公众号记得加星标⭐️，第一时间看推送不会错过。 在本文中，戈登向台积电提出了一系列关于其下一步发展方向的问题。 台积电成立于 1987 年，开创了纯晶圆代工业务，如今已成为全球领先的专业半导体代工厂。 我们最近就该公司下一步计划提出了一系列问题。该公司发言人拒绝回答我们所有的问题，但他们回 答的几个问题却为我们提供了关于半导体技术和行业的一些有趣见解。 Gordon Feller：台积电预计在向 2nm 以下工艺技术过渡的过程中会有哪些突破或障碍？ 台积电：我们在2纳米制程节点上引入的最大创新是纳米片晶体管结构，也称为环栅晶体管。这是一 项重大进步，因为这是我们历史上第二次采用全新的晶体管结构，也是自2014年16纳米制程节点从 平面晶体管过渡到FinFET晶体管以来的首次。经过多年的技术挑战，台积电将于今年年底前实现2纳 米制程的量产。 我们将在 A16（1.6nm 级）节点上采用另一项重大创新——超强电源轨（Super Power Rail），即我 们的背面供电技术。背面供电轨架构通过将正面布线资源专用于信号传输，并将电源布线移至背面， 从而提高了逻辑密度和性能。这种结构使 A16 成为具有复杂信号布线和 ...

数据显示，华宝基金旗下1只基金重仓华虹公司。华宝上证科创板芯片指数发起A（021224）三季度持 有股数18.75万股，占基金净值比例为2.49%，位居第七大重仓股。根据测算，今日浮盈赚取约114.55万 元。 华宝上证科创板芯片指数发起A（021224）成立日期2024年8月27日，最新规模1.26亿。今年以来收益 6.08%，同类排名440/5488；近一年收益81.35%，同类排名221/4192；成立以来收益166.4%。 华宝上证科创板芯片指数发起A（021224）基金经理为陈建华。 1月7日，华虹公司涨5.1%，截至发稿，报125.98元/股，成交32.74亿元，换手率6.57%，总市值2187.01 亿元。 资料显示，华虹半导体有限公司位于上海张江高科技园区哈雷路288号,香港中环夏悫道12号美国银行中 心2212室，成立日期2005年1月21日，上市日期2023年8月7日，公司主营业务涉及华虹半导体有限公司 是一家主要从事特色工艺晶圆代工的中国投资控股公司。该公司提供包括嵌入式/独立式非易失性存储 器、功率器件、模拟与电源管理、逻辑与射频等多元化特色工艺平台的晶圆代工及配套服务。该公司还 从事 ...

Investment Rating - The report maintains a "Buy" rating for the company with a target price of 120 HKD [5] Core Views - The semiconductor industry is experiencing significant asset operations and expansion, with a focus on long-term capacity expansion and supply chain localization. The acquisition of 97.4988% of Huali Micro by the company is expected to enhance its performance and liquidity [1][2] - The integration of Huali Micro is projected to increase the company's net profit by 151%, raising the earnings per share (EPS) by 127% [3] - The company is well-positioned to benefit from the dual drivers of "specialized processes + logic processes," alongside the expansion of 12-inch capacity and technological synergies [1][4] Financial Impact on Balance Sheet - Without considering the financing, the total assets are expected to increase by 7.6% to 933.6 billion RMB, and the net assets will rise by 4.2% to 462.8 billion RMB [2][10] - If the financing is successful, total assets and net assets could increase by 16% and 21%, respectively, potentially pushing total assets beyond 1 trillion RMB [2][10] Financial Impact on Profit and Loss Statement - The acquisition is expected to contribute an additional 5.7 billion RMB to net profit, resulting in a total net profit of 9.6 billion RMB, a 151% increase compared to pre-acquisition figures [3][11] - The EPS is projected to rise from 0.22 RMB to 0.50 RMB, reflecting a significant enhancement in shareholder returns [3][11] Earnings Forecast and Valuation - Revenue forecasts for 2025, 2026, and 2027 are projected to grow by 20.9%, 28.8%, and 17.6%, reaching 24.2 billion, 31.2 billion, and 36.7 billion USD, respectively [4][20] - The company is valued at a price-to-book (PB) ratio of 4.2 times for 2026, reflecting its leading position in specialized processes within the semiconductor industry [4][12]

证券日报网讯 12月23日，民德电子在互动平台回答投资者提问时表示，芯微泰克为公司参股企业，目 前公司的持股比例为28.57%。芯微泰克聚焦于先进功率器件所需特种工艺的晶圆代工业务，主要生产 工艺包括晶圆的超薄化及超薄晶圆的工艺加工、超高能离子注入（B+、P+、H+）、激光退火及超高温 退火扩散、重金属（Pt、Ni/Pt、Au）加工、正面及背面金属化、化学镀和电镀等工艺，涉及产品涵盖 6/8英寸的IGBT、MOSFET、SBD及FRD等系列产品。 （文章来源：证券日报） ...

过去，Exynos处理器曾因发热和性能降频问题而遭到诟病。为了解决这一问题，三星在Exynos 2600中 首次引入了一种名为"HPB"（Heat Path Block，散热路径块）的散热方案。三星方面宣称，该技术利用 高介电常数（High-k）EMC材料来改善散热，将热阻降低16%，确保芯片在重负载情况下也能稳定保持 内部温度。 据韩国经济新闻、朝鲜日报等韩媒消息，12月19日，韩国三星电子正式公布了其下一代移动系统芯片 Exynos 2600，系全球首款采用2纳米制程工艺的SoC，基于三星的GAA（全环绕栅极）工艺制造，或将 搭载于三星下一代旗舰智能手机Galaxy S26系列。 同时，Exynos 2600支持最高3.2亿像素的超高分辨率摄像头，并通过新引入的AI视觉感知系统（VPS） 和APV编解码器等技术，能够拍摄出更智能、更清晰的照片。 值得注意的是，三星电子在官网上将Exynos 2600的产品状态标注为"量产中"，韩媒普遍认为，这一动 向或表明其良品率已提升至足以支持大规模生产的水平。 近年来，三星的半导体代工部门深陷泥潭，市场份额远落后于竞争对手台积电，其核心原因就在于良品 率低下。 早在2 ...

证券日报网讯12月19日，赛微电子（300456）在互动平台回答投资者提问时表示，公司是一家MEMS纯 代工厂商，一直致力于为通信计算、生物医疗、工业汽车、消费电子等各领域客户提供MEMS工艺开发 及晶圆制造服务。 ...

证券日报网讯12月17日，赛微电子（300456）在互动平台回答投资者提问时表示，公司为专业的MEMS 独立代工厂商；瑞典Silex原为公司全资子公司，现为公司重要参股子公司。 ...

Dec. 12, 2025 产业洞察 根据TrendForce集邦咨询最新调查，2025年第三季全球晶圆代工产业持续受AI高效能运算(HPC)，和消费性电子新品主芯片与周边IC需求带动，以7nm(含) 以下先进制程生产的高价晶圆贡献营收最为显著，加上部分厂商得益于供应链分化商机，推升前十大晶圆代工厂第三季合计营收季增8.1%，接近451亿美 元。 TrendForce集邦咨询表示，由于预期2026年景气与需求将受国际形势影响，同时2025年中以来存储器逐季涨价、产能吃紧，供应链对2026年主流终端应用 需求转趋保守，即便车用、工控将于2025年底重启备货，预估第四季晶圆代工产能利用率成长动能将受限，前十大厂合计产值季增幅可能明显收敛。 | Ranking | Company | | Revenue | | Market Share | | | --- | --- | --- | --- | --- | --- | --- | | | | 3Q25 | 2Q25 | QoQ | 3Q25 | 2Q25 | | I | 台积电(TSMC) | 33,063 | 30,239 | 9.30% | 71.00% | ...

Core Insights - Samsung Electronics' wafer foundry business is recovering due to strong growth in the automotive semiconductor market, having secured orders from Tesla and Hyundai [1][2] - The company is supplying eMRAM, a non-volatile memory technology, to Hyundai, which is produced using a 14nm FinFET process [1] - eMRAM offers significant advantages over NAND flash memory, including a speed approximately 1000 times faster and low power consumption, driving demand in the automotive sector [1] Group 1 - Samsung has completed the development of its 14nm eMRAM process and plans to expand its product lineup to 8nm by 2026 and 5nm by 2027, with expected density and speed improvements of 30% and 33% respectively [2] - The company is rapidly expanding its automotive foundry business, having been selected by Tesla for the production of its next-generation AI semiconductor, AI6, which will utilize a 2nm process [2][3] - Samsung is also preparing to mass-produce 8nm MCUs for Hyundai, with plans to complete development by 2028 and start production by 2030 [2] Group 2 - There is a high likelihood that Samsung will win the contract for Hyundai's high-end 5nm autonomous driving chips, as the selection process is set to take place next year [3] - The project, "K-on-Device AI Semiconductor," has been delayed but is expected to favor Samsung due to its established capabilities in advanced process technologies [3] - Samsung's foundry has gained reference standards for various automotive chip processes, including advanced nodes (2nm, 5nm, and 8nm) and mature processes (14nm) [3]

Core Insights - Samsung Electronics is making significant strides in its foundry business, aiming to catch up with TSMC by stabilizing its 3nm technology and advancing towards 2nm processes [1][4] - The company is expected to achieve profitability in its foundry operations starting in 2027, driven by increased production rates at its Texas facility [4] Group 1: 2nm Capacity Expansion - Counterpoint Research predicts a 163% increase in Samsung's 2nm capacity, from 8,000 wafers per month in 2024 to 21,000 wafers per month by the end of next year [2] - The improvement in 2nm yield, estimated at 55% to 60%, has allowed Samsung to attract major clients, including a $16.5 billion contract with Tesla for AI6 chip production [2] Group 2: Competitive Positioning - TSMC holds a dominant market share of 70.2% in the foundry market, while Samsung's share is only 7.3% [3] - Samsung's introduction of Gate-All-Around (GAA) technology in its 3nm process enhances performance and power efficiency, positioning it favorably against TSMC, which will only adopt GAA in its 2nm process [3] Group 3: Flexible Pricing Strategy - TSMC's focus on major clients like NVIDIA and Apple has led to a 50% price increase for its 2nm wafers, creating an opportunity for Samsung to attract new customers with a flexible pricing strategy [3] - Samsung's foundry business is showing signs of recovery, having secured contracts with various companies, including AI semiconductor startups and major tech firms [3] Group 4: Future Outlook - Samsung anticipates a significant improvement in its financial performance as it ramps up production of 2nm technology and implements cost efficiency measures [4] - The company has reported record orders centered around advanced processes, indicating a positive trajectory for its foundry business [4]