Group 1 - The surge in equipment computing power demand is driving the need for effective heat dissipation solutions, with traditional passive cooling methods like graphene and VC expected to transition towards active cooling solutions [1] - The micro-pump liquid cooling solution is gaining traction, with a clear trend and strong implementation certainty, particularly in the context of AI innovations led by companies like Apple [2] - The liquid cooling driving chip technology presents a significant barrier, with limited competition from foreign analog manufacturers, creating a favorable competitive landscape for domestic companies [3] Group 2 - Aiwey Electronics has launched a new domestic liquid cooling driver, the AW86320 piezoelectric driver, capable of providing over 180Vpp, significantly enhancing cooling efficiency in small electronic devices [3] - Nanchip Technology has developed the SC3601 piezoelectric micro-pump liquid cooling driver chip, achieving a tenfold improvement in energy efficiency and low standby power consumption, filling a gap in domestic technology [3] - The micro-pump liquid cooling trend is expected to expand from mobile phone cases to high-end smartphones by Q4 2025, with 2026 anticipated to be a breakout year for active cooling solutions [2]

Group 1 - Huawei is set to launch the Mate80 series with significant upgrades in design, performance, and imaging systems, marking a true iteration of the series [1] - The performance enhancement includes a "dual-track parallel" cooling solution that combines active fans and micro-pump liquid cooling, breaking through the technical boundaries of flagship device cooling and waterproofing [1] - The demand for efficient cooling solutions is increasing due to the rising power consumption of key components like chips, motherboards, and batteries, driven by advancements in AI technology [1] Group 2 - The micro-pump liquid cooling technology, which was introduced during the Mate60 period, utilizes high-performance phase change materials (PCM) to efficiently absorb and distribute heat [1] - The transition from passive to active cooling solutions is expected as mobile terminals face thermal load challenges, with micro-pump liquid cooling poised to revolutionize the cooling landscape in various product categories [1] - According to broker estimates, the market potential for active liquid cooling in mobile phones and laptops alone could exceed 100 billion [1] Group 3 - Nanxin Technology has launched the SC3601 piezoelectric micro-pump liquid cooling driver chip, which has been validated by multiple clients and is set for mass production [2] - Feirongda has introduced cooling devices and module products, including micro-pump liquid cooling modules, to meet customer demands [3]