Core Viewpoint - Huawei is exploring a dual cooling solution for the Mate80 series, combining an active fan and micro-pump liquid cooling, which has garnered significant attention in the industry and among consumers [2][4][12] Group 1: Active Cooling Technologies - The introduction of active cooling technologies, such as micro fans and micro-pump liquid cooling, indicates that mainstream smartphone manufacturers are taking active cooling seriously, moving beyond niche applications [4][10] - OPPO has already integrated an active cooling fan in its mid-range K13 series, creating a "Storm Engine" system that mimics PC cooling solutions [8] - The OnePlus 11 concept phone was the first to feature Active CryoFlux micro-pump liquid cooling, showcasing the industry's shift from passive to active cooling solutions [10][12] Group 2: Importance of Thermal Management - As smartphones evolve into high-performance computing devices, the demand for effective thermal management has increased due to rising processor power consumption and heat output [13] - Early smartphones relied on passive cooling methods, but the introduction of materials like vapor chambers and graphene has significantly improved heat dissipation capabilities [13][14] - The transition from passive to active cooling is a collective response to the high power consumption era driven by AI functionalities and high-refresh-rate displays [14][21] Group 3: Comparison of Cooling Methods - Passive cooling relies on material properties for heat conduction and diffusion, while active cooling uses mechanical means to enhance heat exchange [14] - Active cooling methods, such as fans and micro-pumps, are more efficient and can sustain high power output, making them suitable for high-load scenarios [14][15] - The industry is witnessing a trend where active cooling technologies are moving towards mass production and market adoption [12][38] Group 4: Future Applications and Market Potential - The integration of micro-pump liquid cooling in smartphones could lead to new applications in AI glasses, AR devices, and humanoid robots, with market potential exceeding hundreds of billions [6][38] - The development of active cooling technologies is seen as a key driver for the next generation of high-performance smart devices, pushing the consumer electronics industry into a new era of high power and performance [38][39] Group 5: Supplier Recommendations - Several companies are emerging as key suppliers for micro-pump and fan technologies, including Chengdu Huitong Xidian Electronics, Resonance Precision, and Nanchip Technology, which are focusing on developing efficient and compact cooling solutions [22][24][26][30][34][36] - These suppliers are contributing to the advancement of thermal management technologies, which are crucial for the performance and longevity of modern electronic devices [30][36] Group 6: Upcoming Events - The 6th Thermal Management Industry Conference and Exposition will take place from December 3-5, 2025, in Shenzhen, focusing on advancements in thermal management technologies and featuring various suppliers and research teams [39][42][48]

Core Insights - OPPO has introduced an active cooling system with a built-in fan in its mid-range products, while Huawei and other manufacturers are also testing similar technologies [1] - Huawei's Mate80 series may feature a dual cooling solution with an active fan and micro-pump liquid cooling, although its implementation remains uncertain [1] - Liquid cooling technology is still in the early stages of development, with many related products in research or validation phases, but there is optimism about its future potential in consumer electronics, AI devices, and high-power chips [1] Company Developments - Aiwei Electronics has completed verification tests for its ultra-low power high-voltage piezoelectric micro-pump liquid cooling product, aiming for mass production by Q4 2025 [2][3] - The company anticipates potential orders from clients by the end of the year, although specific client names cannot be disclosed due to confidentiality agreements [3] - Aiwei's product pricing is estimated at approximately $2-3 per unit for small batches and $1-1.5 per unit for large batches, with expected annual revenue from this product being less than 100 million RMB based on a hypothetical shipment of 10 million phones [3] Industry Trends - The liquid cooling technology is expected to expand beyond consumer electronics into industrial and automotive sectors [1] - Companies like Nanchip Technology and Zhihua Technology are also developing liquid cooling solutions, with a focus on low-power applications in mobile devices [3][4] - The industry is seeing significant investment in liquid cooling technology, with many firms recognizing it as a key strategic direction for future growth [6]

Group 1 - Huawei is set to launch the Mate80 series with significant upgrades in design, performance, and imaging systems, marking a true iteration of the series [1] - The performance enhancement includes a "dual-track parallel" cooling solution that combines active fans and micro-pump liquid cooling, breaking through the technical boundaries of flagship device cooling and waterproofing [1] - The demand for efficient cooling solutions is increasing due to the rising power consumption of key components like chips, motherboards, and batteries, driven by advancements in AI technology [1] Group 2 - The micro-pump liquid cooling technology, which was introduced during the Mate60 period, utilizes high-performance phase change materials (PCM) to efficiently absorb and distribute heat [1] - The transition from passive to active cooling solutions is expected as mobile terminals face thermal load challenges, with micro-pump liquid cooling poised to revolutionize the cooling landscape in various product categories [1] - According to broker estimates, the market potential for active liquid cooling in mobile phones and laptops alone could exceed 100 billion [1] Group 3 - Nanxin Technology has launched the SC3601 piezoelectric micro-pump liquid cooling driver chip, which has been validated by multiple clients and is set for mass production [2] - Feirongda has introduced cooling devices and module products, including micro-pump liquid cooling modules, to meet customer demands [3]

Group 1 - The article highlights a significant price increase of over 43% since the beginning of the year, with a projected supply-demand gap exceeding 2,900 tons by 2025, indicating a substantial market opportunity in the military and new energy sectors, along with the Yaxia project expected to yield a decade-long dividend [1] - The AI Agent is driving a revolution in heat dissipation, with an anticipated penetration rate of 30% and a market size approaching 20 billion, suggesting that industry chain targets are already positioned to capitalize on this trend [1]

Investment Rating - The report maintains an "Outperform" rating for the heat management industry, driven by the slowdown of Moore's Law and the rise of edge AI applications [1]. Core Insights - The heat management industry is undergoing significant upgrades due to the deceleration of Moore's Law and the explosive growth in cloud computing power demands, leading to increased pressure on thermal management solutions for edge AI applications [1][2]. - Passive cooling methods are nearing their physical limits, prompting a shift towards active cooling technologies in mobile devices [3][4]. Summary by Sections 1. Moore's Law Slowdown and Edge AI Iteration - The growth rate of transistor density has significantly slowed, with the compound annual growth rate (CAGR) dropping to single digits for processes below 5nm, indicating the gradual failure of Moore's Law [19][20]. - As performance demands increase, the power consumption per unit area of chips is rising, necessitating enhanced thermal management solutions [24][25]. - The limitations of passive cooling methods are becoming evident, as the area of vapor chambers (VC) is increasing while material iterations are slowing down [43][44]. 2. Transition to Active Cooling Technologies - The industry is expected to enter an active cooling era, with technologies like micro-pump liquid cooling and micro fans becoming more prevalent [3][4]. - By 2030, it is projected that the penetration rate of active cooling in smartphones will reach 30%, with a market size of approximately 20 billion yuan [3][4][75]. 3. Investment Highlights and Beneficiary Segments - Active cooling technologies are anticipated to unlock the full potential of edge AI applications, with significant benefits for companies involved in the thermal management supply chain [4][4]. - Key players in the thermal management module sector include Feirongda, Suzhou Tianmai, and Zhongshi Technology, while chip-related companies include Aiwei Electronics and Nanchip Technology [4][4].