Group 1 - SK Hynix is supplying its HBM4 12-Hi stacked memory to NVIDIA at a price approximately 70% higher than the fifth generation HBM (HBM3E) [1] - SK Hynix announced significant technological changes in HBM4, including increased IO counts and improved designs to enhance bandwidth, while also aiming to reflect cost increases in pricing strategies [1] - The current bump bonding method used in HBM limits the vertical spacing between chips, making it difficult to reduce below 40μm, which hinders memory capacity and bandwidth improvements [1] Group 2 - The hybrid bonding technology is expected to be used for next-generation HBM products, allowing for higher interconnect density, smaller pitch, and lower energy consumption, with pitches reaching 10μm or less [1] - HBM4 is set to utilize direct-to-chip liquid cooling (D2C) technology for direct liquid cooling of the chips, as per a roadmap published by KAIST [1] - Yak Technology supplies precursors to major companies including TSMC, SK Hynix, and SMIC [2] - Taiji Industry provides semiconductor backend services to SK Hynix and its affiliates [3]