Core Insights - The 2026 China Semiconductor Testing and Failure Analysis Seminar focused on chip reliability, featuring 11 experts who shared cutting-edge technologies such as hydrogen diffusion and thermal electron imaging, highlighting the trend of integrating microscopic mechanisms with engineering validation to address reliability challenges [1][2][26] Group 1: Hydrogen Diffusion and Surface Effects - Liu Ziyuan's report emphasized the critical role of interface quality in semiconductor devices, revealing that hydrogen diffusion behavior can indirectly affect interface stability and device reliability. The research introduced a high-sensitivity hydrogen detection platform aimed at collaborating with the industry for cross-scale research [5][6] Group 2: Advanced Packaging and Failure Analysis - Xu Yi discussed the challenges in failure analysis of stacked chips due to thermal expansion mismatches. His team developed a microwave-based vacuum plasma technology that selectively etches epoxy layers without damaging the underlying silicon, providing a safe and efficient method for advanced packaging failure analysis [7][8] Group 3: Thermal Management and Electron Transport - An Zhenghua's team tackled the "thermal bottleneck" in integrated circuits by employing scanning probe microscopy to achieve nanoscale thermal electron imaging, revealing discrepancies in electron temperature distribution. This technology has garnered attention from leading companies like TSMC for its potential in advanced device thermal-electrical co-design [9][10] Group 4: Spectroscopic Solutions in Semiconductor Processes - Wu Yanhong presented HORIBA's comprehensive spectroscopic solutions for semiconductor processes, covering material development, process monitoring, and failure analysis. Techniques such as ellipsometry and Raman spectroscopy were highlighted for their non-destructive and rapid measurement capabilities [11][12] Group 5: OLED Process and Defect Detection - Huang Weihua's report focused on high-precision detection needs in OLED processes, showcasing a multi-channel measurement system that achieves over 0.5% accuracy in film thickness measurement and a defect identification accuracy of 97.54% using deep learning algorithms [13][14] Group 6: Electromagnetic Compatibility (EMC) in Chip Reliability - Li Jinlong outlined the causes of chip-level EMC issues and proposed optimization strategies across design, packaging, and testing. The team developed a small-scale testing device capable of measuring emissions and susceptibility at frequencies exceeding 6 GHz, addressing the stringent requirements for automotive-grade chips [25][29] Group 7: Comprehensive Reliability Analysis - Sun Haoran's report detailed a systematic approach to analyzing the reliability of optical modules in aerospace applications, establishing a multi-physical field coupling simulation model and proposing multi-dimensional reinforcement strategies to ensure long-term reliability under complex conditions [17][18] Group 8: Vibration Control for Semiconductor Equipment - Sun Yu's team focused on active vibration isolation and excitation techniques to address performance degradation in semiconductor equipment due to environmental vibrations. Their research achieved superior active isolation effects and precise reproduction of micro-vibration environments [19][20] Group 9: AI Chips and Advanced Packaging Solutions - Zhang Fang discussed the challenges in failure analysis for AI chips and advanced packaging, introducing a dual-beam electron microscope technology that provides a comprehensive solution from sample preparation to analysis, enhancing the accuracy and efficiency of defect identification [21][22] Group 10: In-Situ Thermal Characterization Techniques - Chen Na's team developed various micro-nano optical fiber probes for in-situ thermal characterization, achieving high-resolution temperature measurements and real-time thermal field analysis, which are crucial for semiconductor device reliability assessments [23][24]

Core Viewpoint - The semiconductor industry is redefining reliability standards as chips are increasingly deployed in harsh environments, necessitating advanced testing and validation methods to ensure performance under extreme conditions [2][17]. Group 1: Testing and Validation - The shift towards more complex applications requires manufacturers to validate performance under normal operating conditions rather than just extreme scenarios, starting from the wafer stage [2][3]. - System-Level Testing (SLT) is becoming essential for identifying early failure modes that traditional aging tests may miss, particularly under real-world operational stresses [3][4]. - Integrating SLT into testing processes allows manufacturers to make informed decisions early in the product lifecycle, enhancing reliability and performance [5][6]. Group 2: Reliability Prediction - Manufacturers are increasingly using data from the entire lifecycle of chips to predict and prevent failures, moving beyond traditional certification methods [7][9]. - The combination of optical inspection, embedded telemetry, and machine learning is crucial for predicting failure mechanisms and improving reliability [9][11]. - Real-time monitoring and feedback loops are essential for optimizing testing coverage and expected lifespan, particularly in high-reliability markets [12][14]. Group 3: Standards and Certification - Certification standards are evolving to reflect the complexities of modern semiconductor applications, with a trend towards convergence across different sectors [13][14]. - The integration of accelerated life testing and field telemetry feedback is enhancing the ability to validate performance under actual workload conditions [14][16]. - Continuous detection and adaptive testing are becoming increasingly important due to the high density and diversity of materials used in semiconductor packaging [16][17]. Group 4: Challenges in Harsh Environments - Chips used in harsh environments face significant thermal and mechanical stresses, making even minor measurement errors potentially catastrophic [15][16]. - Corrosion detection is gaining attention, especially for aerospace and industrial applications, where long-term exposure to moisture can lead to degradation [15][16]. - The need for ongoing monitoring and adaptive testing is critical to manage reliability in unpredictable operational conditions [16][17].