具体到资本市场，今年以来，AI芯片作为最强劲的主线之一，受到投资者热情追逐。一方面，受地缘 政治扰动，先进节点芯片成为博弈焦点，自主创新需求强烈；另一方面，数据中心的建设如火如荼，在 训练、推理外，存储的卡点也日益突出，涨价不断超预期。未来，在政治和产业多重力量作用下，AI 与芯片将会如何交融演进？ 在此背景下，由南方财经全媒体集团长三角中心主办，汇正财经联合主办的"2025年21世纪卓越董事会 （苏州站）：芯力量·芯解法·芯机遇"活动即将于2025年11月14日拉开帷幕。 长三角地区作为中国集成电路产业基础最扎实、产业链最完整、创新资源最密集的区域，肩负着打造世 界级产业集群的国家使命。选择在苏州举办本次活动，正是基于这里完善的产业生态和丰富的创新资 源。届时，产业界、投资界、学术界的多位重量级嘉宾将齐聚一堂，共商产业发展大计。 本次会议邀请到了上海技术交易所副总裁陆继军、国泰海通研究所电子首席分析师舒迪、浙商银行苏州 分行投资银行部主要负责人王涛等嘉宾发表主题演讲，从多个维度解析产业发展趋势。 本次活动设置了两场深度圆桌对话。首场圆桌以"芯算联动"为主题，将深入探讨芯片、算法、计算系统 如何联动，实现高效 ...

Core Insights - The emergence of numerous domestic AI models in 2023 highlights the increasing demand for computing power in various sectors, including cloud computing, smart manufacturing, and intelligent finance [1] - The AI industry is viewed as a certain growth area, with computing power being a necessary but not sufficient condition for success, emphasizing the need for a comprehensive advantage across multiple domains [1] - Wuxi's proposal for "chip-computing synergy" aims to leverage national strategies to enhance AI applications in various fields, including agriculture and urban governance [1] Computing Power Demand - The rapid growth of AI has led to an unprecedented demand for computing power, with estimates indicating a need for 260 trillion TeraFLOPS of computing power daily to support AI agents [2] - The deployment of NVIDIA H100 GPUs would require approximately 700,000 units daily, highlighting a significant gap between current manufacturing capacity and future demand [2] - Wuxi has initiated the establishment of a city-level intelligent computing cloud center to address the growing need for computing power [3] Chip Development and Advanced Processes - The demand for high-performance, low-power chips is increasing due to the high computing requirements of AI applications, despite the slowdown of Moore's Law [4] - The development of new AI System on Chip (SoC) projects in Wuxi aims to enhance performance, power efficiency, and scalability through advanced manufacturing techniques [5] - Wuxi's semiconductor industry is advancing with the establishment of a pilot line for advanced process photoresists, filling a gap in domestic capabilities [5] Advanced Packaging Technologies - Advanced packaging technologies are essential for overcoming challenges related to power consumption, memory, and cost in AI chip development [6] - The industry is shifting towards high-integration solutions like Chiplet architecture and 3D stacking to meet increasing computing density demands [6] - The market for Chiplet technology is projected to grow significantly, with a compound annual growth rate of 42.5% from 2024 to 2033 [7] CPO Technology and Market Dynamics - The rise of Co-Packaged Optics (CPO) technology is generating interest in the AI computing center sector, with potential implications for existing market structures [8] - CPO is expected to coexist with traditional optical modules in the near term, addressing different needs in data center interconnectivity [8] - Challenges remain for CPO implementation, including reliability, maintainability, and production yield issues, which need to be addressed for broader adoption [9]