设备材料国产化
Search documents
通富微电:封装测试所需主要原材料为引线框架、基板、键合丝和塑封料等
Zheng Quan Ri Bao· 2025-12-05 11:11
Core Viewpoint - Tongfu Microelectronics has stable supply channels for its main raw materials required for packaging and testing, including lead frames, substrates, bonding wires, and encapsulation materials [2] Group 1 - The company sources its main raw materials both domestically and internationally [2] - The company is attentive to policies and industry trends regarding self-sufficiency, domestic substitution, and localization of equipment and materials [2] - The company aims to seize opportunities from these trends to create value for its shareholders [2]