截至9月30日，康强电子股东户数6.81万，较上期减少15.25%；人均流通股5510股，较上期增加 18.00%。2025年1月-9月，康强电子实现营业收入15.64亿元，同比增长5.16%；归母净利润9641.49万 元，同比增长21.40%。 1月9日，康强电子盘中上涨2.32%，截至10:53，报18.09元/股，成交3.13亿元，换手率4.73%，总市值 67.89亿元。 资金流向方面，主力资金净流入2396.67万元，特大单买入3960.33万元，占比12.64%，卖出1164.63万 元，占比3.72%；大单买入4605.55万元，占比14.70%，卖出5004.58万元，占比15.98%。 康强电子今年以来股价涨9.84%，近5个交易日涨9.84%，近20日涨9.77%，近60日跌0.22%。 资料显示，宁波康强电子股份有限公司位于浙江省宁波市鄞州投资创业中心金源路988号，成立日期 1992年6月29日，上市日期2007年3月2日，公司主营业务涉及引线框架、键合丝等半导体封装材料的制 造和销售。主营业务收入构成为：引线框架产品59.11%，键合丝产品23.69%，电极丝产品16.36%，其 ...

康达法意字【2025】第第0730号 致：宁波康强电子股份有限公司 北京市康达律师事务所（以下简称"本所"）接受宁波康强电子股份有限公司（以下简称"康强电 子"或"公司"）的委托，担任公司2025年员工持股计划（以下简称"本次员工持股计划"）的专项法律顾 问，依据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共和国证券法》（以下简 称"《证券法》"）、《关于上市公司实施员工持股计划试点的指导意见》（以下简称"《试点指导意 见》"）、《深圳证券交易所上市公司自律监管指引第1号一一主板上市公司规范运作》（以下简 称"《自律监管指引》"）、《律师事务所从事证券法律业务管理办法》、《律师事务所证券法律业务执 业规则（试行）》等有关法律、法规、规范性文件和《宁波康强电子股份有限公司章程》（以下简 称"《公司章程》"）的规定，按照律师行业公认的业务标准、道德规范和勤勉尽责精神，出具本法律意 见书。 本所律师仅依赖于本法律意见书出具日前已经发生或存在的事实以及《公司法》《证券法》《试点指导 意见》及其他现行的法律、法规和规范性文件的规定发表法律意见。对于本法律意见书至关重要而无法 得到独立证据支持的事实，本 ...

（记者 胡玲） 每经AI快讯，有投资者在投资者互动平台提问：康强电子提到为公司提供封测的产品？请具体讲一下 有哪些？ 华天科技（002185.SZ）12月9日在投资者互动平台表示，康强电子为公司提供引线框架等产品。 ...

Core Viewpoint - Tongfu Microelectronics has stable supply channels for its main raw materials required for packaging and testing, including lead frames, substrates, bonding wires, and encapsulation materials [2] Group 1 - The company sources its main raw materials both domestically and internationally [2] - The company is attentive to policies and industry trends regarding self-sufficiency, domestic substitution, and localization of equipment and materials [2] - The company aims to seize opportunities from these trends to create value for its shareholders [2]

Industry Overview - The lead frame is a critical chip carrier in semiconductor packaging, connecting internal circuits to external leads, forming the core structure of electrical circuits [1][20] - Lead frames are primarily made from copper alloys and are processed through mechanical stamping or chemical etching to create specific circuit patterns [1][20] - The increasing complexity of chip processes and diverse packaging forms have raised the requirements for lead frames, necessitating smaller sizes, tighter pin spacing, and a wider variety of types [1][20] Market Capacity and Development Trends - The lead frame market is experiencing steady growth, driven by the continuous development of the semiconductor industry [3][22] - Major global manufacturers include Mitsui High-tec, AAMI, SDI, Kang Qiang Electronics, Chang Wah Technology, and HAESUNGDS, with the top ten companies holding about 50% of the market share by 2024 [5][24] - From 2020 to 2024, China's lead frame sales revenue is expected to remain above $1.3 billion, accounting for over 35% of the global market [5][24] Industry Development Trends and Opportunities - Government policies are strongly supporting the rapid development of the domestic semiconductor industry, enhancing international competitiveness and promoting innovation [9][27] - The lead frame market is evolving towards higher density, reliability, and lower costs, driven by the demands of emerging fields such as electric vehicles, IoT, and artificial intelligence [9][28] - The growth of electronic product demand, particularly in smartphones and personal computers, along with the expansion of AI and data centers, presents significant opportunities for semiconductor companies [9][29] Major Companies in the Industry - Key players in the lead frame industry include Mitsui High-tec, Chang Wah Technology, HAESUNGDS, and others, each with unique strengths and market positions [10][30] - Companies like Kang Qiang Electronics and Advanced Assembly Materials International are recognized for their extensive product offerings and technological capabilities in lead frame manufacturing [10][32]

此外，在半导体模块、功率器件、传感器封装中，会用到大量散热片、金属垫片、微孔结构件等。这些零件强调导热性、尺寸一致性和表面质量，而深圳成 熟的蚀刻工艺能够实现高光洁度、高平整度和严格的尺寸控制。尤其在大批量生产时，自动化蚀刻线结合在线监控系统，可以确保每批次产品的一致性达到 严格标准。 深圳在半导体辅助制造中的另一个优势在于材料覆盖范围广，包括铜、铝、铁镍合金（如42合金）、镍基材料等。这些材料是 IC 封装最常见的金属材料， 而深圳蚀刻企业在这些材料的腐蚀均匀性、侧蚀控制等方面已经形成稳定技术体系。 值得注意的是，深圳蚀刻加工正在加速智能化。大量工厂已经引入数控曝光、显影自动化、蚀刻药水在线监控、AI视觉检测等系统，使封装零件的加工精 度与一致性大幅提升。在半导体封装中，任何微米级尺寸偏差都可能影响产品良率，因此深圳的智能化升级成为行业的重要竞争力。 随着半导体向更小尺寸、更高功率、更高密度方向发展，对精密金属件的要求会进一步提高，如更小引线间距、更薄金属载体、更高散热能力等。深圳蚀刻 加工具有灵活性强、适配性高、批量效率佳等特点，将成为未来半导体封装产业不可缺少的制造环节。 半导体产业是现代制造业中技术门 ...

Core Viewpoint - The article discusses the significance of semiconductor packaging and testing (封测) in the semiconductor industry, highlighting its processes, roles, and market potential, especially in the context of China's growing semiconductor sector. Group 1: Definition, Role, and Process of Packaging - Packaging refers to the process of placing, fixing, and sealing chips using specific materials and techniques, which protects chip performance and extends internal functions to the external environment [7][8]. - The four main roles of packaging are protection, support, connection, and heat dissipation [6][8]. - The basic packaging process includes wafer thinning, wafer cutting, chip attachment, wire bonding, encapsulation, curing, testing, marking, packaging, inspection, and shipping [7][8]. Group 2: Semiconductor Packaging Industry Chain - The semiconductor packaging industry is positioned in the midstream of the semiconductor industry chain, which includes design, manufacturing, and packaging/testing [17]. - The packaging segment accounts for a significant portion of the value in the packaging and testing process, with estimates indicating that packaging contributes 80-85% of the total value [22]. Group 3: Market Overview and Growth Potential - In 2022, China's semiconductor industry sales reached 12,006 billion yuan, with packaging accounting for 2,995 billion yuan, representing 24.9% of the total [22]. - The packaging industry is expected to grow, with projections indicating a sales increase to 3,060 billion yuan in 2023, reflecting an 8.4% year-on-year growth [22]. - The article emphasizes that the advanced packaging and high-end packaging materials sectors are likely to benefit from the ongoing AI wave and supportive policies [22]. Group 4: Equipment and Technology in Packaging - The semiconductor packaging process involves various equipment, including thinning machines, cutting machines, die bonders, and encapsulation machines, each playing a critical role in ensuring quality and efficiency [32][37]. - The market for packaging equipment is dominated by a few key players, with significant market shares held by companies like TOWA and ASM Pacific [45]. Group 5: Testing Process and Equipment - Testing is crucial for ensuring the functionality and performance of semiconductor devices, with processes divided into wafer testing and final product testing [16][54]. - The global market for testing equipment is led by companies such as Advantest and Teradyne, which together hold a significant market share [48]. Group 6: Raw Materials in Packaging - The raw materials used in semiconductor packaging include cutting materials, adhesive materials, bonding wires, packaging substrates, and encapsulation materials, with the packaging substrate accounting for 40% of the market share [63][64]. - The article notes that the barriers to entry for packaging materials are lower compared to wafer materials, and China has achieved a level of import substitution in this area [63].

Core Viewpoint - 康强电子's stock price has experienced fluctuations, with a recent decline of 2.01% and a year-to-date increase of 13.33%, indicating volatility in market performance [1]. Company Overview - 康强电子, established on June 29, 1992, and listed on March 2, 2007, is located in Ningbo, Zhejiang Province. The company specializes in manufacturing and selling semiconductor packaging materials, including lead frames and bonding wires [1]. - The revenue composition of 康强电子 includes lead frame products (59.11%), bonding wires (23.69%), electrode wires (16.36%), and others (0.82%) [1]. Financial Performance - For the period from January to September 2025, 康强电子 reported a revenue of 1.564 billion yuan, reflecting a year-on-year growth of 5.16%. The net profit attributable to shareholders was 96.4149 million yuan, marking a 21.40% increase [2]. - Since its A-share listing, 康强电子 has distributed a total of 153 million yuan in dividends, with 33.7756 million yuan distributed over the past three years [3]. Shareholder Information - As of September 30, 2025, 康强电子 had 68,100 shareholders, a decrease of 15.25% from the previous period. The average number of circulating shares per shareholder increased by 18.00% to 5,510 shares [2]. - Among the top ten circulating shareholders, Hong Kong Central Clearing Limited is the fourth largest, holding 6.9695 million shares as a new shareholder. The Guotai Zhongzheng Semiconductor Materials Equipment Theme ETF is the seventh largest, increasing its holdings by 1.4853 million shares to 2.6834 million shares [3]. Market Activity - 康强电子's stock has appeared on the龙虎榜 three times this year, with the most recent occurrence on January 20, where it recorded a net buy of -150 million yuan [1]. - The stock has seen a recent trading volume of 60.6593 million yuan, with a turnover rate of 0.91% [1].

Core Viewpoint - 康强电子's stock price has shown a significant increase this year, with a year-to-date rise of 25.37%, indicating strong market performance despite recent fluctuations in trading volume and net capital outflow [1][2]. Group 1: Stock Performance - As of November 12, 康强电子's stock price was 19.37 CNY per share, with a market capitalization of 7.269 billion CNY [1]. - The stock has experienced a 7.02% increase over the last five trading days, a 6.84% increase over the last 20 days, and a 12.55% increase over the last 60 days [1]. - The company has appeared on the龙虎榜 three times this year, with the most recent appearance on January 20, where it recorded a net buy of -150 million CNY [1]. Group 2: Financial Performance - For the period from January to September 2025, 康强电子 reported a revenue of 1.564 billion CNY, representing a year-on-year growth of 5.16% [2]. - The net profit attributable to shareholders for the same period was 96.4149 million CNY, reflecting a year-on-year increase of 21.40% [2]. Group 3: Shareholder Information - As of September 30, 2025, 康强电子 had 68,100 shareholders, a decrease of 15.25% from the previous period, with an average of 5,510 circulating shares per shareholder, an increase of 18.00% [2]. - The company has distributed a total of 153 million CNY in dividends since its A-share listing, with 33.7756 million CNY distributed over the last three years [3]. - Notable institutional holdings include Hong Kong Central Clearing Limited as the fourth-largest shareholder with 6.9695 million shares, and Guotai Zhongxin Semiconductor Materials Equipment Theme ETF as the seventh-largest shareholder with 2.6834 million shares, an increase of 1.4853 million shares from the previous period [3].

Group 1 - The core point of the news is that 康强电子 (Kangqiang Electronics) experienced a decline of 5.03% in its stock price, reaching 20.02 yuan per share, with a trading volume of 1.02 billion yuan and a turnover rate of 13.31%, resulting in a total market capitalization of 7.513 billion yuan [1] - 康强电子 is located in Ningbo, Zhejiang Province, and was established on June 29, 1992. It was listed on March 2, 2007. The company's main business involves the manufacturing and sales of semiconductor packaging materials, including lead frames and bonding wires [1] - The revenue composition of 康强电子 includes lead frame products at 59.11%, bonding wire products at 23.69%, electrode wire products at 16.36%, and other products at 0.82%, with molds and spare parts contributing 0.02% [1] Group 2 - 国泰中证半导体材料设备主题ETF (Guotai CSI Semiconductor Materials and Equipment Theme ETF) is among the top ten circulating shareholders of 康强电子, having increased its holdings by 1.4853 million shares in the third quarter, totaling 2.6834 million shares, which represents 0.72% of the circulating shares [2] - The estimated floating loss for 国泰中证半导体材料设备主题ETF today is approximately 2.8444 million yuan [2] - The fund was established on July 19, 2023, with a latest scale of 8.299 billion yuan. Year-to-date, it has achieved a return of 48.71%, ranking 666 out of 4217 in its category, and a one-year return of 32.01%, ranking 1118 out of 3918 [2]