此外，在半导体模块、功率器件、传感器封装中，会用到大量散热片、金属垫片、微孔结构件等。这些零件强调导热性、尺寸一致性和表面质量，而深圳成 熟的蚀刻工艺能够实现高光洁度、高平整度和严格的尺寸控制。尤其在大批量生产时，自动化蚀刻线结合在线监控系统，可以确保每批次产品的一致性达到 严格标准。 深圳在半导体辅助制造中的另一个优势在于材料覆盖范围广，包括铜、铝、铁镍合金（如42合金）、镍基材料等。这些材料是 IC 封装最常见的金属材料， 而深圳蚀刻企业在这些材料的腐蚀均匀性、侧蚀控制等方面已经形成稳定技术体系。 值得注意的是，深圳蚀刻加工正在加速智能化。大量工厂已经引入数控曝光、显影自动化、蚀刻药水在线监控、AI视觉检测等系统，使封装零件的加工精 度与一致性大幅提升。在半导体封装中，任何微米级尺寸偏差都可能影响产品良率，因此深圳的智能化升级成为行业的重要竞争力。 随着半导体向更小尺寸、更高功率、更高密度方向发展，对精密金属件的要求会进一步提高，如更小引线间距、更薄金属载体、更高散热能力等。深圳蚀刻 加工具有灵活性强、适配性高、批量效率佳等特点，将成为未来半导体封装产业不可缺少的制造环节。 半导体产业是现代制造业中技术门 ...

点击上方 蓝字 关注我们，看更多行业报告 并将 "材料汇" 设为"星标⭐"，第一时间收获最新推送 写在前面 一直在路上，所以停下脚步，只在于分享 分享内容包括： 新 材料/ 半导体 / 新能源/光伏/显示材料 等 正文 1.1 封测的定义、作用与工艺流程 | 图表1:半导体封装工艺流程 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | | | 即段操作 | | | | 后段慢作 | | | 晶圆脂频 | 品周切宜 | 芯片贴装 | 焊接货 | 后固化、测试 | 打标 | | | 该步骤指在圆片官 | 该步骤也称划片, | 已切割下来的芯片 | 该先辈主要用于使 | 塑封和后固化工艺指在塑封后加热硬 | 电镀：待营脚成型后，在其表面涂 | | | | | | | | | 包装:根据测试结果 | | 面采用机械或化学 | 先将晶圆粘贴在蓝 | 需要非美到框架中 | 引线孔与引脚相连 | 化并去除管亮周围多余的材料,防止 | 刷防腐材料,避免管脚出现氧化、 | | | 机械方式进行财 | 膜上,再将晶圆切 | 间的焊盘上,若焊 | ，使芯片可以与外 ...

11月18日，康强电子盘中下跌2.01%，截至09:43，报17.51元/股，成交6065.93万元，换手率0.91%，总 市值65.71亿元。 资料显示，宁波康强电子股份有限公司位于浙江省宁波市鄞州投资创业中心金源路988号，成立日期 1992年6月29日，上市日期2007年3月2日，公司主营业务涉及引线框架、键合丝等半导体封装材料的制 造和销售。主营业务收入构成为：引线框架产品59.11%，键合丝产品23.69%，电极丝产品16.36%，其 他(补充)0.82%，模具及备件0.02%。 康强电子所属申万行业为：电子-半导体-半导体材料。所属概念板块包括：核电、小盘、增持回购、融 资融券、存储概念等。 截至9月30日，康强电子股东户数6.81万，较上期减少15.25%；人均流通股5510股，较上期增加 18.00%。2025年1月-9月，康强电子实现营业收入15.64亿元，同比增长5.16%；归母净利润9641.49万 元，同比增长21.40%。 分红方面，康强电子A股上市后累计派现1.53亿元。近三年，累计派现3377.56万元。 机构持仓方面，截止2025年9月30日，康强电子十大流通股东中，香港中央结 ...

Core Viewpoint - 康强电子's stock price has shown a significant increase this year, with a year-to-date rise of 25.37%, indicating strong market performance despite recent fluctuations in trading volume and net capital outflow [1][2]. Group 1: Stock Performance - As of November 12, 康强电子's stock price was 19.37 CNY per share, with a market capitalization of 7.269 billion CNY [1]. - The stock has experienced a 7.02% increase over the last five trading days, a 6.84% increase over the last 20 days, and a 12.55% increase over the last 60 days [1]. - The company has appeared on the龙虎榜 three times this year, with the most recent appearance on January 20, where it recorded a net buy of -150 million CNY [1]. Group 2: Financial Performance - For the period from January to September 2025, 康强电子 reported a revenue of 1.564 billion CNY, representing a year-on-year growth of 5.16% [2]. - The net profit attributable to shareholders for the same period was 96.4149 million CNY, reflecting a year-on-year increase of 21.40% [2]. Group 3: Shareholder Information - As of September 30, 2025, 康强电子 had 68,100 shareholders, a decrease of 15.25% from the previous period, with an average of 5,510 circulating shares per shareholder, an increase of 18.00% [2]. - The company has distributed a total of 153 million CNY in dividends since its A-share listing, with 33.7756 million CNY distributed over the last three years [3]. - Notable institutional holdings include Hong Kong Central Clearing Limited as the fourth-largest shareholder with 6.9695 million shares, and Guotai Zhongxin Semiconductor Materials Equipment Theme ETF as the seventh-largest shareholder with 2.6834 million shares, an increase of 1.4853 million shares from the previous period [3].

Group 1 - The core point of the news is that 康强电子 (Kangqiang Electronics) experienced a decline of 5.03% in its stock price, reaching 20.02 yuan per share, with a trading volume of 1.02 billion yuan and a turnover rate of 13.31%, resulting in a total market capitalization of 7.513 billion yuan [1] - 康强电子 is located in Ningbo, Zhejiang Province, and was established on June 29, 1992. It was listed on March 2, 2007. The company's main business involves the manufacturing and sales of semiconductor packaging materials, including lead frames and bonding wires [1] - The revenue composition of 康强电子 includes lead frame products at 59.11%, bonding wire products at 23.69%, electrode wire products at 16.36%, and other products at 0.82%, with molds and spare parts contributing 0.02% [1] Group 2 - 国泰中证半导体材料设备主题ETF (Guotai CSI Semiconductor Materials and Equipment Theme ETF) is among the top ten circulating shareholders of 康强电子, having increased its holdings by 1.4853 million shares in the third quarter, totaling 2.6834 million shares, which represents 0.72% of the circulating shares [2] - The estimated floating loss for 国泰中证半导体材料设备主题ETF today is approximately 2.8444 million yuan [2] - The fund was established on July 19, 2023, with a latest scale of 8.299 billion yuan. Year-to-date, it has achieved a return of 48.71%, ranking 666 out of 4217 in its category, and a one-year return of 32.01%, ranking 1118 out of 3918 [2]

Core Viewpoint - 康强电子's stock price has shown significant growth this year, with a year-to-date increase of 27.25%, indicating strong market performance and investor interest [1][2]. Financial Performance - For the period from January to September 2025, 康强电子 achieved a revenue of 1.564 billion yuan, representing a year-on-year growth of 5.16% [2]. - The net profit attributable to shareholders for the same period was 96.4149 million yuan, reflecting a year-on-year increase of 21.40% [2]. Stock Market Activity - As of November 7, 康强电子's stock price was 19.66 yuan per share, with a trading volume of 670 million yuan and a turnover rate of 9.35% [1]. - The company has appeared on the龙虎榜 three times this year, with the most recent appearance on January 20, where it recorded a net buy of -150 million yuan [1]. Shareholder Information - As of September 30, 康强电子 had 68,100 shareholders, a decrease of 15.25% from the previous period, while the average number of circulating shares per person increased by 18.00% to 5,510 shares [2]. - The top ten circulating shareholders include Hong Kong Central Clearing Limited as the fourth largest shareholder, holding 6.9695 million shares, marking a new entry [3]. Dividend Distribution - 康强电子 has distributed a total of 153 million yuan in dividends since its A-share listing, with 33.7756 million yuan distributed over the past three years [3].

Group 1 - The core viewpoint of the article is that Chengtian Weiye announced its semiconductor business products, which include packaging materials and specialized chip products [2] - The main products of the semiconductor business include carrier tapes, lead frames, and copper heat sink substrates, which are essential for semiconductor packaging applications [2] - The products primarily cater to packaging applications for MOSFET, SiC, and IGBT power modules [2]

Group 1: Company Overview - The company is one of the earliest entrants in the smart card industry, establishing a comprehensive end-to-end process for chip application development, module packaging, smart card R&D, production, sales, and terminal application development [1] - Smart card business accounts for approximately 60%-70% of total revenue, with expectations for stable revenue in this segment [1][2] Group 2: Semiconductor Business - Main products in the semiconductor business include carrier tapes, lead frames, and copper heat dissipation substrates, catering to the needs of MOSFET, SiC, and IGBT power modules [2] - The growth of the semiconductor packaging materials sector is driven by the rapid expansion of downstream power electronics applications, particularly in photovoltaic inverters, energy storage systems, and new energy vehicles [2] Group 3: Liquid Cooling Solutions - The company has developed a full-stack layout for liquid cooling products, including core components like liquid cooling plates and secondary system-level solutions [3] - The liquid cooling business is in an active market expansion phase, targeting major domestic server manufacturers and AI computing platform builders [3] Group 4: Strategic Partnerships - The company has formed a joint venture with superX to integrate strengths and expand the global AIDC cabinet liquid cooling product market, with the company holding a 25% stake [3] - The joint venture aims to design customized cabinet-level liquid cooling solutions, enhancing internal business synergy [3] Group 5: Technology and Innovation - The microchannel liquid cooling plate (MLCP) technology integrates traditional packaging heat dissipation structures with liquid cooling channels, significantly reducing thermal resistance and improving heat exchange efficiency [3] - The company is actively advancing MLCP sample testing and production line preparations, focusing on high heat flux density applications in AI servers and power modules [3] Group 6: Risk Management - The company acknowledges potential technical, market, and application validation risks associated with new business and product development [4] - It emphasizes the importance of rational investment and risk awareness among investors [4]

Core Viewpoint - Kangqiang Electronics is a significant player in the domestic semiconductor packaging materials sector, primarily engaged in the manufacturing and sales of lead frames and bonding wires, with certain technological barriers in place [1] Group 1: Business Performance - In Q3 2025, Kangqiang Electronics reported revenue of 1.564 billion yuan, ranking 8th among 24 companies in the industry, with the industry leader, Yuyuan New Materials, generating 6.77 billion yuan [2] - The net profit for the same period was 96.41 million yuan, placing the company 11th in the industry, while the top performer, Yake Technology, achieved a net profit of 864 million yuan [2] Group 2: Financial Ratios - As of Q3 2025, Kangqiang Electronics had a debt-to-asset ratio of 42.90%, which is higher than the industry average of 31.95% [3] - The gross profit margin for Q3 2025 was 14.35%, which is below the industry average of 25.67% [3] Group 3: Shareholder Information - As of September 30, 2025, the number of A-share shareholders decreased by 15.25% to 68,100, while the average number of circulating A-shares held per shareholder increased by 18.00% to 5,510.94 [5] - Among the top ten circulating shareholders, Hong Kong Central Clearing Limited is the fourth largest with 6.9695 million shares, marking its entry as a new shareholder [5]

Core Viewpoint - 康强电子's stock price has shown fluctuations in recent trading sessions, with a year-to-date increase of 13.79% and a recent decline of 0.17% over the past five trading days [2]. Financial Performance - As of June 30, 康强电子 reported a revenue of 9.71 billion yuan for the first half of 2025, a slight decrease of 0.37% year-on-year, while the net profit attributable to shareholders was 594.84 million yuan, reflecting a growth of 26.23% [2]. - The company has distributed a total of 1.53 billion yuan in dividends since its A-share listing, with 33.78 million yuan distributed over the past three years [3]. Stock Market Activity - On October 17, 康强电子's stock price fell by 2.01% to 17.58 yuan per share, with a trading volume of 124 million yuan and a turnover rate of 1.86%, resulting in a total market capitalization of 6.597 billion yuan [1]. - The stock has appeared on the龙虎榜 three times this year, with the most recent instance on January 20, where it recorded a net buy of -150 million yuan [2]. Shareholder Information - As of June 30, 2025, 康强电子 had 80,400 shareholders, an increase of 0.53% from the previous period, with an average of 4,670 circulating shares per shareholder, a decrease of 0.53% [2][3]. - The seventh largest circulating shareholder is the 国泰中证半导体材料设备主题ETF, holding 1.1981 million shares, which is an increase of 191,300 shares from the previous period [3].