Core Insights - The article emphasizes that thermal management technology is crucial for breakthroughs in computing power, energy efficiency, and product reliability, especially in advanced fields like AI, smart vehicles, and semiconductors [2] - The "洞见热管理2026" series aims to create a comprehensive platform for industry, academia, research, and application to address thermal control challenges and establish new thermal balance standards [2] Group 1: Event Overview - The 2026 Future Industry New Materials Expo (FINE2026) will take place from June 10-12 at the Shanghai New International Expo Center, featuring an exhibition area of 50,000 square meters and over 300 strategic and cutting-edge technology reports, expecting to attract more than 100,000 professional visitors [3] - The Shanghai event will focus on high heat flux density scenarios, showcasing liquid cooling plates, AI chips, and power device thermal management [6] Group 2: Shanghai Event Highlights - The Shanghai exhibition will emphasize the integration of the Yangtze River Delta industrial cluster, particularly in data centers, new energy vehicles, semiconductors, energy storage systems, and large power facilities [8] - Key topics will include battery thermal management under high-power fast charging, automotive-grade power module cooling, and industrial-grade heat exchange solutions aimed at carbon neutrality [8] Group 3: Shenzhen Event Overview - The seventh Thermal Management Industry Conference and Expo (iTherM2026) will be held in Shenzhen in December 2026, focusing on the flexibility of technology and rapid market response [9] - The Shenzhen event will address the thermal challenges of miniaturized and integrated electronic devices and chips, providing a one-stop value connection platform for the thermal management industry [9] Group 4: Shenzhen Event Highlights - The Shenzhen exhibition will spotlight AI computing servers, smartphones, wearable devices, and low-altitude economy sectors, showcasing immersion cooling technology and new thermal interface materials for compact spaces [11] - The event aims to facilitate the commercialization of innovative technologies and provide a platform for startups and tech giants to showcase their ideas [11] Group 5: Previous Event Recap - The 2025 Shenzhen Thermal Management Expo featured numerous companies presenting new materials, processes, and system-level cooling solutions, attracting significant engagement from engineers and professionals [12] - The event successfully transitioned from "display" to "connection," highlighting the importance of industry collaboration and the rapid generation of cooperation intentions [16]

Core Viewpoint - The article highlights the advancements and market potential of M9 materials produced by Huihong Technology, a subsidiary of Meilian New Materials, which has achieved mass production of EX resin, a key component for electronic materials, marking a significant milestone in domestic production capabilities [2][3]. Group 1: Company Developments - Huihong Technology has successfully launched mass production of M9 materials, specifically EX resin, becoming the only domestic company to achieve this milestone [2]. - The production line for EX resin has an annual capacity of 200 tons, with plans to expand to 500 tons by 2024 [2]. - Meilian New Materials reported a revenue of 878 million yuan in the first half of 2025, reflecting a year-on-year growth of 3.10% [2]. Group 2: Market Insights - The global market for EX resin is projected to reach approximately 500-800 million yuan by 2025, with a domestic market share of 30%, and Meilian New Materials/Huihong Technology holding over 60% of this market [3][5]. - The EX resin is crucial for various applications, including communication devices, AI servers, and semiconductor packaging, indicating a broad market potential [3]. Group 3: Technological Advancements - Huihong Technology has overcome significant technical barriers previously dominated by Japanese imports, particularly in the production of special resins for 5G/6G communications [3]. - The M9-grade copper-clad laminates (CCL) are set to be utilized in NVIDIA's upcoming AI graphics cards, highlighting the demand for high-performance materials in advanced technology applications [4].