证券研究报告 | 北交所定期报告 | | --- | 证券分析师 赵昊 SAC：S1350524110004 zhaohao@huayuanstock.com 万枭 SAC：S1350524100001 wanxiao@huayuanstock.com 我国 AI 调用量于 2026 年 2 月首超美国，关注北交所 AI 算力产业链标的 ——北交所科技成长产业跟踪第六十五期（20260301） 投资要点： 风险提示：宏观经济环境变动风险、市场竞争风险、资料统计误差风险 hyzqdatemark 2026 年 03 月 02 日 请务必仔细阅读正文之后的评级说明和重要声明 联系人 2025H2 我国大模型日均调用量环比增长 263%，国产算力需求正经历指数级增长。根据第一财经消息，全球最 大的 AI 模型 API 聚合平台 OpenRouter 数据显示，2026 年 2 月 9 日-15 日，中国模型以 4.12 万亿 Token 的调 用量，首次超过同期美国模型的 2.94 万亿 Token；2026 年 2 月 16 日-22 日，中国模型周调用量进一步冲高至 5.16 万亿 Token，三周大涨 127 ...

证券日报网讯2月25日，精研科技（300709）在互动平台回答投资者提问时表示，在液冷业务方面，公 司散热板块液冷业务涉及产品为液冷模组、液冷板，开拓领域主要为服务器、储能等，并布局芯片、基 站等方向。截至回复之时，公司散热业务对芯片公司没有取得量产订单或者进行过量产供货。公司已在 越南正式成立孙公司越南精研(GIANTECHNOLOGY(VIETNAM)COMPANYLIMITED)。越南子公司已 经布局了MIM的一部分产能，同时，部分传动客户也要求公司在越南建设产能，满足其对于原产地生 产的需要。但目前公司主要的生产场地仍在国内。 ...

格隆汇2月25日丨精研科技(300709.SZ)在投资者互动平台表示，在液冷业务方面，公司散热板块液冷业 务涉及产品为液冷模组、液冷板，开拓领域主要为服务器、储能等，并布局芯片、基站等方向。截至回 复之时，公司散热业务对芯片公司没有取得量产订单或者进行过量产供货。 关于越南工厂的情况，公 司已在越南正式成立孙公司越南精研（GIAN TECHNOLOGY （VIETNAM） COMPANY LIMITED）。 越南子公司已经布局了MIM的一部分产能，同时，部分传动客户也要求公司在越南建设产能，满足其 对于原产地生产的需要。但目前公司主要的生产场地仍在国内。 ...

进入2026年，热管理技术已不再局限于传统的"散热"，它成为了制约算力突破、能源效率与产品可靠性的核心命脉。随着AI大规模算力集群、智能汽车、半 导体、深空/低空飞行器等前沿领域的跨越式发展，行业对热管理方案的精准度与能效比提出了近乎苛刻的要求。基于此， " 洞见热管理2026 " 系列活动 将以" 上海+深圳 " 双展联动模式 ，搭建起贯穿产、学、研、用的全产业链对接平台，旨在汇聚全球智慧，攻克温控难题，定义新一代热力平衡标准。 01 6月10日 上海站：未来产业之基！聚焦液冷板、芯片与功率器件热管理 2026未来产业新材料博览会 （FINE2026） 将于 6月10-12日 在上海新国际博览中心隆重举行。上海站规模宏大展出面积达 50,000平方米（N1-N5） ， 300+场 战略与前沿科技报告， 预计吸引超过10万+名专业观众。 同期 N2馆 特设 "2026热管理液冷板产业展"与"AI芯片及功率器件热管理展区" ，聚焦高热流密度场景下的工程难题。（ 可点击下方图片超链接查看详细介绍 ） | FINE 2026 × Ind iTher M | 中国未来产业崛起引领全球新材料创新发展 | | | | - ...

Core Insights - The article emphasizes that thermal management technology is crucial for breakthroughs in computing power, energy efficiency, and product reliability, especially in advanced fields like AI, smart vehicles, and semiconductors [2] - The "洞见热管理2026" series aims to create a comprehensive platform for industry, academia, research, and application to address thermal control challenges and establish new thermal balance standards [2] Group 1: Event Overview - The 2026 Future Industry New Materials Expo (FINE2026) will take place from June 10-12 at the Shanghai New International Expo Center, featuring an exhibition area of 50,000 square meters and over 300 strategic and cutting-edge technology reports, expecting to attract more than 100,000 professional visitors [3] - The Shanghai event will focus on high heat flux density scenarios, showcasing liquid cooling plates, AI chips, and power device thermal management [6] Group 2: Shanghai Event Highlights - The Shanghai exhibition will emphasize the integration of the Yangtze River Delta industrial cluster, particularly in data centers, new energy vehicles, semiconductors, energy storage systems, and large power facilities [8] - Key topics will include battery thermal management under high-power fast charging, automotive-grade power module cooling, and industrial-grade heat exchange solutions aimed at carbon neutrality [8] Group 3: Shenzhen Event Overview - The seventh Thermal Management Industry Conference and Expo (iTherM2026) will be held in Shenzhen in December 2026, focusing on the flexibility of technology and rapid market response [9] - The Shenzhen event will address the thermal challenges of miniaturized and integrated electronic devices and chips, providing a one-stop value connection platform for the thermal management industry [9] Group 4: Shenzhen Event Highlights - The Shenzhen exhibition will spotlight AI computing servers, smartphones, wearable devices, and low-altitude economy sectors, showcasing immersion cooling technology and new thermal interface materials for compact spaces [11] - The event aims to facilitate the commercialization of innovative technologies and provide a platform for startups and tech giants to showcase their ideas [11] Group 5: Previous Event Recap - The 2025 Shenzhen Thermal Management Expo featured numerous companies presenting new materials, processes, and system-level cooling solutions, attracting significant engagement from engineers and professionals [12] - The event successfully transitioned from "display" to "connection," highlighting the importance of industry collaboration and the rapid generation of cooperation intentions [16]

明泰铝业（601677.SH）2月12日在投资者互动平台表示，目前，公司高端产品占比约30%，现阶段重点 推进新能源电池材料、汽车轻量化用铝、铝塑膜铝箔、液冷板等产品。2025年10月，子公司鸿晟新 材"汽车、绿色能源用铝产业园项目"首期一条气垫炉生产线正式建成投产，进一步丰富公司在新能源汽 车、低空经济等新兴领域的高端铝材产品体系，公司聚焦"高端化+绿色化+智能化"主战略，深度布局 前沿领域，将稳步提升高端产品占比。 每经AI快讯，有投资者在投资者互动平台提问：公司多年来努力建设高端产品，现在情况如何？量产 情况如何？单吨税前利润如何？ （记者 王晓波） ...

进入2026年，热管理技术已不再局限于传统的"散热"，它成为了制约算力突破、能源效率与产品可靠性的核心命脉。随着AI大规模算力集群、智能汽车、半 导体、深空/低空飞行器等前沿领域的跨越式发展，行业对热管理方案的精准度与能效比提出了近乎苛刻的要求。基于此， " 洞见热管理2026 " 系列活动 将以" 上海+深圳 " 双展联动模式 ，搭建起贯穿产、学、研、用的全产业链对接平台，旨在汇聚全球智慧，攻克温控难题，定义新一代热力平衡标准。 01 6月10日 上海站：未来产业之基！聚焦液冷板、芯片与功率器件热管理 2026未来产业新材料博览会 （FINE2026） 将于 6月10-12日 在上海新国际博览中心隆重举行。上海站规模宏大展出面积达 50,000平方米（N1-N5） ， 300+场 战略与前沿科技报告， 预计吸引超过10万+名专业观众。 同期 N2馆 特设 "2026热管理液冷板产业展"与"AI芯片及功率器件热管理展区" ，聚焦高热流密度场景下的工程难题。（ 可点击下方图片超链接查看详细介绍 ） | FINE 2026 × Ind iTher M | 中国未来产业崛起引领全球新材料创新发展 | | | | - ...

Group 1 - The stock price of Cheng Tian Wei Ye has shown a downward trend, closing at 48.90 yuan on February 11, 2026, down 15.47% from 55.40 yuan on February 5, 2026 [1] - On February 6, the stock price was 54.40 yuan, with a daily decline of 1.81% and a net inflow of 13.30 million yuan from main funds; however, on February 11, there was a net outflow of 7.56 million yuan, indicating a bearish market trend [1] - The stock price fluctuations may be influenced by overall market adjustments and sentiment in the liquid cooling sector [1] Group 2 - Recent developments in the liquid cooling business are a core focus, with Cheng Tian Wei Ye entering the supply chain of leading U.S. semiconductor companies through a Taiwanese partner, providing key components such as liquid cooling plates and pipes [2] - The company is also advancing sample testing with domestic server manufacturers and internet companies, driven by AI computing power demand accelerating the commercialization of liquid cooling [2] - A fundraising plan was disclosed on January 16, 2026, aiming to raise no more than 800 million yuan for the industrialization of liquid cooling heat dissipation systems to expand production capacity [2] - Policy support is evident, with the Ministry of Housing and Urban-Rural Development seeking opinions on data center design standards, which now include requirements for liquid cooling systems [2] Group 3 - Institutional research indicates that Cheng Tian Wei Ye's liquid cooling business is receiving significant attention, with the next-generation microchannel packaging cover plate (MLCP) technology in the joint R&D stage with clients, expected to enhance cooling efficiency [2] - Valuation analysis by Securities Star suggests a relative valuation range of 44.03-48.66 yuan, with a C rating for valuation accuracy, indicating that the stock price may be high, but future revenue growth prospects are favorable [2] - Overall, institutional ratings remain neutral, with no significant positive or negative changes observed [2]

AI芯片及功率器件热管理大会暨展览会 2026年6月10-12日 上海新国际博览中心 01 大会信息 人工智能大模型、新能源汽车、储能系统及具身智能等新兴产业加速落地，算力密度与功率密度的同步跃 升，正将热管理推向前所未有的工程高度。一方面， AI服务器与专用芯片持续突破单芯片与单机柜功耗 上限； 此外 功率器件在新能源汽车、电力电子与储能系统中的高频、高压、高集成化应用，使系统发热 集中度与热失控风险显著上升。 在此背景下 ，本届 " AI芯片及功率器件热管理大会暨展览会 " 将聚焦高热流密度场景下的热管理系统工 程问题，围绕 高性能 导热材料、封装基板、液冷技术等方向 ， 系统性探讨 材料层面 、模块级、系统级 的关键技术路径与工程实践。 同期 "FINE2026 AI芯片及功率器件热管理 展区 " 将汇聚上下游材料、设备、产业链资源，精准对接市场 需求，全力助推液冷产业的高质量发展。 扫码报名参展参会 主题 ： 中国未来产业崛起引领全球新材料创新 时间 ： 2026年6月10-12日（6月8-9日布展） 地点 ：上海新国际博览中心 N1-N5 规模： 50,000平 ,10W+观众 02 组织机构 主办 ...

Group 1 - The core theme of the event is the rise of China's future industries leading global innovation in new materials, particularly focusing on liquid cooling technology as a solution to high heat density challenges in various sectors such as AI, electric vehicles, and data centers [2][15][28] - The "2026 Thermal Management Liquid Cooling Industry Conference and Exhibition" will take place from June 10-12, 2026, at the Shanghai New International Expo Center, featuring discussions on key technologies and engineering applications in the liquid cooling field [2][3][28] - The event will include a specialized exhibition area, "FINE2026 Thermal Management Liquid Cooling Board Industry Exhibition," which will gather upstream and downstream materials, equipment, and industry chain resources to meet market demands and promote high-quality development of the liquid cooling industry [2][7] Group 2 - The organizing bodies include DT New Materials, DT Future Industries, and various associations related to new materials and productivity enhancement, indicating a strong collaborative effort in the industry [4] - The conference will feature over 30 specialized forums and more than 300 expert reports focusing on cutting-edge technologies and industry trends in sectors such as AI, aerospace, and renewable energy [17][19] - The event will showcase a wide range of innovative solutions and products, including liquid cooling solutions for AI data centers, power semiconductor modules, and advanced cooling materials, highlighting the comprehensive nature of the exhibition [7][19] Group 3 - The event will offer early bird registration prices, with fees set at ¥2200 for regular attendees and ¥1200 for students until March 31, 2026, after which the prices will increase [8] - The agenda includes a variety of activities such as keynote speeches, parallel forums, and networking opportunities, designed to facilitate collaboration and knowledge sharing among industry professionals [5][19] - The exhibition will cover various themes, including data center liquid cooling, energy storage, and advanced manufacturing technologies, providing a holistic view of the industry's current landscape and future directions [6][7]