Core Viewpoint - The semiconductor industry is transitioning from FinFET to CFET technology by 2026, marking a shift in chip performance competition from mere size reduction to addressing physical limits and thermal management challenges [2][32]. Group 1: Macro Crisis - The long-term focus on increasing transistor density has led to significant thermal management issues, impacting CPU and GPU performance, power consumption, and energy efficiency [4][6]. - High temperatures can slow down critical signal propagation and cause permanent degradation of chip performance, leading to increased energy consumption for the same computational tasks [7][10]. Group 2: Path Exploration - Chip-level cooling technologies are essential for efficiently dissipating heat from high-density chips, with methods categorized into active and passive cooling systems [12][13]. - Advanced cooling architectures include remote, near-chip, and embedded on-chip cooling, each with varying effectiveness in heat transfer [13]. Group 3: Architectural Revolution - The transition to nanosheet and CFET architectures is expected to increase power density by 12%-15%, raising concerns about thermal runaway in densely packed data centers [34]. - Backside power delivery networks (BSPDN) are being developed to reduce resistance and improve voltage delivery, but they may introduce new thermal challenges due to thinner silicon substrates [35][40]. Group 4: Future Solutions - The industry is exploring various advanced materials and cooling techniques, including microchannel cooling, liquid cooling, and high-performance thermal management materials like diamond composites [20][59]. - Collaborative approaches, such as system and technology co-optimization (STCO), are necessary to address the complex thermal management challenges posed by next-generation chips [48][75].

Core Viewpoint - The article discusses the challenges faced by Rapidus in achieving its ambitious goals in the semiconductor industry, particularly in the context of AI chip production and the transition to 3D IC technology. Group 1: Rapidus and AI Chip Production - Rapidus is focusing on advanced packaging technologies to secure orders from major clients like GAFAM in the growing AI market [4][8] - The company aims to mass-produce 2nm chips by 2027, but there are doubts about its capability to achieve this in the front-end process [7][8] - The article argues that Rapidus's goal of ultra-short turnaround time (TAT) for AI chip packaging is unrealistic due to various technological and supply chain challenges [71] Group 2: Transition to 3D IC Technology - The semiconductor industry is experiencing a paradigm shift from front-end processing to back-end 3D IC technology, which integrates multiple chips into a single package [29][31] - This shift is driven by the limitations of traditional scaling methods and the need for higher performance in AI applications [26][29] - Rapidus's entry into the 3D IC field aligns with industry trends, but achieving its goals will require overcoming significant hurdles [31][71] Group 3: Challenges in HBM Production - The production of High Bandwidth Memory (HBM) is a bottleneck for AI chip manufacturing, with a lead time of approximately six months [67] - HBM production is complex and costly, with a significantly lower yield compared to standard DRAM, making it a critical factor for companies like Rapidus [66][67] - The current market for advanced HBM is dominated by suppliers like SK Hynix, which has sold out its 2025 production capacity, further complicating Rapidus's plans [68][71]