Core Viewpoint - The article discusses the recent developments regarding Xinheng Semiconductor Technology (Shanghai) Co., Ltd., including its completion of the IPO counseling report and the implications for its future capital movements in the semiconductor industry [1][6]. Group 1: Company Overview - Xinheng Semiconductor was established in 2010 and specializes in Electronic Design Automation (EDA) software development, providing comprehensive EDA solutions applicable in various fields such as 5G, smartphones, IoT, AI, and data centers [3]. - The company launched the world's first 3DIC Chiplet advanced packaging system design analysis EDA platform in 2021 [3]. - Co-founder and Chairman Ling Feng has over 20 years of experience in the semiconductor industry, having worked with major companies like Motorola and Cadence [3]. - Co-founder Dai Wenliang, who has a strong background in EDA, emphasizes the potential of the EDA market, which is expected to exceed one trillion yuan in the coming years [4]. Group 2: Recent Capital Movements - In early 2025, Xinheng Semiconductor accelerated its capital movements, initiating the A-share IPO process on February 7 and engaging in discussions for asset acquisition with Huada Jiutian, which ultimately fell through [7][8]. - The company reported projected revenues of 106 million yuan and 265 million yuan for 2023 and 2024, respectively, with net profits of -89.93 million yuan and 48.13 million yuan [7]. - The failed acquisition was attributed to disagreements on core terms between the parties involved, but both companies reaffirmed their strategic collaboration [8]. Group 3: Industry Context - The EDA industry is characterized by high market concentration, dominated by three major players: Cadence, Synopsys, and Siemens EDA, which collectively hold over 74% of the global market share [14]. - The domestic EDA market is expected to see an increase in localization, with the domestic EDA market share projected to rise from 11% in 2021 to 19% by 2025, equating to approximately 3.5 billion yuan [15]. - Xinheng Semiconductor focuses on advanced packaging technologies and aims to differentiate itself by embracing AI and transitioning from rule-based to data-driven design methodologies [18].

这意味着，在经历年初芯和半导体在上海证监局办理IPO辅导备案登记，拟冲击资本市场，以及被华大 九天收购一案无果而终等一系列事件后，芯和半导体资本动作有了明确走向。 半导体老兵"啃硬骨头" 芯和半导体成立于2010年，主营业务为电子设计自动化（EDA）软件开发，提供覆盖芯片、封装、模 组、PCB板级、互连到整机系统的全栈集成系统EDA解决方案，支持Chiplet（芯粒）先进封装，可应用 于5G、智能手机、物联网、人工智能和数据中心等领域。芯和半导体官网还显示，其于2021年全球首 发了3DIC Chiplet先进封装系统设计分析全流程EDA平台。 芯和联合创始人、董事长凌峰，为半导体资深从业人士。据介绍，凌峰在EDA、射频和SiP设计领域有 着二十多年工作和创业经验，曾在摩托罗拉、Cadence（楷登电子）等大公司和Neolinear、Physware等 初创公司工作。他于2000年在伊利诺伊大学厄巴纳-香槟分校获得电气工程博士学位，是IEEE（电子技 术与信息科学工程师协会）高级会员，拥有专著章节3部和国际核心期刊文章和会议文章60多篇。此 外，他还曾任华盛顿大学电机工程系兼职副教授（2007-2011年）以 ...

Core Viewpoint - The article discusses the challenges faced by Rapidus in achieving its ambitious goals in the semiconductor industry, particularly in the context of AI chip production and the transition to 3D IC technology. Group 1: Rapidus and AI Chip Production - Rapidus is focusing on advanced packaging technologies to secure orders from major clients like GAFAM in the growing AI market [4][8] - The company aims to mass-produce 2nm chips by 2027, but there are doubts about its capability to achieve this in the front-end process [7][8] - The article argues that Rapidus's goal of ultra-short turnaround time (TAT) for AI chip packaging is unrealistic due to various technological and supply chain challenges [71] Group 2: Transition to 3D IC Technology - The semiconductor industry is experiencing a paradigm shift from front-end processing to back-end 3D IC technology, which integrates multiple chips into a single package [29][31] - This shift is driven by the limitations of traditional scaling methods and the need for higher performance in AI applications [26][29] - Rapidus's entry into the 3D IC field aligns with industry trends, but achieving its goals will require overcoming significant hurdles [31][71] Group 3: Challenges in HBM Production - The production of High Bandwidth Memory (HBM) is a bottleneck for AI chip manufacturing, with a lead time of approximately six months [67] - HBM production is complex and costly, with a significantly lower yield compared to standard DRAM, making it a critical factor for companies like Rapidus [66][67] - The current market for advanced HBM is dominated by suppliers like SK Hynix, which has sold out its 2025 production capacity, further complicating Rapidus's plans [68][71]