Core Viewpoint - The article discusses the challenges faced by Rapidus in achieving its ambitious goals in the semiconductor industry, particularly in the context of AI chip production and the transition to 3D IC technology. Group 1: Rapidus and AI Chip Production - Rapidus is focusing on advanced packaging technologies to secure orders from major clients like GAFAM in the growing AI market [4][8] - The company aims to mass-produce 2nm chips by 2027, but there are doubts about its capability to achieve this in the front-end process [7][8] - The article argues that Rapidus's goal of ultra-short turnaround time (TAT) for AI chip packaging is unrealistic due to various technological and supply chain challenges [71] Group 2: Transition to 3D IC Technology - The semiconductor industry is experiencing a paradigm shift from front-end processing to back-end 3D IC technology, which integrates multiple chips into a single package [29][31] - This shift is driven by the limitations of traditional scaling methods and the need for higher performance in AI applications [26][29] - Rapidus's entry into the 3D IC field aligns with industry trends, but achieving its goals will require overcoming significant hurdles [31][71] Group 3: Challenges in HBM Production - The production of High Bandwidth Memory (HBM) is a bottleneck for AI chip manufacturing, with a lead time of approximately six months [67] - HBM production is complex and costly, with a significantly lower yield compared to standard DRAM, making it a critical factor for companies like Rapidus [66][67] - The current market for advanced HBM is dominated by suppliers like SK Hynix, which has sold out its 2025 production capacity, further complicating Rapidus's plans [68][71]