Group 1 - The article emphasizes the importance of timely and professional information interpretation in investment decision-making [1] - It focuses on uncovering the investment value of significant events, analyzing industry chain companies, and interpreting key policies [1] - The product aims to provide users with quick information on market impacts, presenting the value of information through a professional lens and simple language [1]

9月22日，华海清科涨0.45%，成交额14.08亿元。两融数据显示，当日华海清科获融资买入额2.00亿 元，融资偿还1.57亿元，融资净买入4223.61万元。截至9月22日，华海清科融资融券余额合计13.53亿 元。 截至6月30日，华海清科股东户数1.36万，较上期减少10.00%；人均流通股17452股，较上期增加 54.75%。2025年1月-6月，华海清科实现营业收入19.50亿元，同比增长30.28%；归母净利润5.05亿元， 同比增长16.82%。 分红方面，华海清科A股上市后累计派现2.71亿元。 机构持仓方面，截止2025年6月30日，华海清科十大流通股东中，华夏上证科创板50成份ETF （588000）位居第四大流通股东，持股891.68万股，相比上期增加90.47万股。易方达上证科创板50ETF （588080）位居第七大流通股东，持股686.29万股，相比上期增加114.97万股。嘉实上证科创板芯片 ETF（588200）位居第九大流通股东，持股393.37万股，相比上期增加87.38万股。香港中央结算有限公 司退出十大流通股东之列。 融资方面，华海清科当日融资买入2.00亿元。当前 ...

Core Viewpoint - The report highlights the potential growth of domestic computing power chips in China due to regulatory actions against NVIDIA, which may lead to an increase in market share for local manufacturers [1][2]. Group 1: Domestic Computing Power Chips - Chinese internet regulators have instructed major tech companies to cease all purchases of NVIDIA's AI chips and terminate existing orders, which is expected to boost the market share of domestic computing power chips [1][2]. - Huawei announced a three-year roadmap for its Ascend AI chips, planning to launch four new products from 2026 to 2028, including self-developed HBM technology [2]. Group 2: Advanced Process Expansion - Domestic advanced logic production is expanding beyond expectations, which is favorable for local equipment manufacturers [2]. - A new iteration cycle in storage technology is anticipated next year, aligning with the technological upgrade cycle [2]. Group 3: SoC Testing Market - The market for high-end SoC testing machines is expanding, with domestic companies like Huafeng Measurement and Changchuan Technology actively developing solutions to meet the high testing requirements of SoC chips [3]. - The need for advanced packaging in computing power chips is expected to benefit domestic equipment suppliers, as local manufacturers are likely to shift towards domestic advanced packaging supply chains [3]. Group 4: Investment Recommendations - Recommended companies in the front-end process include North Huachuang and Zhongwei Company for etching and thin film deposition equipment, and in the back-end packaging, companies like Huafeng Measurement and Changchuan Technology are highlighted [3][4]. - Advanced packaging equipment suppliers such as Jing Sheng Machine and other leading semiconductor equipment manufacturers are also noted as potential beneficiaries [3][4].