Core Insights - Alison Wagonfeld will report directly to CEO Jensen Huang, indicating a strategic shift in the company's focus on marketing as it becomes increasingly important for the AI chip maker [1] Company Summary - The appointment of Alison Wagonfeld highlights the growing significance of marketing within the company, reflecting a broader trend in the industry where effective marketing strategies are essential for competitive advantage in the AI sector [1]

Benzinga and Yahoo Finance LLC may earn commission or revenue on some items through the links below. Shares of Arm Holdings traded slightly lower over the past month amid broader AI sector volatility and profit-taking after earlier highs. Traders eye the chip designer’s role in powering next-gen AI compute as a key rebound catalyst. Against that backdrop, we ran Arm Holdings through an AI price-prediction agent powered by OpenAI’s GPT. The goal was to see how a data-driven model handicaps the next 60 day ...

智通财经APP获悉，据港交所1月9日披露，芯天下技术股份有限公司(简称：芯天下)向港交所主板递交上市申请，广发证券和中信证券为其联席保荐人。据 招股书，芯天下专注代码型闪存芯片的研究与开发、设计和销售。代码型闪存芯片主要为存储系统启动及运行过程中的代码而设，该等场景需要高稳定度与 可靠度。该公司以Fabless模式为客户提供从1Mbit至8Gbit宽容量范围的代码型闪存芯片。为强化产品组合，该公司提供模拟芯片和MCU。 | [编纂]的[编纂]數目 | [编纂]股H股(視乎[编纂]行使與否而定) | | --- | --- | | [编纂]數目 | [编纂]股H股(可予[编纂]) | | [编纂]數目 | [編纂]股H股(可予[編纂]及視乎[編纂]行使與否而定 | | 最高[编纂] .. | 每股H股[編纂]港元,另加1.0%經紀佣金、0.0027% | | | 證監會交易徵費、0.00015%會財局交易徵費及 | | | 0.00565%聯交所交易費(須於申請時以港元繳足 | | | 多繳股款可予退還) | | 面值 | 每股H股人民幣1.00元 | | [編纂] | [编纂] | | 聯席保薦人及[編纂] ...

Jan 8 (Reuters) - The U.S. Supreme Court is set to issue rulings on Friday on cases related to the legality of ​tariffs imposed by President Donald Trump under the International Emergency ‌Economic Powers Act. The administration faces the possibility of having to refund nearly $150 billion paid in ‌tariffs to importers if the court declares that the sweeping duties Trump has imposed under the IEEPA are illegal. Major corporations such as Costco, Revlon, Ray-Ban eyeglass maker EssilorLuxottica, Bumble Be ...

据港交所文件，1月9日，芯天下技术股份有限公司向港交所递交上市申请书，联席保荐人为广发证券、 中信证券。该公司是一家无晶圆厂芯片设计公司，专注于通用型芯片的研究与开发、设计与销售，核心 产品为代码型闪存芯片，并辅以覆盖模拟芯片及MCU的产品线。 ...

Core Viewpoint - Semilux International Ltd. has received a deficiency notice from Nasdaq regarding its Market Value of Listed Securities, which fell below the required minimum of $35 million, impacting its compliance status for continued listing on the Nasdaq Global Market [1][2]. Group 1: MVLS Deficiency Notice - The MVLS Deficiency Notice indicates that from November 13, 2025, to December 30, 2025, the Company's MVLS was below the $35 million threshold required for Nasdaq listing [1]. - The notice does not immediately affect the trading of the Company's ordinary shares, which continue to trade under the symbol "SELX" [2]. Group 2: Compliance Timeline - The Company has until June 29, 2026, to regain compliance with the MVLS Requirement, as per Nasdaq Listing Rule 5810(c)(3)(C) [2]. - To regain compliance, the Company's MVLS must close at $35 million or more for at least ten consecutive business days during the compliance period [2]. Group 3: Potential Delisting - If compliance is not achieved by the Compliance Date, Nasdaq will issue a notice regarding potential delisting, which the Company can appeal [3]. - There is no guarantee that any appeal against a delisting determination would be successful [3]. Group 4: Company Actions - The Company plans to actively monitor its MVLS and will take reasonable measures to regain compliance with the MVLS Requirement [4]. - Despite the Company's efforts to maintain its listing, there is no assurance that it will successfully regain or maintain compliance with Nasdaq's continued listing standards [4].

中国半导体行业IPO盛况前所未有，几乎所有的国产芯片企业都在争抢驶入资本市场主航道的船票。 继摩尔线程（688795.SH）、沐曦股份（688802.SH）登陆A股不久后，壁仞科技（6082.HK）、天数智芯（9903.HK）也在港交所挂牌上市。 与此同时，燧原科技也顺利完成了IPO辅导，百度（NASDAQ：BIDU）旗下昆仑芯正式向港交所递交上市申请。 除GPU公司、AI芯片外，多家半导体企业迎来密集的IPO闯关热潮。 存储芯片龙头企业——长鑫科技申报科创板IPO获受理；广东首个量产的12英寸晶圆制造平台——粤芯半导体申报创业板IPO获受理；DPU芯 片龙头企业——云豹智能在深圳证监局办理上市辅导备案登记……更多芯片产业链上下游龙头企业正蓄势待发。 1月8日，21世纪经济报道记者不完全统计，共有95家半导体产业链企业开启或加速IPO进程，包括已上市10家，准备上市85家。 其中，A股市场共有55家，已上市4家，除了17家企业已进入辅导备案进程，其余34家企业都在加速IPO进程；港股市场共有40家，已上市6 家，还有34家冲刺上市。 随着自主创新持续推进，叠加政策与市场红利，中国半导体产业正进入资本驱动与技术 ...

Financial Data and Key Metrics Changes - Revenue for Q2 2026 was $9.9 million, down 27% from $13.5 million in the prior year period, primarily due to lower shipments of wafer packs [26][27] - Non-GAAP gross margin for Q2 was 29.8%, compared to 45.3% a year ago, reflecting lower sales volume and a less favorable product mix [27] - Non-GAAP net loss for the quarter was $1.3 million, or negative $0.04 per diluted share, compared to net income of $0.7 million, or $0.02 per diluted share in Q2 2025 [28] Business Line Data and Key Metrics Changes - Wafer-level burn-in engagements expanded with significant progress in production installations across AI processors, flash memory, and silicon photonics [5][7] - Package-part burn-in systems saw increased demand, with orders totaling more than $5.5 million in the fiscal third quarter to date, exceeding total orders for the entire second quarter [17][18] - Contact revenues, including wafer packs and burn-in systems, totaled $3.4 million, representing 35% of total revenue, down from 64% in the prior year [27] Market Data and Key Metrics Changes - The company expects bookings in the second half of fiscal 2026 to be between $60 million and $80 million, primarily driven by AI processors [5][23] - Increased visibility across multiple end markets, including AI, silicon photonics, and gallium nitride, is expected to drive significant revenue growth in fiscal 2027 [6][22] - The semiconductor market is experiencing a shift towards reliability testing, with growing demand for advanced wafer-level and package-level burn-in systems [21] Company Strategy and Development Direction - The company is focusing on expanding into key markets such as AI processors, gallium nitride power semiconductors, and silicon photonics, diversifying its customer base and total addressable market [22] - A strategic partnership with ISE Labs was announced to deliver advanced wafer-level test and burn-in services for next-generation high-performance computing and AI applications [7][8] - The company is reinstating financial guidance for fiscal 2026, expecting revenue between $25 million and $30 million for the second half of the fiscal year [23][30] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook due to increased visibility across multiple end markets and the expected strong bookings for AI-related products [6][22] - The company is taking a conservative approach to estimating the size of the AI market but acknowledges the potential for significant revenue growth in the coming years [36][39] - Management highlighted the importance of reliability testing in the semiconductor industry, driven by the increasing performance and safety requirements of devices [21] Other Important Information - The company ended the quarter with $31 million in cash, up from $24.7 million at the end of Q1, primarily due to proceeds from an equity program [29] - The company has received additional bookings of $6.5 million in the first six weeks of Q3, increasing effective backlog to $18.3 million [25][29] Q&A Session Summary Question: Is the potential booking strength of $60-$80 million in the second half of the fiscal year almost entirely on the AI accelerator processor line? - Management confirmed that the bulk of the bookings is across wafer-level and package-part burn-in for AI processors, with some contributions from silicon carbide and silicon photonics [34] Question: Do you see the AI business expanding meaningfully in the multi-year timeframe including 2027 and 2028? - Management believes the AI business could be measured in hundreds of millions of dollars in a few years, with significant demand for wafer-level burn-in systems [36] Question: What is the anticipated capacity for manufacturing wafer-level systems? - Management indicated that they could potentially manufacture over 20 systems a month if needed, exceeding current forecasts [41] Question: Is the delay in wafer-level benchmarks due to customer changes or new parameters? - Management acknowledged that the delay was partly due to misunderstandings regarding wafer-level testing requirements, but they remain optimistic about progress [50][51] Question: Will customers initially use package-part burn-in and then switch to wafer-level burn-in? - Management indicated that while some customers may start with package-part burn-in, they are likely to transition to wafer-level burn-in as it proves more efficient [80]

On Jan. 8, 2026, investors weighed eye‑popping AI demand forecasts against questions over valuation, China access, and capital intensity.Nvidia (NVDA 2.09%), a GPU and AI solutions leader, closed Thursday's session at $185, down 2.17%. Nvidia IPO'd in 1999 and has grown an astounding 450,934% since going public. Trading volume reached 163.5 million shares, coming in nearly 12% below versus its three-month average of 185.9 million shares.Thursday's move followed commentary on AI demand potentially topping $5 ...

Financial Data and Key Metrics Changes - Revenue for Q2 FY2026 was $9.9 million, down 27% from $13.5 million in the prior year period, primarily due to lower shipments of wafer packs [24] - Non-GAAP gross margin for Q2 was 29.8%, compared to 45.3% a year ago, reflecting lower sales volume and a less favorable product mix [25] - Non-GAAP net loss for the quarter was $1.3 million, or negative $0.04 per diluted share, compared to net income of $0.7 million, or $0.02 per diluted share in Q2 FY2025 [26] - Cash position improved to $31 million at the end of the quarter, up from $24.7 million at the end of Q1 [27] Business Line Data and Key Metrics Changes - Wafer-level burn-in engagements expanded with significant progress in production installations across AI processors, flash memory, and silicon photonics [5][6] - Package-part burn-in systems saw increased demand, with orders totaling more than $5.5 million in the fiscal third quarter to date, exceeding total orders for the entire second quarter [17] - Contact revenues, which include wafer packs and burn-in systems, totaled $3.4 million, representing 35% of total revenue, down from 64% in the same quarter last year [25] Market Data and Key Metrics Changes - The semiconductor test and burn-in market is experiencing growth driven by AI and data center infrastructure, with bookings expected to be between $60 million and $80 million in the second half of FY2026 [5][23] - The company is seeing strong demand for its Sonoma systems, particularly for high-temperature operating life qualifications for AI devices [17][19] - The silicon carbide market is expected to see demand growth, although the company is taking a conservative stance on order expectations [15] Company Strategy and Development Direction - The company is focusing on expanding into key markets such as AI processors, gallium nitride power semiconductors, and silicon photonics, diversifying its customer base and total addressable market [22] - A strategic partnership with ISE Labs was announced to enhance wafer-level test and burn-in services for next-generation high-performance computing and AI applications [8] - The company is reinstating financial guidance for FY2026, expecting revenue between $25 million and $30 million for the second half of the fiscal year [23][28] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook due to increased visibility across multiple end markets and the reinstatement of financial guidance [6][22] - The company highlighted the importance of reliability testing in the semiconductor industry, driven by the growing complexity and performance requirements of next-generation devices [21] - Management noted that the demand for AI and data center infrastructure is a significant growth driver for the company [4][20] Other Important Information - The company successfully closed the InCal facility and consolidated operations into its Fremont facility, resulting in cost savings [26] - The company raised $10 million in gross proceeds through an equity offering during the quarter [27] - The company plans to participate in several investor conferences in early 2026 to enhance investor relations [28] Q&A Session Questions and Answers Question: What is the potential booking strength of $60-$80 million in the second half of this fiscal year? - The majority of bookings are expected to come from the AI accelerator processor line, with some contributions from silicon carbide and silicon photonics [30] Question: Can you provide insight into the AI processor market's potential growth? - The company anticipates that the AI business could be measured in hundreds of millions of dollars in a few years, with significant demand for wafer-level burn-in systems [31][32] Question: What is the expected capacity for manufacturing wafer-level systems? - The company discussed the potential to manufacture over 20 systems a month if demand requires it, indicating strong production capabilities [36] Question: Will customers transition from package-part burn-in to wafer-level burn-in? - Customers may initially use package-part burn-in and later transition to wafer-level burn-in as they become more comfortable with the technology [50][51]