Core Viewpoint - The company Guangpu Co., Ltd. (300632) announced its participation in the Light Expo, showcasing advanced optical integrated sensor packaging products, including 2.5D and micro-optical packaging solutions, which have broad applications across various sectors [1] Group 1: Product Offerings - The showcased products include advanced optical integrated sensor packaging solutions [1] - These products are applicable in multiple fields such as robotics, artificial intelligence, smart wearables, brain-machine interfaces, low-altitude economy, intelligent driving, and consumer electronics [1]

Core Insights - The 25th China International Optoelectronic Exposition (CIOE) held from September 10 to 12 in Shenzhen showcased a significant increase in attendance, particularly in the XR (Extended Reality) section, indicating growing interest in AR glasses and related technologies [1][2] - Major companies like GoerTek, Sunny Optical, JBD, and Raynex presented their latest solutions in the AR glasses sector, focusing on advancements in optical components such as waveguides and micro-displays, which are critical for product form and display quality [1][4] - The development of AI large models is driving demand for new smart terminal devices beyond smartphones, providing a clear market direction for "glasses" shaped products [1][4] Market Trends - According to CINNO Research, sales of consumer-grade AI/AR glasses in China are projected to reach 262,000 units in the first half of 2025, representing a 73% year-on-year increase, with audio and photography-focused non-screen AI glasses seeing a staggering 463% growth [4] - Over 30 companies showcased XR-related solutions at the expo, covering various aspects from materials to micro-display chips, indicating a robust interest from leading manufacturers like Xiaomi and Huawei entering the market [4][5] Technical Challenges - Industry experts highlighted that the mass production of AI+AR glasses faces challenges in supply chain coordination, cost control, and yield improvement, particularly in the precision processing of waveguide lenses and the low yield rates of Micro-LED micro-display chips [4][5] - The optical display system accounts for approximately 40% of the total cost of AR glasses, making the maturity and cost of this segment crucial for market acceptance [5] Performance vs. Cost - Manufacturers are divided into two camps: those pursuing maximum performance, exemplified by MicroLED technology, and those focusing on cost optimization, represented by LCoS (Liquid Crystal on Silicon) technology [6][9] - Companies like Raynex and JBD are pushing the boundaries of performance with their MicroLED solutions, achieving high brightness and compact sizes, while others like Guangfeng Technology are working on cost-effective solutions through innovative architectures [9][10] Future Outlook - The industry is currently at a crossroads, with AR glasses still facing technical, cost, and application scenario constraints before reaching maturity [16][17] - The market for AI glasses, which focus on audio and photography, is expected to grow significantly, with projections for sales increasing from 5.5 million units to between 7 million and 8 million units this year [17][18] - Experts predict that AR glasses will eventually evolve into a platform capable of supporting a wide range of applications, but this may not occur until around 2029 to 2030 when display technologies and chips mature [18]

格隆汇9月12日丨仕佳光子(688313.SH)在投资者互动平台表示，根据公司于2025年7月30日披露的半年 度定期报告：公司硅光模块用 CW DFB 激光器已获得业内客户验证，实现小批量出货；公司开发出数 据中心和人工智能算力用＞900mW MOPA 激光器，送样验证中。 ...

格隆汇9月12日丨仕佳光子(688313.SH)在投资者互动平台表示，根据公司于2025年7月30日披露的半年 度定期报告：公司硅光模块用 CW DFB 激光器已获得业内客户验证，实现小批量出货；公司开发出数 据中心和人工智能算力用＞900mW MOPA 激光器，送样验证中。 ...

Core Insights - The demand for AI computing power has led to a significant increase in the adoption of silicon photonics technology in the optical module sector, with a notable rise in penetration rates [1][5] - Huagong Technology's subsidiary, Huagong Zhengyuan, showcased advanced products at the 26th China International Optoelectronic Expo, indicating a strong commitment to silicon photonics [1][5] Industry Trends - Silicon photonics technology has transitioned from an optional path to a clear direction, with various solutions like CPO and LPO coexisting in different scenarios [1][5] - The global market for silicon photonics modules in data centers is projected to reach $5.5 billion by 2025, with penetration rates expected to exceed 50% [5] Company Developments - Huagong Zhengyuan has been developing silicon photonics technology since 2019, achieving mass production of a full range of silicon photonics products, with over 70% of its 800G module shipments being silicon photonics products [5][7] - The company reported a 124% year-on-year revenue growth in its connectivity business, which accounted for 49% of total revenue, with R&D investment at 8.7% focused on silicon photonics and CPO [7] Product Innovations - The second-generation single-wave 400G optical engine was introduced, achieving a breakthrough speed of 420Gbps, laying the groundwork for the 3.2T optical module [5][9] - The 3.2T CPO product features a 16-channel 200G solution, maintaining industry-leading performance in power consumption and data density [9] Market Dynamics - The rapid iteration of optical module technology is leading to a competitive landscape where leading companies must possess fast R&D, global manufacturing, and cross-chain integration capabilities [6] - The industry is moving towards a multi-solution approach, with LPO and CPO technologies being developed to meet specific performance needs, particularly in AI training and inference [8][9]

Market Overview - A-shares experienced a collective surge, with the Shenzhen Component Index and the ChiNext Index reaching new highs in the current market cycle. The Shanghai Composite Index rose by 1.65% to 3875.31 points, the Shenzhen Component Index increased by 3.36% to 12979.89 points, and the ChiNext Index climbed by 5.15% to 3053.75 points. The total trading volume in the Shanghai and Shenzhen markets reached 24.377 trillion, a significant increase of 459.6 billion compared to the previous day [1][3]. AI and Cloud Computing Sector - The AI hardware sector remains the core focus of the current market rally, with significant interest in AI computing hardware and communication sectors. The Communication ETF (515880) hit a limit-up with a premium rate of 0.60%, while the ChiNext AI ETF (159388) rose by 8.71% [3][4]. - Oracle's stock surged by over 40%, marking its largest intraday gain since 1992, following news of a $300 billion power procurement contract with OpenAI, which is set to begin in 2027. This contract is expected to significantly exceed OpenAI's current revenue and is one of the largest cloud contracts in history [5]. - Oracle's cloud computing revenue grew by 28% year-on-year to $7.186 billion, accounting for 48% of total revenue, with remaining performance obligations (RPO) reaching $455 billion, a year-on-year increase of over four times [5]. Server and Chip Market Dynamics - The AI server market is expected to maintain its growth momentum, with major cloud service providers (CSPs) like Google, Meta, Amazon, and Microsoft projected to increase capital expenditures to $90 billion in Q2 2025, a 70% year-on-year increase [6]. - Domestic server leaders are anticipated to benefit significantly from this trend, with substantial growth in AI server business expected, showing over 60% year-on-year growth [6]. - The introduction of NVIDIA's new GPU, Rubin CPX, is expected to enhance AI application efficiency and reduce inference costs, further driving demand in the optical communication and liquid cooling sectors [7]. Investment Opportunities - Investors are encouraged to focus on the A-share AI hardware sector, particularly the Communication ETF (515880) and the ChiNext AI ETF (159388), which have significant exposure to optical modules and servers [9]. - The semiconductor sector has shown strong performance, with notable gains in various chip ETFs, indicating a potential recovery from previous downturns [14].

Core Viewpoint - The company is introducing a photonic integrated chip design and packaging solution that utilizes 3D lithography technology, which enhances precision and reduces signal attenuation, making it suitable for industrial mass production [1] Group 1 - The solution employs polymer waveguides of arbitrary shapes, replacing traditional lens coupling with photonic wire bonding [1] - The technology is particularly applicable for CPO/OIO small-sized multi-channel packaging [1] - The advantages include high alignment accuracy and reduced optical signal loss, which are critical for industrial applications [1]

Core Viewpoint - The company has received overseas sample orders for its silicon-based OCS, indicating interest in its technology despite the market's uncertain outlook [1] Company Developments - The company has achieved small-scale trial production of its 400G coherent module [1] - The OCS market is characterized by high demand and significant technical challenges, suggesting that large-scale application will take time [1] - Currently, the company does not consider OCS a significant part of its revenue budget [1] Future Plans - In the second half of the year, the company plans to accelerate the implementation of overseas projects and increase production capacity [1] - The focus will be on ensuring timely delivery of existing orders [1]

格隆汇9月10日丨仕佳光子(688313.SH)在投资者互动平台表示，大功率DFB激光器芯片是公司面向高端 应用开发的重要产品之一，可应用于数据中心高速互连与人工智能算力基础设施等高带宽、低功耗需求 场景。公司致力于通过持续研发保持相关产品技术的先进性与竞争力。本次光博会期间欢迎莅临11号馆 11B25仕佳光子展位交流。 ...

格隆汇9月10日丨鹏鼎控股(002938.SZ)在互动平台表示，公司2024年下半年通过光模块客户认证并小批 量投产，未来随着AI技术的发展，该业务线的营收贡献将逐步攀升。 ...