按2024年收入及销量计，天域半导体在中国碳化硅外延片行业均排名第一，市场份额分别为30.6%、 32.5%。 来源：市场资讯 （来源：郭二侠说财） 量化派的中签结果昨天晚上港交所已经公布，有16万人申购，其中乙组1.2万人；一手中签率0.6%，乙 头总中签率10.8%；公开认购9366倍，冻资1225亿港元，国配15倍。 量化派的货量太少，总共才2670手，仅比今年唯一的一只创业板金叶国际2000手多一点点，因此上市大 涨。通常情况下，手数越少，中签难度越大，上市后的涨幅也越高，因为庄家好控盘。 可以看出有许多打新人没有参与，融资申购的人也不多，如果不中签就白白损失100港币手续费。 一、招股信息 | 公司名称 | 天域半导体 (02658.HK) | | --- | --- | | 所属行业 | 未导体 | | 招股目期 | 11月27日~12月2日 | | 发行股数 | 总发行3007万股,其中10%为公开发售, 90%为国际配售 | | 分配机制 | 机制B | | 招股价 | 58港元 | | 每手股数 | 50股 | | 公司市值 | 228.1亿 | | 市盈率 | 亏损 | | 最小申购金额 ...

Core Viewpoint - Tianyu Semiconductor has submitted an IPO application to the Hong Kong Stock Exchange, aiming to expand its production capacity and enhance its R&D capabilities in the silicon carbide (SiC) sector, which is crucial for various applications including electric vehicles and renewable energy [1][8]. Group 1: Company Overview - Established in 2009, Tianyu Semiconductor specializes in the development, production, and sales of 4H-SiC epitaxial wafers, with applications in new energy, rail transportation, smart grids, and consumer electronics [1]. - The company has achieved significant milestones in production capacity, including mass production of 4-inch wafers in 2014, 6-inch wafers in 2018, and becoming one of the few companies in China capable of 8-inch wafer production in 2023 [1]. Group 2: Financial Performance - The company's revenue has shown volatility, with reported figures of RMB 437 million in 2022, RMB 1.171 billion in 2023, RMB 520 million in 2024, and RMB 257 million in the first five months of 2025 [2][3]. - Net profit figures indicate a loss of RMB 500 million in 2024, following a profit of RMB 95.88 million in 2023, and a profit of RMB 951,500 in the first five months of 2025 [2][3]. - The gross margin has fluctuated significantly, with rates of 20% in 2022, 18.5% in 2023, a loss margin of -72% in 2024, and a recovery to 22.5% in the first five months of 2025 [2][3]. Group 3: Customer Dependency - The company relies heavily on its top five customers, which accounted for 61.5% of total revenue in 2022, 77.2% in 2023, 75.2% in 2024, and 61.8% in the first five months of 2025 [5]. Group 4: R&D Investment - R&D expenditures have been consistent, with amounts of RMB 29 million in 2022, RMB 55 million in 2023, RMB 61 million in 2024, and RMB 20 million in the first five months of 2025, indicating a commitment to technological advancement [4]. Group 5: Financing and Shareholding - Since 2021, the company has raised approximately RMB 1.464 billion through seven rounds of financing, with share prices increasing from RMB 2.93 in 2021 to RMB 41.96 in November 2024 [6][8]. - The major shareholders include Li Xiguang and related parties holding 58.36%, with other notable investors such as Huawei and BYD holding smaller stakes [6]. Group 6: IPO Plans and Use of Proceeds - The IPO proceeds are intended for expanding overall production capacity, enhancing R&D and innovation capabilities, strategic investments or acquisitions, and expanding global sales and marketing networks [8].

7月22日，广东天域半导体股份有限公司（简称"天域半导体"）向港交所提交上市申请，中信证券为其独家保荐人。此前， 天域半导体曾于2024年12月首次向港交所递交上市申请。 | | | | 截至12月31日止年度 | | | | | 截至5月31日止五個月 | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | 2022年 | | 2023年 | | 2024年 | | 2024年 | | 2025年 | | | 销量 | | | 销量 | | 销量 | | 销量 | | 销量 | | | | | 00 | | 9/0 | | 0% | | 00 | | 0/0 | | 销售自製碳化硅外延片 | | | | | | | | | | | | 4英时 2.777 | | 6.3 | 1.818 | 1.4 | 1.699 | 2.2 | 318 | 0.9 | 901 | 1.2 | | 6英时 40.167 | | 90.2 | 125.799 | 96.3 | 68.358 | 86.6 | 36.520 | 9 ...