Core Viewpoint - The article discusses the upcoming "2025 Liquid Cooling Industry Innovation and Application Forum" organized by DT New Materials, highlighting its significance in the liquid cooling technology sector and the participation of various industry leaders [3][10]. Event Details - The forum will take place from July 3 to July 5, 2025, in Dongguan, Guangdong [3][10]. - Over 300 industry professionals are expected to attend, with activities including product displays and report exchanges [3]. Agenda Overview - The event will feature a detailed agenda, including registration, opening activities, keynote speeches, and specialized reports on liquid cooling technologies [4][11]. - Notable topics include future technology trends in liquid cooling, applications of liquid cooling plates for high-power IGBT/SiC chips, and innovations in liquid cooling solutions for data centers [13][20]. Accommodation and Transportation - Various hotel options are available near the venue, with prices ranging from 180 to 350 RMB per night [6][8]. - Transportation details from major airports and train stations to the venue are provided, including estimated costs and travel times [9]. Registration and Fees - Registration fees are set at 2800 RMB for regular attendees and 1200 RMB for students, with on-site fees being slightly higher [32][33]. - Payment methods include bank transfer and Alipay, with specific instructions for registration completion [33].

9 June 2025 | 2:01AM HKT Taiwan Technology: Monthly revenues preview on Chenbro, Auras, E Ink; ASIC AI servers / e-papers to drive growth; FX affects 2Q25 Chenbro May revenues declined by 7% MoM to NT$1.8bn, or 12% behind our estimates. The sequential decline is mainly caused by high base and FX impact, while the rising AI servers (HGX, MGX, and ASIC), and general servers new product cycle continue to support the company's growth. For coming months, we expect June revenues to stay at similar level as May, a ...

新华财经北京5月26日电（康耕甫） 近日，"ESIS 2025第四届中国电子半导体数智峰会"在上海举办。汇 正财经首席策略师杨首骏在论坛期间接受新华财经采访时表示，半导体行业与AI形成真正的生态协同 更多的可能是技术驱动行业发展。对于投资者来说，国家产业大基金三期入局刚一年左右的时间，可能 未来整个半导体投资中会出现更多确定性的机会。 杨首骏表示，近几年随着AI技术的创新与爆发，资本市场包括实业，一些细分方向都出现了比较确定 的机会。比如光模块、液冷等，不过结合近期财报，这两个行业龙头的一些表现还是略有区别。一些光 模块企业，比如中际旭创等，虽然股价出现大涨，但最近几年的估值反而是越来越低，也就是说这些企 业现在进入到业绩兑现当中，当然低估值之后能不能保持高增速？这可能是未来投资者需要考量的一个 问题，"我觉得可能有点难"。 液冷方向来看，目前一些龙头上市公司估值不算很低，而且股价表现相较于光模块的一些龙头企业来说 还是比较弱。"所以这两个细分方向的上市公司可能在过去几年走的路径有所不同。我反倒觉得可能液 冷这个方向未来的空间会更大一些。因为从数据中心建设的角度来说，对于液冷的需求量可能未来会更 大，近期英伟 ...

EATONTOWN, N.J., May 01, 2025 (GLOBE NEWSWIRE) -- Climb Channel Solutions, an international specialty technology distributor and wholly owned subsidiary of Climb Global Solutions, Inc. (NASDAQ: CLMB), is excited to announce its new partnership with Accelsius. Accelsius is a leader in next-generation liquid cooling solutions for high-performance computing environments. This partnership further strengthens Climb’s commitment to delivering innovative emerging technologies to its channel partners, equipping the ...