三维集成键合设备
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拓荆科技公告拟募资46亿元推进核心主营业务,科创半导体ETF(588170)开盘翻红
Mei Ri Jing Ji Xin Wen· 2025-11-28 02:39
Group 1 - The core viewpoint of the news highlights the positive performance of the semiconductor materials and equipment sector, particularly the rise of the Sci-Tech Innovation Board Semiconductor Materials and Equipment Theme Index and its constituent stocks [1][2] - The Sci-Tech Semiconductor ETF (588170) has shown significant trading activity, with a turnover of 2.48% and a transaction volume of 79.76 million yuan, indicating strong investor interest [1] - The recent announcement by Tuojing Technology regarding its plan to raise up to 4.6 billion yuan for the construction of a high-end semiconductor equipment industrialization base and a cutting-edge technology research center reflects the company's focus on technological innovation and domestic semiconductor industry enhancement [1][2] Group 2 - Changcheng Securities identifies Tuojing Technology as a leading domestic supplier of semiconductor thin film deposition equipment, benefiting from the accelerated expansion of domestic wafer fabs and the push for localization [2] - The company is strategically positioning itself in the three-dimensional integration bonding equipment market and has received support from the National Integrated Circuit Industry Investment Fund, which may lead to a second growth curve [2] - The semiconductor materials and equipment industry is characterized by low domestic substitution rates and high potential for domestic replacement, driven by the AI revolution and ongoing technological advancements [2]
研报掘金丨长城证券:维持拓荆科技“增持”评级,前瞻性布局三维集成键合设备
Ge Long Hui A P P· 2025-11-27 06:49
Core Viewpoint - Tuojing Technology reported a 600% year-on-year increase in net profit excluding non-recurring items for the first three quarters, with Q3 revenue growing 82% quarter-on-quarter, driven by strong downstream demand and a robust order backlog [1] Company Performance - The company is a leading domestic supplier of semiconductor thin film deposition equipment, with advanced core products such as PECVD and ALD, and a comprehensive product range [1] - The acceleration of domestic wafer factory expansions and the push for localization are expected to significantly benefit the company as a leading platform equipment provider [1] Future Outlook - The company is strategically positioning itself in three-dimensional integrated bonding equipment and has received substantial support from a major fund, which is anticipated to open a second growth curve [1] - Projected net profits for the company from 2025 to 2027 are estimated to be 1.102 billion, 1.922 billion, and 2.651 billion yuan, respectively, with corresponding price-to-earnings ratios of 74, 43, and 31 times [1]