Group 1: Company Overview and Value Management - The company has implemented various strategies for value management, including cash dividends, stock incentives, and investor relations management, to enhance company value and investor confidence [2][3]. - In 2025, the company plans to distribute cash dividends of 125,991,116.70 CNY (including tax), which accounts for 40.86% of the net profit attributable to shareholders [3]. - The company has executed two stock incentive plans to retain core talent and stimulate team vitality, ensuring high growth and stable returns for shareholders [3]. Group 2: Investment and Mergers - In 2025, the company completed 4 equity investments and 1 acquisition, focusing on AI-related sectors, including a cash acquisition of Shanghai Furui Kun Microelectronics [4]. - Future investments will target high-quality companies in core areas such as connectivity, automotive, and robotics, with a global perspective to enhance industry layout and growth potential [4]. Group 3: Investor Relations and Communication - The company conducted approximately 175 investor communication events in 2025, engaging over 30 brokerages and 90 institutions, to attract long-term investors and reduce stock price volatility [5]. - Regular public events, such as the annual developer conference, are held to showcase the company's business layout and core technology advantages, enhancing investor understanding and market attention [5]. Group 4: ESG Initiatives - The company initiated ESG-related work in its second year post-IPO, forming a dedicated team to improve its ESG management system, with the first ESG report disclosed alongside the 2025 annual report [5]. - The company has been included in major indices, such as the Shenzhen Component Index and the ChiNext Index, and was recognized as one of the "Top 50 Value Companies" on the ChiNext, reflecting market recognition [5]. Group 5: Future Growth and R&D - Starting in 2026, the company will enter a phase of concentrated R&D results, transitioning from steady growth to rapid growth, with a focus on high-margin products [10][14]. - The product structure will be upgraded to advanced processes, with plans to release new laser radar chips and other high-margin products, which are expected to enhance profitability [10][14]. Group 6: Market Challenges and Strategies - The company is addressing the rising prices of storage chips by implementing cost transfers and optimizing product and customer structures to alleviate cost pressures [8]. - A diversified supply chain and customer base are maintained to mitigate risks associated with geopolitical tensions, ensuring stable operations [11].

Core Viewpoint - The 2026 CCTV Spring Festival Gala serves as a cultural feast and a showcase of the global chip industry, highlighting the advancements in China's chip technology from "usable" to "highly usable" [1][29] Group 1: Robotics Showcase - Four humanoid robots, MagicBot Z1, Galbot G1, Unitree H1, and "Little Bumi," showcased at the gala, demonstrating the capabilities of eight chip companies that support these "tech performers" [3][29] - MagicBot Z1 features 100% domestically produced core chips, with Allwinner Technology providing the main SoC chip for overall control and motion planning [4][5] - Galbot G1 relies on NVIDIA's AGX Orin 64GB chip, achieving 275 TOPS of computing power for AI interactions [6][7] - Unitree H1, the most commercially successful model, utilizes multiple chips including Intel's Core i7 for high-performance motion control and NVIDIA's Jetson Orin NX for edge AI inference [8][9][10][11] - "Little Bumi" targets the consumer market with a price under 10,000 yuan, using Rockchip's RK3588 SoC for approximately 6 TOPS of AI computing power [12][13][14] Group 2: Broadcasting Technology - The gala achieved 8K ultra-high-definition wireless broadcasting, supported by four chip companies that built the computational foundation [15][29] - Huawei's Hi3536DV400 chip enabled real-time compression of 8K video, while the Kunpeng 920S chip supported over 1 billion concurrent live requests [16][17] - AMD's EPYC 9004 series chips provided rendering power for real-time graphics during the event [18] Group 3: Communication Infrastructure - The seamless connection between the main venue and four sub-venues relied on three chip companies for communication technology [19][29] - Huawei's Tian Gang 02 base station chip facilitated low-latency transmission of 8K signals, marking the large-scale application of 5G-A technology [19] - ZTE and China Star Network contributed to the 5G-A network and satellite communication, ensuring stable signal transmission in remote areas [20][21] Group 4: Stage Control and Perception - The precise operation of stage lighting, robotic arms, and AR effects depended on three chip companies providing MCU, power chips, and perception chips [22][29] - GigaDevice's GD32H7 series MCU enabled rapid light switching and robotic movement control [23] - STMicroelectronics' IGBT power chips ensured stable operation of high-power stage equipment [24] - Orbbec provided depth perception chips for the Unitree H1 robot, enhancing spatial awareness and obstacle avoidance [25] Group 5: End-User Experience - The viewing experience for audiences was enhanced by three chip companies ensuring high-quality visuals and security [26][29] - Hisense's X9 image quality chip optimized 8K visuals for the gala [27] - Unisoc's financial-grade security chips safeguarded interactive data during the event [28] - BDU's BD960 positioning chip ensured synchronization of devices across different locations [29]