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道氏技术:与能斯达及芯培森签署战略合作协议 将碳材料应用于人形机器人电子肌肉等关键零部件材料配方中
Mei Ri Jing Ji Xin Wen· 2025-07-29 11:37
Core Viewpoint - The announcement highlights a strategic cooperation agreement between the company, Suzhou Nengsida Electronics Technology, and its affiliate Guangdong Chipenson Technology, focusing on the development and market expansion of key components for humanoid robots, including electronic muscles, electronic skin, and joints [1] Group 1 - The agreement aims to integrate the strengths of the three parties in the research and development of materials required for key components of humanoid robots [1] - The collaboration will involve the application of carbon materials in the formulation of electronic muscles, electronic skin, and joints, enhancing product performance [1] - The agreement is a framework agreement, with specific cooperation matters to be approved and disclosed according to relevant regulations [1]
道氏技术:公司与能斯达及关联方芯培森签署战略合作框架协议 围绕人形机器人电子肌肉等方面展开深度合作
news flash· 2025-07-29 11:27
Core Viewpoint - The company, Daoshi Technology, has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chiperson Technology Co., Ltd. to enhance the development and market expansion of key components for humanoid robots [1] Group 1 - The collaboration will focus on integrating each party's strengths in the research and development of materials needed for electronic muscles, electronic skin, and joints in humanoid robots [1] - The agreement aims to apply carbon materials in the formulation of key component materials for humanoid robots, thereby improving product performance [1] - This framework agreement serves as a guiding document for the long-term cooperation among the three parties, with specific cooperation matters to follow relevant approval procedures and information disclosure obligations [1]