Investment Rating - The report maintains an "Accumulate" rating for the company [1] Core Views - The consumer electronics industry is recovering, leading to steady growth in the company's core business, with a year-on-year revenue increase of 12.41% in H1 2025 [4] - The company has made significant progress in developing new products and expanding its customer base, particularly in the semiconductor thermal management solutions sector [5] - The company is expected to improve its profitability as it expands its domestic and international business [4][5] Summary by Sections Financial Performance - In H1 2025, the company achieved operating revenue of 438 million yuan, with a year-on-year increase of 12.41% [4] - The sales revenue from connector products was approximately 285 million yuan, up 6.78% year-on-year, while the revenue from structural components reached about 105 million yuan, up 13.51% year-on-year [4] Product Development - The company is focusing on the research and development of semiconductor packaging thermal management solutions, aiming to capture new growth opportunities [5] - The semiconductor metal heat sink business is gradually achieving mass shipments, with efforts to expand both domestic and international markets [5] Profit Forecast - The profit forecasts for 2025-2027 have been adjusted to 14 million yuan, 29 million yuan, and 49 million yuan respectively, with corresponding EPS of 0.07, 0.14, and 0.23 yuan [6] - The estimated P/E ratios for the same period are 778, 361, and 217 times [6] Market Comparison - The company's stock performance has shown a significant increase compared to the CSI 300 index over the past year, indicating strong market positioning [3]

【狙击龙虎榜】科技股分化但仍延续主流地位 市场风格或 出现切换关注小微盘股的情绪博弈 【重点公司跟踪】 腾龙股份：今天风格切换的核心应该是腾龙股份，昨天地天板失败今天竞价超预期并再度涨停走出二波，所以今天出现了很多振 幅比较大的个股，比如园林股份、成飞集成、日丰股份等。下午会开板主要是因为上一波炒的是液冷，淳中科技跌停，大元泵业 炸板的情况下腾龙股份炸板太正常了，关键是能回封说明资金认可该股的地位，明天大概率能走出弱转强从而确认二波。 鸿日达：随着电子产品往高性能、高频高速、以及轻薄化方向演进，半导体制程技术不断微缩，芯片的空间被压缩得更窄小，单 位体积需要散发的热量不断提升，电子元件发热密度越来越高，单一使用导入胶等界面材料将热量放出至芯片外部的难度增加, 以及考虑到热量"雄积"将引起的各种对芯片性能的负面影响，半导体金属散热片配合界面材料成为高算力芯片封装的主流方式。 鸿日达半导体金属散热片产品已与多家国内主流的芯片设计公司、封装厂建立业务对接，并已部分完成工厂审核、样品验证导 入。目前公司拥有2条具备量产能力的产线，预计2025年增扩4~7条产线，订单充裕，产能大幅扩张，2025年是公司半导体散热 放量 ...