Investment Rating - The report maintains an "Outperform" rating for the industry [6] Core Insights - Huawei's new products, including Ascend chips and supernodes, are set to lead a new era in computing power, with a clear roadmap for product iterations from 2025 to 2028 [1][14] - The introduction of self-developed HBM technology marks a significant advancement in memory bandwidth, enhancing the efficiency of large model training [3][23] - The supernode architecture is designed to integrate hundreds of processors, reshaping the competitive landscape in AI infrastructure [22][24] Summary by Sections 1. Huawei Computing Power Product Launch - Ascend chips will follow a yearly iteration schedule, with the 910C launching in Q1 2025 and subsequent models (950PR, 950DT, 960, 970) planned through 2028 [14][15] - The Ascend 950 series introduces low-precision data formats and self-developed HBM, enhancing training efficiency for large models [15][16] - The Ascend 960 and 970 are expected to double performance metrics across various parameters, including computing power and memory bandwidth [18][19] 2. Supernode Products - The supernode data center (Atlas 900/950/960 SuperPoD) is designed for large-scale AI training, achieving EFLOPS-level computing power with high bandwidth and low latency [2][27] - The supernode cluster (Atlas 950/960 SuperCluster) enhances network performance and energy efficiency, reaching ZFLOPS-level computing power [2][37] - The enterprise-grade air-cooled supernode server (Atlas 850) is tailored for post-training and multi-scenario inference, supporting flexible scaling [2][38] 3. Related Investment Targets - Key investment targets include hardware partners for Ascend, domestic wafer foundries, and companies involved in copper connections, optical connections, power supplies, PCBs, and cooling solutions [4][46]