后摩智能M50芯片
Search documents
中国算力方案:如何用有限资源做出无限可能?|甲子引力
Sou Hu Cai Jing· 2025-12-12 07:15
场景驱动的创新模式是中国算力产业的独特优势。 2025年12月3日,「甲子光年」在北京万达文华酒店圆满举办"轰然成势,万象归一"2025甲子引力年终盛典。 在算力产业专场圆桌对话中,甲子光年分析师王艺作为主持人,对话后摩智能联合创始人、战略副总裁项之初,海光信息智算产品负责人贺群,蓝耘科技 CTO安江华,新华三集团企业技术部总经理朱哲,围绕《中国算力方案:如何用有限资源做出无限可能?》展开深入探讨。 在当下全球算力竞争从"有没有"转向"够不够、好不好"的深水区,中国算力产业面临先进制程受限、高端GPU供应收紧等独特外部约束。嘉宾们指出,制 程瓶颈、软件生态和系统化工程成为年度高频词,产业正处于从"堆叠算力"到"高效协同"的关键"拐点"。 面对算力不足、互联受限、生态薄弱的"三重困境",产业界分享了如何通过找准应用场景、构建差异化技术路线、以及推动端云协同来实现突破的策略。 从存算一体芯片的商业化落地,到超节点万卡集群的系统工程,从Scale-up与Scale-out的技术抉择,到液冷技术的必然选择,嘉宾们用实战案例揭示了中 国算力方案的创新路径。 对于未来的全球竞争格局,嘉宾们普遍认为,无论是芯片厂商、系统集 ...
对话后摩智能CEO吴强:未来90%的数据处理可能会在端边
Guan Cha Zhe Wang· 2025-07-30 06:41
Core Insights - The World Artificial Intelligence Conference (WAIC 2025) highlighted the development of domestic computing power chips, particularly the M50 chip from Houmo Intelligence, designed for large model inference in AI PCs and smart terminals [1][4] - Houmo Intelligence's CEO, Wu Qiang, emphasized a shift in the focus of large models from training to inference, and from cloud intelligence to edge and endpoint intelligence [1][4] Company Overview - Houmo Intelligence was founded in 2020, focusing on high-performance AI chip development based on integrated storage and computing technology [3] - The M50 chip is seen as a significant achievement for Houmo Intelligence, showcasing their advancements over the past two years [3] Product Specifications - The M50 chip delivers 160 TOPS INT8 and 100 TFLOPS bFP16 physical computing power, with a maximum memory of 48GB and a bandwidth of 153.6 GB/s, while maintaining a typical power consumption of only 10W [4] - The product matrix from Houmo Intelligence covers a range of computing solutions from edge to endpoint, including the LQ50 Duo M.2 card for AI PCs and companion robots [4] Market Positioning - Wu Qiang stated that domestic companies should adopt differentiated technological paths rather than directly copying international giants like NVIDIA and AMD [4] - Houmo Intelligence aims to integrate storage and computing technology with large models to enable offline usability and data privacy [4] Future Developments - The release of the M50 chip is viewed as a starting point, with plans for more chips to address computing power, power consumption, and bandwidth issues in edge and endpoint AI computing [5] - Houmo Intelligence has initiated research on next-generation DRAM-PIM technology, which aims to achieve 1TB/s on-chip bandwidth and triple the energy efficiency of current levels [9] Target Markets - The M50 chip is applicable in various fields, including consumer terminals, smart offices, and smart industries, with a focus on offline processing to mitigate data transmission risks [8] - Potential clients include Lenovo's next-generation AI PC, iFlytek's smart voice devices, and China Mobile's new 5G+AI edge computing equipment [8]