Core Viewpoint - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will focus on the integration and innovation within the thermal management industry, highlighting the latest trends, technologies, and collaborative opportunities across various sectors such as electronics, new materials, and green energy [1][2]. Group 1: Conference Information - The conference will take place from December 3 to 5, 2025, at the Shenzhen International Convention and Exhibition Center, with an expected attendance of over 2000 participants and more than 350 exhibitors [1][2]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More," emphasizing the importance of thermal management in various industries [1][2]. Group 2: Key Activities and Focus Areas - iTherM 2025 will feature over 20 activities, including keynote speeches, roundtable discussions, and case studies, aimed at fostering communication and collaboration in the thermal management field [2][4]. - The conference will particularly emphasize intellectual property, entrepreneurial projects, and innovative technologies that can transition from laboratory to market, promoting cooperation among government, industry, academia, and investment sectors [4]. Group 3: Featured Companies and Innovations - Notable participants include Henkel, which specializes in thermal interface materials and has applications in electric vehicles and power electronics [5]. - Shenzhen Hongfu Cheng New Materials Co., Ltd. focuses on carbon-based thermal materials for high-speed optical communication and intelligent driving chips [6]. - Shanghai Aled Group Co., Ltd. is expanding its high-performance thermal interface materials for data centers and AI applications [7]. - Other companies like tesa, Chengdu Silica Technology Co., Ltd., and Indium Corporation are also contributing innovative thermal management solutions [8][9][13]. Group 4: Conference Agenda - The agenda includes various specialized forums covering topics such as thermal science, functional materials, technology applications, and engineering solutions, addressing current challenges and future opportunities in the thermal management industry [19][20]. - Specific topics will include liquid cooling technology, power device thermal management, and thermal management for electric vehicles and data centers [19].

Core Viewpoint - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will focus on the integration and innovation within the thermal management industry, highlighting the importance of collaboration across various sectors such as electronics, new materials, and green technology [1][2]. Group 1: Conference Information - The conference will take place from December 3 to 5, 2025, at the Shenzhen International Convention and Exhibition Center, with an expected attendance of over 2000 participants and more than 350 exhibitors [1][2]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More," emphasizing the need for synergy in addressing industry challenges and opportunities [1][2]. Group 2: Key Activities and Focus Areas - iTherM 2025 will feature over 20 activities, including keynote speeches, roundtable discussions, and case studies, aimed at fostering communication and collaboration in the thermal management field [2][4]. - The conference will particularly emphasize intellectual property, entrepreneurial projects, and innovative technologies that can transition from laboratories to market applications [4]. Group 3: Featured Companies and Innovations - Notable participants include Henkel, which specializes in thermal interface materials and has applications in electric vehicles and power electronics [5]. - Shenzhen Hongfu Cheng New Materials Co., Ltd. focuses on carbon-based thermal materials for high-speed optical communication and intelligent driving chips [6]. - Shanghai Aled Group Co., Ltd. is expanding its high-performance thermal interface materials for data centers and AI applications [7]. - Other companies like tesa, Chengdu Silica Technology Co., Ltd., and Indium Corporation are also showcasing their advancements in thermal management materials and technologies [8][9][13]. Group 4: Conference Agenda - The agenda includes various specialized forums covering topics such as thermal science, functional materials, technology applications, and engineering solutions [19]. - Specific sessions will address challenges and advancements in data center thermal management, electric vehicle thermal management, and cooling technologies [19]. Group 5: Registration and Participation - Registration fees are set at ¥2200 for regular attendees and ¥1200 for students if paid before October 31, 2025 [21]. - Payment options include bank transfer, Alipay, and WeChat Pay, with specific instructions for invoicing provided [22].

Core Viewpoint - The article discusses the increasing importance of thermal management in electronic components due to rising power densities and heat generation, emphasizing the role of thermal interface materials (TIMs) in enhancing heat dissipation and reliability of integrated circuits [2][3][6]. Group 1: Thermal Management and Its Importance - The performance stability, safety, and lifespan of electronic components are adversely affected by high temperatures, necessitating effective heat dissipation strategies [2]. - Thermal management has emerged as a critical field of study, focusing on safe heat dissipation methods and materials for various electronic devices [2][3]. Group 2: Thermal Interface Materials (TIMs) - TIMs are essential in reducing thermal contact resistance between electronic components and heat sinks, thereby improving heat transfer efficiency [3][9]. - TIMs can be categorized into TIM1 (primary TIM) and TIM2 (secondary TIM), with TIM1 being in direct contact with heat-generating chips and requiring high thermal conductivity and low thermal resistance [9][10]. Group 3: Types and Characteristics of TIMs - Different types of TIMs include thermal grease, thermal pads, phase change materials, thermal gels, thermal adhesive tapes, and thermal potting compounds, each with unique properties and applications [18][22]. - The selection of TIMs is influenced by factors such as thermal conductivity, adhesion, and the ability to fill microscopic surface irregularities [12][19]. Group 4: Market Dynamics and Key Players - The thermal interface materials market is primarily dominated by major companies like Henkel and Parker-Chomerics, which together hold about half of the market share [16]. - Domestic suppliers in China, such as Yantai Debang Technology and Shenzhen Aochuan Technology, are still in the early stages of development, focusing on lower-end products [17]. Group 5: Future Trends and Challenges - The demand for higher thermal conductivity and stability in TIMs is expected to grow, with future developments likely focusing on nanotechnology and advanced filler materials [51][53]. - The industry faces challenges in standardizing testing methods and performance metrics for TIMs, which is crucial for effective selection and application in integrated circuit designs [52].