公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 semiengineering 。 人工智能和高性能计算对逻辑到内存集成的无限需求正在推动超大格式封装的进步，预计未来几年超大格式封装将接近最 大光罩尺寸的 10 倍。 这些组件的最佳开发方案是采用扇出型面板级封装，用面板取代目前的晶圆载体。扇出型封装的成本远低于硅中介层，同 时能够容纳超大尺寸的芯片和高I/O数量。但设备方面仍需进行多项改进，以改善层间对准度，改进芯片/组件在基板上的 倒装芯片贴装，并通过材料和工艺的进步来控制翘曲和芯片偏移。 面 板 级 封 装 已 被 证 明 有 助 于 降 低 智 能 手 表 、 电 源 管 理 IC (PMIC) 和 物 联 网 设 备 等 小 型 设 备 的 生 产 成 本 。 意 法 半 导 体 (STMicroelectronics) 用扇出型重分布层 (RDL) 取代了四方扁平无引线 (QFN) 封装中的引线框架。取而代之的是，它使 用重分布层 (RDL) 进行连接，从而提高了生产效率并降低了生产成本。与通常与高性能计算相关的 2/2µm 前沿重分布层 特性相比，此类设备所需的 RDL 线宽/ ...

Core Viewpoint - The article discusses the shift towards Fan-Out Panel Level Packaging (FOPLP) as a new mainstream for AI chip packaging, with major companies like TSMC, ASE, and others investing in this technology to increase production and reduce costs [1][2]. Group 1: Industry Trends - FOPLP is expected to replace CoWoS as the leading technology for AI chip packaging, with a focus on enhancing the yield of large-sized AI chips and lowering production costs [1]. - TSMC is constructing a pilot production line for FOPLP in Taoyuan, aiming for small-scale trial production by 2027, utilizing a smaller substrate size of 310mm x 310mm compared to previous attempts [1]. Group 2: Company Strategies - ASE has been investing in FOPLP for over a decade, with a $200 million investment in equipment to establish a production line in Kaohsiung, expected to begin trial production by the end of this year [2]. - Powertech Technology has begun small-scale shipments of FOPLP and is validating high-end products for a major client, with packaging costs reaching $25,000 for advanced SoC designs [2]. - Innolux has validated its FOPLP products and plans to ramp up production by 2025, anticipating that the AI boom will drive demand for high-end chips [2]. Group 3: Technological Developments - Innolux's Chip First technology aims to reduce die size and costs while maintaining high I/O density and lower packaging thickness, suitable for various advanced applications [3]. - The company has outlined a roadmap for FOPLP technology, with Chip First technology set for mass production this year, followed by RDL First technology in one to two years, and TGV technology in two to three years [3].

业界最新消息指出，力成已经将旗下FOPLP技术正式定名PiFO，技术类似台积电的CoPoS，透过 不同名称与其他业者做出区隔。事实上，力成在该技术耕耘最久，早在2019年实现量产。力成先 前也强调，目前全球真正具大规模FOPLP生产能力的业者仅有公司一家，并看好未来在AI世代 中，高阶逻辑芯片的异质封装，将采用更多FOPLP解决方案。 台积电部分，尽管对外尚未详细解释在面板级封装的技术细节， 但MoneyDJ早前已率先掌握 ，其 预计在2026年设立首条CoPoS实验线，并将落脚旗下采钰(6789)，而真正大规模生产的量产厂也 已 敲 定 将 落 脚 在 嘉 义 AP7 ， 目 标 2028 年 底 至 2029 年 之 间 实 现 大 规 模 量 产 ， 首 家 客 户 将 由 辉 达 (NVIDIA)拔得头筹。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 MoneyDJ 。 继CoWoS后，FOPLP(扇出型面板级封装)成为近来最受嘱目的先进封装技术。据业界消息，在该 技术上，主要竞争的三大厂在命名上也各有千秋，其中，台积电(2330)取名为CoPoS(Chip-on- Panel-on ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自电子时报 。 尽管SpaceX尚未自行生产芯片，但据报道，该公司正在向扇出型面板级封装（FOPLP）领域扩 张，并计划在德克萨斯州建造一座芯片封装工厂。据《电子时报》报道，马斯克的公司目前大部分 芯片的封装工作都由欧洲公司意法半导体（STMicroelectronics）完成，但该公司也将无法完成的 订单转包给台湾公司群创光电（Innolux）。 然而，作为美国推动半导体独立发展的一部分，SpaceX 也在推动芯片自主生产。该公司去年在德 克萨斯州巴斯特罗普开设了美国最大的印刷电路板 (PCB) 制造工厂，旨在满足 Starlink 的需求。 这至关重要，因为它可以帮助马斯克建立一条垂直整合的卫星生产线，从而降低成本并能够根据需 要 快 速做出 调 整 。 芯 片 封 装 是 SpaceX 合乎逻辑的下一步，尤 其 是 考 虑 到 一 些 FOPLP 工艺与 PCB 制造类似，例如镀铜、激光直接成像和半加成工艺。 除了将芯片制造业务迁回美国本土之外，垂直整合对SpaceX的长期盈利能力也至关重要。其拥有 7600颗卫星的网络，是目前全球最大的在轨卫星网 ...

Core Viewpoint - The ongoing AI boom is driving advancements in semiconductor packaging technologies, particularly Fan-out Panel Level Packaging (FOPLP), which is expected to enhance chip efficiency and market competitiveness [1][2]. Group 1: Advanced Packaging Technologies - Advanced packaging integrates different chips to improve performance, reduce space, and lower power consumption, with TSMC's CoWoS technology being a notable example [1]. - FOPLP technology utilizes square substrates for IC packaging, significantly increasing usable area compared to traditional round wafers, achieving a utilization rate of 95% [1]. - The development of mid-to-high-end semiconductor packaging using 3.5 generation FOPLP glass substrates can provide an area seven times larger than that of a 12-inch glass wafer [1]. Group 2: Industry Collaboration and Development - The Ministry of Economic Affairs, in collaboration with companies like Innolux and the Industrial Technology Research Institute, has launched initiatives to promote FOPLP technology and enhance the value of existing panel production lines [1][2]. - Despite challenges in production technology, such as panel warping and yield issues, ongoing collaboration aims to reduce defects and improve manufacturing processes [2]. Group 3: Market Position and Strategy - Innolux is not competing directly with established semiconductor manufacturers but is leveraging its existing panel production capabilities to transition into advanced packaging [2][3]. - The company plans to utilize its larger glass substrates to meet the increasing demand for IC packaging, with a focus on chip-first solutions to gain market recognition [3]. - The company is committed to continuous improvement in technology and talent development in the FOPLP sector, with expectations for tangible results and shipments this year [3]. Group 4: Future Prospects and Innovations - The company is exploring various advanced technologies, including chip last and redistribution layer (RDL) techniques, while maintaining a focus on validating these technologies rather than solely on mass production [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自ctee 。 布局发酵，明年起扩大营运贡献。 日月光布局扇出型面板级先进封装已超过十年 全球半导体受AI、高性能计算（HPC）、5G与车用电子等新兴应用持续扩大影响，推动先进封装 技术成为重要方向，其中扇出型面板级封装（Fan-Out Panel Level Packaging, FOPLP）具备高 效能、低成本与高良率等优势，正快速崛起，为下一代封装的关键解决方案。 二大封测大厂也对此做好准备。日月光预计今年底前试产，力成已小量出货，明年起逐步扩大营运 贡献。 与传统封装相比，FOPLP最大特色在于单次处理面积扩大，有效提升生产效率并降低单位成本， 随着先进封装愈加复杂与芯片多元整合的需求增加，FOPLP技术的可扩展性与成本效益，满足产 业未来的要求。 供应链业者表示，目前先进封装仍以CoWoS为主，但未来不再是其独大的局面，日月光、力成二 大封装厂，均可望在2026至2027年显著扩大营运贡献。 日月光布局超过十年的扇出型面板级先进封装，去年投入2亿美元采购设备，将在高雄厂建立产 线，预计今年下半年设备进驻，年底前进行试产，明（2026）年开始送样进 ...

Core Viewpoint - The National Integrated Circuit Industry Investment Fund (referred to as "the Big Fund") is accelerating its exit from investments in semiconductor companies, particularly through the reduction of its stake in Tongfu Microelectronics, indicating a shift in investment strategy amid a sluggish semiconductor market [1][2][4]. Group 1: Investment Activities - The Big Fund plans to reduce its holdings in Tongfu Microelectronics by 37.94 million shares, not exceeding 2.5% of the total share capital, with an estimated total value of approximately 9.56 billion yuan [1][2]. - The Big Fund has been reducing its stake in Tongfu Microelectronics for three consecutive quarters, with the latest reduction bringing its ownership down from 11.26% to 8.77% [3][4]. - As of the end of Q1 2024, the Big Fund held over 14% of Tongfu Microelectronics, with the first phase holding 133 million shares (8.77%) and the second phase holding 20.52 million shares (5.49%) [2][4]. Group 2: Financial Performance - In Q1 2024, Tongfu Microelectronics reported revenue of 6.092 billion yuan, a year-on-year increase of 15.34%, while net profit grew by 2.94% to 101 million yuan [5][6]. - Despite the growth in revenue, the net profit growth rate lagged behind revenue growth, and both revenue and net profit saw a quarter-on-quarter decline of 10.41% and 18.94%, respectively [5][6]. - The company aims for a revenue target of 26.5 billion yuan in 2025, representing a year-on-year growth of 10.96% [7]. Group 3: Market Trends - The Big Fund's investment strategy focuses on key segments of the semiconductor industry, including wafer manufacturing, design, packaging, and equipment materials, with a significant portion allocated to wafer manufacturing [2]. - The semiconductor market is expected to benefit from the growing demand for AI applications, particularly in automotive AI chips and smart factory equipment, which will drive the demand for industrial chips [7].