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跨行业视角下的AI产业链:拆解玻纤铜箔树脂PCB的景气阶梯
2025-08-19 14:44
Summary of AI PCB Industry and Related Companies Industry Overview - The AI PCB market is expected to exceed $10 billion by 2026 and reach over $13 billion by 2027, driven primarily by the surge in demand for ASICs and switches, as well as the application of NVIDIA's Rubin series products [1][2][4]. Key Companies and Market Dynamics - **High-Speed Copper Clad Laminate (CCL)**: NVIDIA's cabinets and ASIC solutions primarily utilize the Ma 8 CCL, with the next-generation Ma 9 CCL expected to triple the value per unit in 1.6T switches. Companies like Shengyi Technology and Nanya New Material are poised to expand their market share [1][5]. - **PCB Market Leaders**: Companies such as Shenzhen Circuits, Huitian Technology, and Pegatron hold significant market shares in the ASIC and switch PCB markets. Pegatron stands out for its mSAP technology, while Shengyi Technology and Nanya New Material excel in high-speed CCL [1][6][9]. - **Profit Elasticity**: High-speed CCL companies exhibit substantial profit elasticity. Shengyi Technology's monthly production capacity is 1 million units, with a potential annual revenue of approximately 20 billion RMB, indicating significant profit potential [7]. Price Trends and Future Expectations - **Ordinary CCL Pricing**: Prices for ordinary CCL (FR4) rose by 5% to 10% from March to May but fell in June due to decreased demand. However, a price increase of 7% to 8% was announced by secondary companies in early August, indicating a positive outlook for future price increases due to reduced supply from leading companies shifting capacity to high-speed boards and increased AI PCB demand [8][9]. Technological Developments - **PCB Technology Trends**: The industry is witnessing a shift from 32-layer to 36-layer and above high-multilayer PCBs, with HDI boards transitioning from 5-stage to 7-stage enhancements. The copper foil sector is also recovering, with high-frequency ultra-low profile (HZLP) copper foil being applied in high-end AI servers [3][33]. Electronic Fabric Market - The electronic fabric market is transitioning from traditional fiberglass to quartz fabric, which is essential for high-frequency applications. Companies like Zhongyi Technology are advancing in this space, with plans to achieve an annual production capacity of 20 million meters by 2030 [10][11]. Competitive Landscape - **Key Players**: In the AI PCB sector, Shenzhen Circuits, Huitian Technology, and Pegatron are recommended for their strong HDI technology. Shengyi Technology and Nanya New Material are favored in the high-speed CCL domain due to their established supply chains and production capacities [6][9]. - **Quartz Fabric Development**: Zhongyi Technology is a leading player in quartz electronic fabric, with significant advancements in product capabilities and production capacity [11][12]. Conclusion - The AI PCB industry is on a growth trajectory, driven by technological advancements and increasing demand for high-performance materials. Key players are well-positioned to capitalize on these trends, with a focus on expanding production capacities and enhancing product offerings to meet the evolving market needs [1][2][3][4][5][6][7][8][9][10][11][12][33].