PCB 行业近况更新 20250703 摘要 AI 服务器需求驱动高速覆铜板增长，年增幅达 30%-50%，但部分产品 存在 10%左右的缺货，价格相对平稳。FR-4 覆铜板受益于汽车和消费 电子需求，2025 年价格上涨 10%-15%。 覆铜板选材策略因市场而异：中低端市场重价格，中高端市场重品质。 汽车安全件属中高端应用，非安全件及消费电子属中低端，PC 和手机亦 属中高端。 高速覆铜板技术路径多样，高端型号如马 8 和马 9 采用碳氢化合物树脂。 随着传输速率提升，高速与高频材料在 DF 参数上趋同，电性能损耗差 异缩小。 国内覆铜板厂商战略各异：深裕是综合供应商，建涛专注中低端，华胜 和南亚定位高端精品店，力图提升高频高速产品份额。 全球覆铜板厂商各有侧重：台光拓展 AI 服务器市场，联茂主打高 TG FR4 及高速 CCL，台湾南亚产品线全面，罗杰斯专注于高频市场。 英伟达下一代 Robin NBL576 材料预计 2027 年后应用，目前处于验证 阶段。PTFE 方案大概率应用于正交背板，但良率和加工性是关键考量 因素。 公司二季度订单充足，F2 满负荷运转，得益于中高端订单结构、市场需 求旺盛 ...

Core Viewpoint - The PCB industry is experiencing a technological revolution driven by the demand from AI data centers, electric vehicles, foldable phones, and robotics, leading to a significant increase in PCB demand and domestic manufacturers accelerating high-end capacity expansion [1] Group 1: AI Servers - AI servers require advanced PCBs with increased layers, leading to a cost increase of 3 times compared to traditional boards, with prices for specialized materials being over 5 times that of standard materials [2][4] - Major manufacturers like Shenghong Technology and Huadian Co. have AI server PCB orders booked until Q1 2026, with some companies operating at full capacity 24/7 [4] - The global market for high-layer PCBs (18 layers and above) is expected to grow at a rate of 41.7% by 2025 [4] Group 2: Electric Vehicles - The value of PCBs in electric vehicles has doubled, with a single vehicle's PCB value reaching 1500-2000 RMB, which is twice that of traditional fuel vehicles [5] - Advanced driving systems require 16-layer HDI boards, with prices exceeding 5000 RMB, and domestic market share for these boards has increased from 30% in 2023 to 45% [6] - The global automotive PCB market is projected to reach 9.4 billion USD by 2025, driven by the production of 77GHz radar boards for Tesla's Robotaxi [9] Group 3: Consumer Electronics - The integration level in consumer electronics is increasing, with the mainboard area of the iPhone 16 Pro reduced by 20.7% while accommodating more AI chips, thanks to SLP technology [10] - Companies like Pengding Holdings are investing significantly in expanding high-end HDI production lines, with a 50% increase in capacity at their Huai'an factory [10] - The penetration rate of HDI boards in consumer electronics is expected to exceed 35% due to the rise of AI PCs, with monthly order growth of 20% for AI PC PCBs [10] Group 4: Robotics - The demand for PCBs in the robotics sector is structurally increasing, with companies like Yushu Technology and UBTECH focusing on high-density and high-reliability PCB requirements [11] - The robotics industry is pushing for upgrades in PCB technology, indicating a broad long-term growth potential [11] Group 5: Industry Outlook - The global PCB market is expected to grow at a CAGR of 5.2% from 2024 to 2029, with AI servers, 800G switches, and robotics applications driving a 3-5 percentage point increase in industry gross margins [13] - The PCB industry is currently in a dual-cycle resonance period of "technological upgrades and domestic substitution," with companies like Shenghong Technology and Shengyi Technology poised for breakthroughs in AI computing, automotive electronics, and robotics [13]

基础化工行业 行业研究 | 深度报告 看好高速覆铜板树脂材料的发展机遇 下游需求增长及技术迭代不及预期；项目投产不及预期；高速树脂技术研发进展不及预 期；下游及终端技术迭代风险；核心客户认证及供应风险；假设条件变化影响测算结果 国家/地区 中国 行业 基础化工行业 报告发布日期 2025 年 05 月 09 日 看好（维持） | 倪吉 | 021-63325888*7504 | | --- | --- | | | niji@orientsec.com.cn | | | 执业证书编号：S0860517120003 | | 顾雪莺 | guxueying@orientsec.com.cn | | | 执业证书编号：S0860523080005 | 有关分析师的申明，见本报告最后部分。其他重要信息披露见分析师申明之后部分，或请与您的投资代表联系。并请阅读本证券研究报告最后一页的免责申明。 ⚫ AI 服务器需求爆发带来国内高速树脂材料的国产化机会。 AI 大模型的发展离不开高 性能的硬件支持，也因此延伸出了对高性能新材料的需求。由于 AI 服务器对信号传 输速率要求更高，其覆铜板所用材料需要满足更高的电性能要求，普通 ...

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 写在前面 （文末有惊喜） 一直在路上，所以停下脚步，只在于分享 包括： 新 材料/ 半导体 / 新能源/光伏/显示材料 等 正文 算力升级拉动电子原材料需求增长图解及测算 图表:算力升级拉动电子上游原材料需求增长图解 图表:服务器升级对PPO树脂及对应硅攒粉需求拉动测算 | | | | | 项目 2022E | 2023E | 2024E | | 2025E | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 科技浪潮 | | AI快发展 | | AI服务器(万台) 12 | 15 | | 34 | 54 | | | | 算力要求提高 | PPO树脂(吨) | 194 | 248 | | 537 | 861 | | | | | Low Df球硅(吨) | 117 | 149 | | 322 | 516 | | 终端应用 | AI服务器官求增长 | CPU服务器架构升级 | 数据中心网络架构造代 | | | | | | | | | | PCIE5.0 ...