晶圆级封装产品(Bumping及WLP)

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甬矽电子: 2025年半年度报告
Zheng Quan Zhi Xing· 2025-08-25 16:53
Core Views - The company, Yongxi Electronics (Ningbo) Co., Ltd., focuses on integrated circuit packaging and testing, providing solutions for integrated circuit design companies and generating revenue through packaging and testing service fees [5][6][12] - The company has achieved significant growth in revenue and net profit during the reporting period, driven by increased demand from overseas clients and existing core customers [9][10] Company Overview - Yongxi Electronics was established in November 2017 and has since concentrated on advanced packaging in the integrated circuit testing and packaging sector [8][12] - The company operates in the "Computer, Communication and Other Electronic Equipment Manufacturing" industry, specifically in integrated circuit packaging and testing [6][7] Financial Performance - For the first half of 2025, the company reported revenue of approximately 2.01 billion RMB, a year-on-year increase of 23.37% [4][9] - The net profit attributable to shareholders reached approximately 30.32 million RMB, reflecting a 150.45% increase compared to the same period last year [4][9] - The gross profit margin for the first half of 2025 was 15.61%, with a quarterly gross profit margin of 16.87% in Q2, an increase of 2.68 percentage points [9][10] Industry Context - The global advanced packaging market is projected to grow significantly, with an expected revenue of 56.9 billion USD in 2025, representing a year-on-year growth of 9.6% [8][9] - The advanced packaging sector is becoming a key growth driver in the semiconductor industry, particularly as demand for high-performance computing and AI applications increases [8][9] Research and Development - The company invested 14.22 million RMB in R&D, accounting for 7.07% of its revenue, which is a 51.28% increase year-on-year [10][12] - The company has filed numerous patents and is actively developing advanced packaging technologies, including Fan-out and 2.5D packaging processes [10][12] Competitive Advantages - The company has established strong relationships with major integrated circuit design firms, enhancing its market position and customer satisfaction [12][13] - The company’s focus on high-density advanced packaging technologies has led to a favorable reputation in emerging application areas such as AIoT and automotive electronics [12][13]
甬矽电子:营收增长50.96%,净利扭亏为盈
势银芯链· 2025-04-24 07:50
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 势银研究: 势银产业研究服务 势银数据: 势银数据产品服务 势银咨询: 势银咨询顾问服务 重要会议: 4月29日,2025势银异质异构集成封装产业大会(浙江宁波) 点此报名 添加文末微信,加 先进封装 群 2024 年,随着全球终端消费市场出现回暖,产业链去库存周期基本结束,叠加AI 应用场景不断涌现,集成电路行业整体景气度回升明显。根据 美国半导体行业协会(SIA)数据,2024年全球半导体销售额达到 6,276 亿美元,同比增长 19.1%,首次突破 6,000 亿美元大关。 近日,甬矽电子(宁波)股份有限 公司 发布了 2024年年度报告,报告显示,2024年甬矽电子 实现营业收入 360,917.94 万元,同比增长 50.96%;实现归属于母公司所有者的净利润 6,632.75 万元,较上年同期增长 15,971.54 万元,实现扭亏为盈。 | | | | | 甲V: 九 | | --- | --- | --- | --- | --- | | 主要会计数据 | 2024年 | 2023年 | 本期比上 年同期增 | ...