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新恒汇上市首日涨229.06%,“芯片首富”虞仁荣资本版图再扩张
Cai Jing Wang· 2025-06-20 10:39
Core Viewpoint - New Henghui (301678.SZ), an integrated circuit packaging company, successfully went public on the ChiNext board, with its stock price surging significantly on the first day of trading, reflecting strong investor interest and confidence in the company’s growth potential [1][2]. Company Overview - New Henghui specializes in the research, production, sales, and testing services of chip packaging materials, with a focus on smart card business, which accounted for approximately 69.28% of its main business revenue in recent years [2]. - The company reported revenues of 6.84 billion yuan, 7.67 billion yuan, and 8.42 billion yuan for the years 2022 to 2024, with net profits increasing from 1.1 billion yuan to 1.86 billion yuan during the same period [2]. Financial Performance - In Q1 2025, New Henghui achieved a revenue of 2.41 billion yuan, representing a year-on-year growth of 24.7%, while net profit slightly decreased by 2.26% to 0.51 billion yuan [2]. - The smart card business has been the primary revenue source, but it is projected to decline by 3.6% in 2024 due to market conditions and increased competition [3]. Business Expansion - New Henghui plans to enhance its etched lead frame business, with an IPO fundraising target of 5.19 billion yuan aimed at projects that will increase production capacity significantly [3]. - The company anticipates that the new high-density QFN/DFN packaging materials project could lead to a substantial increase in revenue from the etched lead frame business, potentially surpassing that of the smart card business [3]. Leadership and Ownership - The company is led by Yu Renrong, a prominent figure in the semiconductor industry, who holds 31.94% of the shares, making him the largest shareholder [4]. - The second-largest shareholder, Ren Zhijun, holds 19.31% of the shares and has played a crucial role in the company's strategic restructuring and growth [4]. Debt and Financial Arrangements - Ren Zhijun's acquisition of shares was financed through a loan from Yu Renrong, leading to significant debt obligations, which have raised regulatory inquiries regarding the clarity of share ownership [5]. - Post-IPO, Ren Zhijun plans to use dividends from the company to repay the loan, with arrangements in place for potential share transfers to settle remaining debts [5].
又一封测企业登陆创业板,新恒汇开盘大涨290.62%
Huan Qiu Shi Bao· 2025-06-20 02:17
截至2024年6月30日,发行人拥有已授权专利59项,其中发明专利32项。 根据股权关系架构,虞仁荣、任志军为新恒汇的控股股东及共同实际控制人。虞仁荣直接持有新恒汇31.41%的股份,通过冯源 绘芯间接持有新恒汇0.53%的股份,合计持有新恒汇31.94%股份,为新恒汇的第一大股东,并担任公司董事;任志军直接持有新 恒汇16.21%的股份,通过共青城志林堂间接持有新恒汇3.10%的股份,合计持有新恒汇19.31%的股份,为新恒汇的第二大股东, 并担任公司董事长。 6月20日,芯片封装材料与封装测试服务提供商新恒汇正式登陆创业板,开盘股价一度涨至50元/股,较发行价上涨290.62%,截 至发稿股价仍高达44.52元,较发行价上涨247.11%。 资料显示,新恒汇是一家集芯片封装材料的研发、生产、销售与封装测试服务于一体的集成电路企业,主要业务包括智能卡业 务、蚀刻引线框架业务以及物联网eSIM芯片封测业务。 智能卡业务是发行人的传统核心业务,主要包括智能卡芯片关键封装材料柔性引线框架产品的研发、生产和销售,以及主要依 靠自产的柔性引线框架向客户提供智能卡模块产品或模块封装服务。报告期内,发行人的主要收入和利润 ...
全球智能影像第一股上市,“芯片首富”旗下公司可申购丨打新早知道
6月11日,有一只新股申购,为创业板的新恒汇(301678.SZ);另有一只新股上市,为科创板的影石创 新(688775.SH)。 一只新股申购 根据欧洲智能卡协会发布的行业权威统计或预测数据,2022年和2023年新恒汇柔性引线框架产品的市场 占有率分别为31.63%、32.32%,仅次于法国Linxens,排名第二。 除了能够向客户提供柔性引线框架产品外,新恒汇目前还具有年产约23.42亿颗智能卡模块生产能力 (含控股子公司山铝电子),是国内主要的智能卡模块供应商之一。2022年和2023年智能卡模块产品的 市场占有率分别为20.71%、17.87%。 新恒汇是一家集芯片封装材料的研发、生产、销售与封装测试服务于一体的集成电路企业,其主要业务 包括智能卡业务、蚀刻引线框架业务以及物联网eSIM芯片封测业务。 | 今日申购 | | | | | --- | --- | --- | --- | | 301678.SZ 新恒汇 | | | | | 发行价(元/股) | 机构报价(元/股) | 市值(亿元) | 所属行业 | | 12.80 | 19.98 | 23.00 | 集成电路制造业 | | 发行市盈率 | ...