·第七届海南岛国际电影节12月3日至12月9日在三亚举行。 ·2025国际电子电路（深圳）展览会12月3日至5日举办。 ·理想AI眼镜Livis发布会12月3日举行。 ·天普股份公告称，公司股票交易情况核查完成。控制权变更仍存审批不确定。12月3日复牌。 今日提示 ·2026年度全国煤炭交易会12月3日至5日召开。 ·第22届世界风能大会12月3日至5日举办。 ·*ST正平公告称，公司股票交易情况核查完成，12月3日复牌。2024年非标审计意见未消除，2025年若 仍未消除将被强退，且存多重风险。 上证精选 ·近日，国家发展改革委、国家数据局、教育部、科技部、中共中央组织部联合印发《关于加强数据要 素学科专业建设和数字人才队伍建设的意见》，旨在加强数据要素学科专业建设和数字人才队伍建设， 建立数据领域科技发展、国家战略需求牵引的学科专业设置调整机制和人才培养模式，激活数据要素赋 能新质生产力的创新引擎作用，促进数据领域教育链、人才链与产业链、创新链融合发展。 ·上交所官 网发布的新开户数据显示，今年11月上交所A股新开户238.14万户，较10月的230.99万户环比上升 3.10%，较去年11月的269.8 ...

Group 1 - The company has been asked by investors about the availability of active copper connection products and the differences between these and its copper connection offerings [2] - The company responded that its high-speed communication wires are bare wire products, which can be widely applied in AEC (Active Copper Cables) and DAC (Passive Copper Cables) [2]

Summary of the Call Transcript on the PCB Industry Industry Overview - The PCB industry, particularly in the context of computing power, is experiencing significant growth driven by overseas markets, especially in PCB optical modules and assembly, with notable performance realization and clear incremental opportunities [1][2] - The industry is currently in a rapid development phase, largely propelled by AI applications, with expectations that this cycle will be longer than the one in 2016, spanning this year and next [2] Key Trends and Developments - The transition from M4 to M9 transmission rates has raised raw material requirements, leading to increased prices and profit margins, with many PCB companies reaching a valuation of over 100 billion [1][4] - Domestic companies are gaining more opportunities as orders from local computing power PCB manufacturers like Shenghong, Sanyou Electronics, and Shennan increase, indicating a trend towards the localization of upstream materials [1][5] - The basic structure of PCB boards includes outer protective layers, copper lines, and substrates, with a trend towards increasing layers and decreasing hole sizes to meet the demands of chip-to-external circuit connections [1][8] Technical Insights - HDI technology enhances design flexibility and allows for denser, miniaturized layouts, making it suitable for high-speed applications [10] - Current optical modules can achieve transmission rates of up to 800Gbps and even 1.6Tbps, with M9 materials meeting single-channel requirements of 224Gbps [3][12] - High-end PCB materials face multiple barriers to production, including complex processes, formula improvements, and certification cycles [18] Market Dynamics - The domestic high-end PCB market share remains low, primarily due to historical preferences for Taiwanese companies by US clients like Cisco and Google; however, domestic firms are gradually gaining traction [16] - The price range for high-end PCB materials varies significantly, with standard PCBs costing a few hundred yuan per square meter, while high-end server PCBs can reach up to 20,000 yuan per square meter [21] Cost Structure and Implications - In server systems, PCBs account for approximately 2% of total costs, with high-end materials constituting about half of the overall cost during mass production [27] - The cost of PCB materials can be estimated based on layers and material properties, with significant price differences between standard and high-end materials [22] Future Outlook - The PCB industry is expected to continue expanding, particularly in high-end applications driven by AI server demand, with the market potentially reaching a scale of hundreds of billions [25][26] - The trend towards domestic production of materials is seen as a critical factor for future research and investment opportunities in the A-share market [5][25] Additional Insights - The integration of different types of PCB materials can optimize production efficiency and cost control, indicating a non-exclusive relationship among various materials [17] - The development of orthogonal backplane technology is anticipated to enhance performance in switch networks, with potential applications in future architectures [20] This summary encapsulates the key points from the call transcript regarding the PCB industry, highlighting its current status, technological advancements, market dynamics, and future prospects.