Core Insights - Shenzhen Cheng Tian Wei Ye Technology Co., Ltd. has established a joint venture, SuperX Cooltech, with SuperX AI Technology Limited to focus on AI server and high-performance computing liquid cooling systems [1][2] - The partnership signifies a strategic move in Cheng Tian Wei Ye's global strategy for digital and energy thermal management [1][2] Group 1: Liquid Cooling Technology and Market Position - Liquid cooling technology is becoming essential for AI data centers due to the limitations of traditional air cooling methods, especially with the rise of high-power GPUs [2] - The joint venture aims to provide efficient and reliable liquid cooling solutions for the global market, excluding mainland China and Hong Kong [1][2] - Cheng Tian Wei Ye is leveraging its expertise in semiconductor materials and thermal management to create a comprehensive liquid cooling product line [2][5] Group 2: Core Product System of the Joint Venture - The joint venture will develop a core product system that includes high-strength nano-injection liquid cooling plates, microchannel liquid cooling plates (MLCP), liquid cooling modules, and CDU systems [3][4] - The MLCP is designed for high-density cooling solutions, supporting precise temperature control and thermal load balancing [3][4] - The integrated solutions aim to achieve system-level energy efficiency with a PUE of less than 1.1 [3] Group 3: Key Technological Innovations - The joint venture will utilize advanced technologies such as nano-injection molding, material reduction techniques, fluid optimization designs, and intelligent control systems [4] - These innovations are expected to provide a competitive edge in the liquid cooling market [4] Group 4: Global Market Outlook - The global liquid cooling systems market is projected to grow significantly, driven by increasing power density and efficiency demands in data centers [5] - The MLCP technology is anticipated to enter mass production by mid-2026, with strong interest from major AI chip customers [5] - The joint venture's product offerings are positioned to cover the entire thermal management chain from chip to cabinet, enhancing its market potential [5]