Core Viewpoint - Shenzhen ChengTian WeiYe Technology Co., Ltd. has established a joint venture, SUPERX COOLTECH PTE. LTD., with SuperX AI Technology Limited to focus on AI server and high-performance computing liquid cooling systems, marking a significant step in the company's global strategy for digital and energy thermal management [1][2]. Group 1: Liquid Cooling Technology and Market Trends - Liquid cooling technology is becoming essential for AI data centers as traditional air cooling fails to meet the high thermal management demands of next-generation GPU architectures, which can exceed 100kW per cabinet [1]. - The global data center liquid cooling market is expected to grow significantly, with forecasts indicating it could reach several billion dollars in the coming years, driven by increasing power density and efficiency pressures in data centers [4]. - The joint venture's focus on MLCP (Microchannel Liquid Cooling Plate) technology is anticipated to enhance GPU performance and support high thermal loads, with production expected to start in the second half of 2026 [4]. Group 2: Joint Venture Product Development - The joint venture will develop a core product system that includes high-strength nano-injection liquid cooling plates, MLCP for AI servers, liquid cooling modules, CDU systems, and integrated cabinet liquid cooling solutions [3]. - The joint venture aims to leverage advanced technologies such as nano-injection molding, material reduction techniques, and fluid optimization to create differentiated technical advantages in the market [3][4]. - SuperX Cooltech will serve as a crucial link between Chinese manufacturing capabilities and international market demands, focusing on technology validation, joint development, and system delivery for international clients [2].

Core Insights - Shenzhen Cheng Tian Wei Ye Technology Co., Ltd. has established a joint venture, SuperX Cooltech, with SuperX AI Technology Limited to focus on AI server and high-performance computing liquid cooling systems [1][2] - The partnership signifies a strategic move in Cheng Tian Wei Ye's global strategy for digital and energy thermal management [1][2] Group 1: Liquid Cooling Technology and Market Position - Liquid cooling technology is becoming essential for AI data centers due to the limitations of traditional air cooling methods, especially with the rise of high-power GPUs [2] - The joint venture aims to provide efficient and reliable liquid cooling solutions for the global market, excluding mainland China and Hong Kong [1][2] - Cheng Tian Wei Ye is leveraging its expertise in semiconductor materials and thermal management to create a comprehensive liquid cooling product line [2][5] Group 2: Core Product System of the Joint Venture - The joint venture will develop a core product system that includes high-strength nano-injection liquid cooling plates, microchannel liquid cooling plates (MLCP), liquid cooling modules, and CDU systems [3][4] - The MLCP is designed for high-density cooling solutions, supporting precise temperature control and thermal load balancing [3][4] - The integrated solutions aim to achieve system-level energy efficiency with a PUE of less than 1.1 [3] Group 3: Key Technological Innovations - The joint venture will utilize advanced technologies such as nano-injection molding, material reduction techniques, fluid optimization designs, and intelligent control systems [4] - These innovations are expected to provide a competitive edge in the liquid cooling market [4] Group 4: Global Market Outlook - The global liquid cooling systems market is projected to grow significantly, driven by increasing power density and efficiency demands in data centers [5] - The MLCP technology is anticipated to enter mass production by mid-2026, with strong interest from major AI chip customers [5] - The joint venture's product offerings are positioned to cover the entire thermal management chain from chip to cabinet, enhancing its market potential [5]