根据《评估报告》，截至2025年6月30日(评估基准日)，深蓝股份股东全部权益的市场评估值为1.93亿 元。经交易双方协商一致，以全部股权1.9亿元的估值，即每股转让价格为4.05元。 上市公司拟通过协议转让方式以现金受让洪旭璇等20名目标公司股东合计持有的深蓝股份2031.35万 股，占目标公司股本总的比例为43.22%，合计交易金额8226.97万元，相关交易费用预计约30万元。 11月27日晚间银轮股份（002126）公告，为加速数字与能源热管理业务发展，整合控制器、驱动器集成 电路硬件及其相关嵌入式系统软件等产品的底层技术，提升公司数字能源系统模块的核心竞争力，公司 拟以自有资金通过股权收购及增资方式持有深圳市深蓝电子股份有限公司(下称"深蓝股份")55%以上股 权。本次收购完成后，公司将成为深蓝股份控股股东，深蓝股份将纳入公司合并报表范围。 深蓝股份主要致力于研发、生产及销售暖通空调控制器和变频驱动器等高科技电子设备，主要产品为控 制器、驱动器集成电路硬件及其相关嵌入式系统软件。该公司2016年3月16日在全国中小企业股份转让 系统挂牌。 2024年及2025年1月至6月，深蓝股份分别实现营业收入7 ...

Core Insights - Shenzhen Cheng Tian Wei Ye Technology Co., Ltd. has established a joint venture, SuperX Cooltech, with SuperX AI Technology Limited to focus on AI server and high-performance computing liquid cooling systems [1][2] - The partnership signifies a strategic move in Cheng Tian Wei Ye's global strategy for digital and energy thermal management [1][2] Group 1: Liquid Cooling Technology and Market Position - Liquid cooling technology is becoming essential for AI data centers due to the limitations of traditional air cooling methods, especially with the rise of high-power GPUs [2] - The joint venture aims to provide efficient and reliable liquid cooling solutions for the global market, excluding mainland China and Hong Kong [1][2] - Cheng Tian Wei Ye is leveraging its expertise in semiconductor materials and thermal management to create a comprehensive liquid cooling product line [2][5] Group 2: Core Product System of the Joint Venture - The joint venture will develop a core product system that includes high-strength nano-injection liquid cooling plates, microchannel liquid cooling plates (MLCP), liquid cooling modules, and CDU systems [3][4] - The MLCP is designed for high-density cooling solutions, supporting precise temperature control and thermal load balancing [3][4] - The integrated solutions aim to achieve system-level energy efficiency with a PUE of less than 1.1 [3] Group 3: Key Technological Innovations - The joint venture will utilize advanced technologies such as nano-injection molding, material reduction techniques, fluid optimization designs, and intelligent control systems [4] - These innovations are expected to provide a competitive edge in the liquid cooling market [4] Group 4: Global Market Outlook - The global liquid cooling systems market is projected to grow significantly, driven by increasing power density and efficiency demands in data centers [5] - The MLCP technology is anticipated to enter mass production by mid-2026, with strong interest from major AI chip customers [5] - The joint venture's product offerings are positioned to cover the entire thermal management chain from chip to cabinet, enhancing its market potential [5]

Group 1: Business Growth and Innovation - The company is focusing on semiconductor packaging materials, specifically lead frames and copper pin heat sink substrates, to enhance material performance and reduce packaging costs, targeting applications in power devices and third-generation semiconductors [1][2][15]. - The development of modular and customized liquid cooling solutions is underway, aimed at AI servers and high-density data centers, currently in the R&D verification stage [1][2][6]. - The company is expanding its smart security business, with ongoing R&D and testing for products like smart security checks and protective barriers [1][2][15]. Group 2: Financial Performance - In 2024, the company reported a revenue of 360.19 million CNY, a decrease of 8.65% year-on-year, while net profit attributable to shareholders increased by 29.77% to 11.57 million CNY [3][5][11]. - Revenue from lead frame products surged by 467.80% in 2024, with a further increase of 236.78% in Q1 2025 [2][4][11]. - The smart card business, a core revenue source, saw a decline of 12.62% in revenue, while semiconductor product revenue dropped by 91.99% [3][4][11]. Group 3: Market Trends and Risks - The lead frame market is experiencing robust growth, driven by demand in electric vehicle control systems and high-performance power modules [2][3][4]. - The company acknowledges risks in new product development, including technical, market, and application validation risks, urging investors to make informed decisions [2][6][15]. - The shift towards high-end specifications in lead frames is evident, with increasing customer demands for high thermal conductivity and low thermal resistance [2][3][4]. Group 4: Strategic Planning and Future Directions - The company aims to diversify its revenue streams by investing in semiconductor packaging materials, digital and energy thermal management, and innovative applications for super SIM cards [1][2][15][20]. - Future growth points are identified in the semiconductor packaging sector, with a focus on self-designed and mass-produced products covering various power module needs [1][2][15]. - The company plans to maintain a balance between traditional smart card business and emerging sectors, ensuring stable growth while fostering new business opportunities [1][15][20].

Core Viewpoint - The company aims to become a global leader in providing comprehensive solutions for smart cards, dedicated chips, semiconductor packaging materials, AIOT products, and digital and energy thermal management products, driven by technological innovation and system integration [4][10]. Group 1: Company Overview - The company is recognized as a high-tech enterprise engaged in the research, production, sales, and service of smart cards and dedicated chips, with a comprehensive service model that includes software development, engineering design, system integration, and manufacturing [10][11]. - The company has established long-term partnerships with globally recognized smart card system companies, leveraging its advantages in quality, service, and production capacity [11]. Group 2: Business Segments - **Smart Card Business**: The company offers telecom SIM cards, financial IC cards, and ID cards, along with dedicated chips for smart cards, covering key application areas such as mobile communication and financial payment [5][10]. - **Semiconductor Manufacturing**: The company has developed a modular service system for dedicated chips, providing flexible service options to meet diverse application needs [6]. - **Digital and Energy Thermal Management**: The company is developing modular and customized thermal management solutions for high-performance applications, focusing on AI servers and digital energy sectors [7][10]. Group 3: Financial and Operational Highlights - The company has a robust patent portfolio with 181 patents, including 4 invention patents and 47 software copyrights, reflecting its commitment to innovation [10]. - The company plans to use up to 250 million RMB of idle funds for cash management to enhance capital efficiency and generate returns for shareholders [53][61]. Group 4: Recent Developments - The company has approved a share buyback plan, intending to repurchase shares worth between 15 million and 30 million RMB to support employee stock ownership plans [14]. - The company is set to hold its annual performance briefing on April 29, 2025, to engage with investors and discuss its operational strategies [22][25].