Group 1: Business Growth and Innovation - The company is focusing on semiconductor packaging materials, specifically lead frames and copper pin heat sink substrates, to enhance material performance and reduce packaging costs, targeting applications in power devices and third-generation semiconductors [1][2][15]. - The development of modular and customized liquid cooling solutions is underway, aimed at AI servers and high-density data centers, currently in the R&D verification stage [1][2][6]. - The company is expanding its smart security business, with ongoing R&D and testing for products like smart security checks and protective barriers [1][2][15]. Group 2: Financial Performance - In 2024, the company reported a revenue of 360.19 million CNY, a decrease of 8.65% year-on-year, while net profit attributable to shareholders increased by 29.77% to 11.57 million CNY [3][5][11]. - Revenue from lead frame products surged by 467.80% in 2024, with a further increase of 236.78% in Q1 2025 [2][4][11]. - The smart card business, a core revenue source, saw a decline of 12.62% in revenue, while semiconductor product revenue dropped by 91.99% [3][4][11]. Group 3: Market Trends and Risks - The lead frame market is experiencing robust growth, driven by demand in electric vehicle control systems and high-performance power modules [2][3][4]. - The company acknowledges risks in new product development, including technical, market, and application validation risks, urging investors to make informed decisions [2][6][15]. - The shift towards high-end specifications in lead frames is evident, with increasing customer demands for high thermal conductivity and low thermal resistance [2][3][4]. Group 4: Strategic Planning and Future Directions - The company aims to diversify its revenue streams by investing in semiconductor packaging materials, digital and energy thermal management, and innovative applications for super SIM cards [1][2][15][20]. - Future growth points are identified in the semiconductor packaging sector, with a focus on self-designed and mass-produced products covering various power module needs [1][2][15]. - The company plans to maintain a balance between traditional smart card business and emerging sectors, ensuring stable growth while fostering new business opportunities [1][15][20].

Core Viewpoint - The company aims to become a global leader in providing comprehensive solutions for smart cards, dedicated chips, semiconductor packaging materials, AIOT products, and digital and energy thermal management products, driven by technological innovation and system integration [4][10]. Group 1: Company Overview - The company is recognized as a high-tech enterprise engaged in the research, production, sales, and service of smart cards and dedicated chips, with a comprehensive service model that includes software development, engineering design, system integration, and manufacturing [10][11]. - The company has established long-term partnerships with globally recognized smart card system companies, leveraging its advantages in quality, service, and production capacity [11]. Group 2: Business Segments - **Smart Card Business**: The company offers telecom SIM cards, financial IC cards, and ID cards, along with dedicated chips for smart cards, covering key application areas such as mobile communication and financial payment [5][10]. - **Semiconductor Manufacturing**: The company has developed a modular service system for dedicated chips, providing flexible service options to meet diverse application needs [6]. - **Digital and Energy Thermal Management**: The company is developing modular and customized thermal management solutions for high-performance applications, focusing on AI servers and digital energy sectors [7][10]. Group 3: Financial and Operational Highlights - The company has a robust patent portfolio with 181 patents, including 4 invention patents and 47 software copyrights, reflecting its commitment to innovation [10]. - The company plans to use up to 250 million RMB of idle funds for cash management to enhance capital efficiency and generate returns for shareholders [53][61]. Group 4: Recent Developments - The company has approved a share buyback plan, intending to repurchase shares worth between 15 million and 30 million RMB to support employee stock ownership plans [14]. - The company is set to hold its annual performance briefing on April 29, 2025, to engage with investors and discuss its operational strategies [22][25].