Core Viewpoint - The company plans to acquire over 55% of Shenzhen Deep Blue Electronics Co., Ltd. to enhance its digital and energy thermal management business, integrating core technologies in controllers and drive integrated circuit hardware [1][2]. Group 1: Acquisition Details - The company will acquire 20 shareholders' total of 20,313,500 shares of Deep Blue, representing 43.22% of the total equity, for a total transaction amount of approximately 82.27 million yuan [2]. - Following the share transfer, the company intends to invest an additional 50 million yuan in Deep Blue through a private placement, pending approval from relevant authorities [2]. - The total investment for acquiring over 55% of Deep Blue is estimated at around 133 million yuan, funded by the company's own or self-raised funds [2]. Group 2: Financial Performance of Deep Blue - Deep Blue reported revenues of 71.52 million yuan and 30.86 million yuan for the years 2024 and the first half of 2025, respectively [1]. - The net profits for the same periods were 17.76 million yuan and 7.35 million yuan [1]. Group 3: Strategic Objectives - The acquisition aims to enhance the company's capabilities in system modules and electromechanical manufacturing, focusing on core technologies in electric control, software, and algorithms [2]. - The integration of technologies from both companies is expected to reduce production costs and strengthen control over the thermal management industry chain [2]. - The acquisition will leverage Deep Blue's customer resources to enhance business collaboration and improve service capabilities [3].

Core Insights - Shenzhen Cheng Tian Wei Ye Technology Co., Ltd. has established a joint venture, SuperX Cooltech, with SuperX AI Technology Limited to focus on AI server and high-performance computing liquid cooling systems [1][2] - The partnership signifies a strategic move in Cheng Tian Wei Ye's global strategy for digital and energy thermal management [1][2] Group 1: Liquid Cooling Technology and Market Position - Liquid cooling technology is becoming essential for AI data centers due to the limitations of traditional air cooling methods, especially with the rise of high-power GPUs [2] - The joint venture aims to provide efficient and reliable liquid cooling solutions for the global market, excluding mainland China and Hong Kong [1][2] - Cheng Tian Wei Ye is leveraging its expertise in semiconductor materials and thermal management to create a comprehensive liquid cooling product line [2][5] Group 2: Core Product System of the Joint Venture - The joint venture will develop a core product system that includes high-strength nano-injection liquid cooling plates, microchannel liquid cooling plates (MLCP), liquid cooling modules, and CDU systems [3][4] - The MLCP is designed for high-density cooling solutions, supporting precise temperature control and thermal load balancing [3][4] - The integrated solutions aim to achieve system-level energy efficiency with a PUE of less than 1.1 [3] Group 3: Key Technological Innovations - The joint venture will utilize advanced technologies such as nano-injection molding, material reduction techniques, fluid optimization designs, and intelligent control systems [4] - These innovations are expected to provide a competitive edge in the liquid cooling market [4] Group 4: Global Market Outlook - The global liquid cooling systems market is projected to grow significantly, driven by increasing power density and efficiency demands in data centers [5] - The MLCP technology is anticipated to enter mass production by mid-2026, with strong interest from major AI chip customers [5] - The joint venture's product offerings are positioned to cover the entire thermal management chain from chip to cabinet, enhancing its market potential [5]

Group 1: Business Growth and Innovation - The company is focusing on semiconductor packaging materials, specifically lead frames and copper pin heat sink substrates, to enhance material performance and reduce packaging costs, targeting applications in power devices and third-generation semiconductors [1][2][15]. - The development of modular and customized liquid cooling solutions is underway, aimed at AI servers and high-density data centers, currently in the R&D verification stage [1][2][6]. - The company is expanding its smart security business, with ongoing R&D and testing for products like smart security checks and protective barriers [1][2][15]. Group 2: Financial Performance - In 2024, the company reported a revenue of 360.19 million CNY, a decrease of 8.65% year-on-year, while net profit attributable to shareholders increased by 29.77% to 11.57 million CNY [3][5][11]. - Revenue from lead frame products surged by 467.80% in 2024, with a further increase of 236.78% in Q1 2025 [2][4][11]. - The smart card business, a core revenue source, saw a decline of 12.62% in revenue, while semiconductor product revenue dropped by 91.99% [3][4][11]. Group 3: Market Trends and Risks - The lead frame market is experiencing robust growth, driven by demand in electric vehicle control systems and high-performance power modules [2][3][4]. - The company acknowledges risks in new product development, including technical, market, and application validation risks, urging investors to make informed decisions [2][6][15]. - The shift towards high-end specifications in lead frames is evident, with increasing customer demands for high thermal conductivity and low thermal resistance [2][3][4]. Group 4: Strategic Planning and Future Directions - The company aims to diversify its revenue streams by investing in semiconductor packaging materials, digital and energy thermal management, and innovative applications for super SIM cards [1][2][15][20]. - Future growth points are identified in the semiconductor packaging sector, with a focus on self-designed and mass-produced products covering various power module needs [1][2][15]. - The company plans to maintain a balance between traditional smart card business and emerging sectors, ensuring stable growth while fostering new business opportunities [1][15][20].

Core Viewpoint - The company aims to become a global leader in providing comprehensive solutions for smart cards, dedicated chips, semiconductor packaging materials, AIOT products, and digital and energy thermal management products, driven by technological innovation and system integration [4][10]. Group 1: Company Overview - The company is recognized as a high-tech enterprise engaged in the research, production, sales, and service of smart cards and dedicated chips, with a comprehensive service model that includes software development, engineering design, system integration, and manufacturing [10][11]. - The company has established long-term partnerships with globally recognized smart card system companies, leveraging its advantages in quality, service, and production capacity [11]. Group 2: Business Segments - **Smart Card Business**: The company offers telecom SIM cards, financial IC cards, and ID cards, along with dedicated chips for smart cards, covering key application areas such as mobile communication and financial payment [5][10]. - **Semiconductor Manufacturing**: The company has developed a modular service system for dedicated chips, providing flexible service options to meet diverse application needs [6]. - **Digital and Energy Thermal Management**: The company is developing modular and customized thermal management solutions for high-performance applications, focusing on AI servers and digital energy sectors [7][10]. Group 3: Financial and Operational Highlights - The company has a robust patent portfolio with 181 patents, including 4 invention patents and 47 software copyrights, reflecting its commitment to innovation [10]. - The company plans to use up to 250 million RMB of idle funds for cash management to enhance capital efficiency and generate returns for shareholders [53][61]. Group 4: Recent Developments - The company has approved a share buyback plan, intending to repurchase shares worth between 15 million and 30 million RMB to support employee stock ownership plans [14]. - The company is set to hold its annual performance briefing on April 29, 2025, to engage with investors and discuss its operational strategies [22][25].