在产品创新方面，该公司持续推进技术迭代，已在高性能相变化导热材料、液态金属热界面材料、芯片 级底部填充胶（Underfill）、AD胶、DAF/CDAF膜、SSD用双组份高导热凝胶、Lipo工艺新型显示封装 材料及驱动电机用新型磁性粘接材料等领域取得实质性突破。 德邦科技方面表示，依托前期积累的核心客户资源与关键技术优势，本公司持续加大在技术研发、产能 建设、市场拓展及管理优化等方面的投入，同时通过投资并购等资本运作，不断培育新的收入增长点， 推动整体营收实现较快增长。 （文章来源：证券日报） 本报讯 2月27日晚，烟台德邦科技股份有限公司（以下简称"德邦科技"）发布2025年度业绩快报。公告 显示，该公司2025年全年实现营业收入15.47亿元，同比增长32.61%；归属于母公司所有者的净利润为 1.05亿元，同比增长8.03%；扣除非经常性损益的净利润为9733.22万元，同比增长16.35%。 根据公告，德邦科技2025年度业绩增长主要受益于集成电路、智能终端等核心领域需求持续复苏，新能 源、高端装备板块亦保持良好增长态势。同时，人工智能、高性能计算、端侧AI终端、商业航天等新 兴应用场景不断涌现，为先 ...

2月27日，德邦科技（688035.SH）发布2025年度业绩快报。报告显示，公司全年实现营业收入 154,723.09万元，同比增长32.61%；实现归属于母公司所有者的净利润10,525.57万元，同比增长 8.03%；扣除非经常性损益后的净利润为9,733.22万元，同比增长16.35%，主营业务盈利能力持续增 强。 资产规模方面，报告期末公司总资产达到344,326.10万元，较期初增长15.95%；归属于母公司的所有者 权益为232,182.86万元，较期初增长1.21%，财务状况稳健向好。 德邦科技指出，报告期内，受部分区域国际局势紧张影响，关键材料进口采购周期延长，供应链稳定性 面临挑战，进一步凸显了供应链自主可控的紧迫性。下游客户对高可靠性国产材料的验证意愿和导入节 奏显著加快，为先进封装材料行业发展带来重要的战略机遇。 与此同时，公司核心服务的集成电路、智能终端领域整体上呈持续复苏、需求旺盛的发展态势，新能 源、高端装备领域亦保持较好的增长。人工智能、高性能计算（HPC）、端侧AI终端、商业航天等新技 术、新应用场景不断涌现，为行业开辟全新发展空间。 报告期内，德邦科技在保持原有主力产品稳定 ...

Core Insights - The iTherM 2025 conference will focus on the development of thermal management technologies in various industries, including electronics, new materials, and green energy, aiming to explore the latest trends and innovations in the thermal management sector [2][3]. Event Details - The conference is scheduled for December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center, China [3][59]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More" [3]. Key Presentations - **Liquid Metal Chip Cooling Technology**: Researcher Deng Zhongshan will discuss advancements in liquid metal thermal management technologies for chip cooling applications, including liquid metal thermal interface materials and their prospects in 5G and consumer electronics [3][6]. - **High-Performance Thermal Management Materials**: Researcher Yu Hengda from Henkel will present innovative solutions for high thermal conductivity materials, addressing challenges in assembly efficiency and reliability [4]. - **Multi-Functional Thermal Interface Materials**: Researcher Zhu Guimei will report on the latest developments in thermal interface materials using liquid metals [5][6]. - **Electronic Packaging Thermal Management Composites**: Researcher Lin Zhengde will focus on solutions for thermal transport systems in electronic packaging, overcoming challenges in material arrangement and interface heat transfer [7][8]. - **Series of Thermal Interface Materials for Various Scenarios**: Researcher Liu Bin will discuss the development of thermal interface materials tailored for AI chips, robotics, and flexible devices [9][10]. Research Focus Areas - **Micro-Nano Thermal Conductivity Mechanisms**: Researcher Zhang Xudong will explore the thermal conductivity mechanisms and applications of liquid metal thermal interface materials [11]. - **Self-Healing Flexible Thermal Interface Materials**: Researcher Xu Cui will present a new type of thermal interface material that can self-repair and maintain long-term reliability [13][14]. - **Thermal Resistance and Bonding Studies**: Researcher Zeng Xiaoliang will discuss the relationship between bonding strength and thermal resistance in thermal interface materials [15][16]. - **High-Performance Metal Thermal Interface Materials**: Researcher Pan Lin will focus on advancements in metal thermal interface materials and their applications in high-performance computing [21][22]. Industry Challenges - The conference will address challenges in thermal management materials for ICT products, particularly in high reliability and performance requirements due to increasing device integration [23][24]. - Researcher Yang Jie will discuss the enhancement of interfacial heat transfer in polymer-based composite materials [25][26]. Conclusion - The iTherM 2025 conference aims to create a professional communication platform for the thermal management industry, facilitating discussions on new technologies, materials, and trends [2][3].