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2025-2031年全球与中国激光直接成像系统(LDI)行业调查与企业投资规划建议研究报告-中金企信发布
Sou Hu Cai Jing· 2025-07-04 01:55
Core Viewpoint - The report highlights the transformative impact of Laser Direct Imaging (LDI) technology on the PCB industry, driven by the demand for high-precision and efficient manufacturing processes, particularly in the context of 5G technology and emerging applications like MiniLED and electric vehicles [2][3][4]. Group 1: Technology Characteristics - LDI technology utilizes UV lasers (typically at 355nm wavelength) for direct imaging on PCB surfaces, significantly improving imaging precision, production efficiency, and process compatibility compared to traditional exposure methods [2]. - The imaging precision of LDI can achieve a line width resolution of less than 5μm, with examples like Orbotech's Nuvogo series achieving ±2.5μm accuracy, a 40% improvement over traditional methods [2]. - Production efficiency is enhanced with parallel scanning modes, increasing capacity to 20-30 square meters per hour, reducing order delivery times from 7 days to 4 days for leading PCB manufacturers [2]. Group 2: Market Growth Drivers - The demand for high-frequency and high-speed PCBs driven by 5G communication technology is a core growth driver for LDI penetration, with LDI technology expected to exceed 60% penetration in the high-end PCB market by 2024 [3][4]. - New application scenarios such as MiniLED and electric vehicles are emerging, with companies like BOE adopting LDI for MiniLED backlight PCBs, improving backlight uniformity by 30% [3]. - The Chinese government's "14th Five-Year" plan emphasizes LDI technology, with significant investments and subsidies promoting domestic LDI equipment adoption, leading to a projected 28% penetration in the Yangtze River Delta by 2024 [4]. Group 3: Competitive Landscape - The global LDI market is characterized by a "one superpower and many strong players" structure, with Orbotech holding a 43% market share, followed by Hitachi and ESI with 22% and 16% respectively [6]. - Chinese companies are adopting differentiated competitive strategies, with firms like Chipbond and Han's Laser leveraging proprietary technologies to reduce costs and improve production capabilities [6]. Group 4: Future Trends and Technology Evolution - Key technological breakthroughs are anticipated in optical system localization, with current localization rates around 50%, and advancements in digital twin technology to optimize LDI exposure parameters [7]. - The LDI market is projected to reach $914 million by 2024, with a compound annual growth rate (CAGR) of 3.3% from 2025 to 2031, reflecting the rigid demand for advanced exposure technologies in mid-to-high-end PCB manufacturing [4][7].
芯碁微装拟发行H股 2021年A股上市2募资共12.58亿
Zhong Guo Jing Ji Wang· 2025-07-02 03:23
芯碁微装最终募集资金净额比原计划少5708.17万元。芯碁微装2021年3月29日披露的招股说明书显示, 公司拟募集资金4.73亿元,其中,2.08亿元用于高端PCB激光直接成像(LDI)设备升级迭代项目, 9380.00万元用于晶圆级封装(WLP)直写光刻设备产业化项目,1.08亿元用于平板显示(FPD)光刻设 备研发项目,6355.00万元用于微纳制造技术研发中心建设项目。 待确定具体方案后,公司将根据相关法律法规,履行相关决策程序。本次H股上市事项尚需提交公司董 事会和股东大会审议,并需取得中国证券监督管理委员会、香港联交所和香港证券及期货事务监察委员 会等相关政府机关、监管机构备案、批准或核准。本次H股上市能否通过审议、备案和审核程序并最终 实施具有较大不确定性。公司将依据相关法律法规的规定,根据本次H股上市的后续进展情况及时履行 信息披露义务,敬请广大投资者注意投资风险。 2021年4月1日,芯碁微装在上交所科创板上市,发行数量为3020.24万股,发行价格为15.23元/股,保荐 机构为海通证券股份有限公司(现名"国泰海通证券股份有限公司"),保荐代表人为于军杰、林剑辉。 芯碁微装募集资金总额为4 ...
国产光刻机“遗珠”,国产设备的中流砥柱
He Xun Cai Jing· 2025-06-05 01:33
精密光学正成为高端制造业的"慧眼",从手机镜头到光刻机等高端设备均有应用。产业链涵盖光学材 料、组件及应用,中游器件/组件是核心。2023 年我国精密光学元器件行业市场规模达 668.3 亿元,全 球 446.8 亿美元。波长光电过去名气不大,如今凭借技术实力崭露头角。它打造从原料到组件的全套流 程,产品覆盖多环节。下游应用中,工业级精密光学是发力重点。其产品在 PCB 激光微加工、国产光 刻机、量检测设备、3D 金属打印等领域发挥重要作用,半导体板块 2024 年销售收入同比大增。此外, 消费级光学新兴领域 AR/VR 产品营收有望倍数级增长。 国产光刻机"遗珠",国产设备的中流砥柱,AR/VR业务爆发在即 风险提示:以上内容仅作为作者或者嘉宾的观点,不代表和讯的任何立场,不构成与和讯相关的任何投 资建议。在作出任何投资决定前,投资者应根据自身情况考虑投资产品相关的风险因素,并于需要时咨 询专业投资顾问意见。和讯竭力但不能证实上述内容的真实性、准确性和原创性,对此和讯不做任何保 证和承诺。 股票名称["波长光电","欧菲光","水晶光电","蓝特光学","华工科技","大族激光","海目星"] 板块名称[" ...