公众号记得加星标⭐️，第一时间看推送不会错过。 从电动汽车的高效驱动系统，到光伏发电中的逆变器，再到5G通讯的核心射频模块，以碳化硅 为代表的第三代功率半导体相比传统的硅芯片呈现出更为优越的性能。当新能源汽车续航里程突 破1000公里、800V高压快充成为标配，碳化硅功率半导体的革命正在加速到来。而更高的功率 密度、更优的散热能力、更强的可靠性以及更高的工作温度范围等严苛要求，让传统的焊料封装 与连接技术在新的技术时代，正在被高性能、高可靠性的烧结银封装与连接技术快速取代。烧结 银技术也成为了碳化硅等第三代功率半导体芯片与模组封装的首选材料。 图源：帝科湃泰 1 烧结银技术概述 碳化硅和氮化镓的应用领域 烧结银的概念 烧结银技术，是一种新型无铅化芯片互连技术。该技术主要是对微米级及以下的银颗粒在300℃以下 进行烧结，通过原子间的扩散作用实现良好连接，从而在低温烧结（<250 ℃ ）条件下获得耐高温 （>700℃）和高导热（>200W/m.K）的烧结银芯片连接界面。 技术发展历程 烧结银技术原理 原子扩散是烧结银技术实现良好连接的核心机制。在低温烧结过程中，银颗粒表面的原子具有较高的 活性，由于表面自由能的驱 ...

Core Viewpoint - The recent launch of the new L6 model by Zhiji Automotive, a subsidiary of SAIC Group, highlights a significant breakthrough in the new energy vehicle (NEV) industry, particularly through the use of conductive silver paste from Dike Co., Ltd. for its key feature, the "instant intelligent control" sunshade [1] Group 1: Industry Developments - The introduction of Dike's silver paste for automotive applications marks the beginning of a potential growth phase for automotive-grade products, especially in the silver material electronic business [1] - The demand for silicon carbide (SiC) power semiconductor modules is increasing, with projections indicating that SiC will become a major selling point for domestic NEVs by 2025 [1][3] - The penetration rate of SiC in domestic NEVs is expected to exceed 26% by the first half of 2024, with both international and domestic companies experiencing significant growth in shipments [3] Group 2: Material Insights - Silver materials are gaining traction in high-power electronic modules due to their superior electrical and thermal conductivity compared to copper, leading to a rapid increase in their usage [3] - The high operating temperatures and switching frequencies of SiC chips necessitate advanced packaging materials, with sintered silver providing excellent thermal and electrical conductivity [4] - The global market for sintered silver is currently dominated by foreign companies, with significant reliance on imports for high-cost automotive electronic raw materials [2][4] Group 3: Company Performance - Dike Co., Ltd. has recently achieved IATF 16949 certification, which is expected to accelerate the adoption of its sintered silver and other materials in NEV applications [5] - Financial data indicates that Dike is projected to achieve a revenue of 15.351 billion yuan in 2024, representing a year-on-year increase of 59.85%, while net profit attributable to the parent company is expected to decline slightly by 6.6% [6] - The company has successfully transitioned from the photovoltaic sector to automotive power electronics, leveraging its expertise in micro-nano silver powder technology [6][7] Group 4: Future Outlook - Dike's strategy includes reducing silver content in its products to lower costs, with plans to produce copper-based solutions that maintain compatibility with existing technologies [8][9] - The anticipated mass application of high-copper paste in TOPCon batteries by the second half of 2025 could further enhance Dike's profitability and market position [9]