Core Insights - ASMPT reported a revenue of HKD 3.66 billion for Q3 2025, representing a year-on-year increase of 9.5% [1] - The total new orders amounted to HKD 3.621 billion, reflecting a year-on-year growth of 14.2% [1] - The company experienced a loss attributable to shareholders of HKD 270 million, marking a shift from profit to loss compared to the previous year [1] - Basic loss per share was HKD 0.65 [1] Business Performance - The advanced packaging (AP) and mainstream businesses benefited from the ongoing adoption of artificial intelligence (AI) [1] - The thermal compression bonding (TCB) solutions in advanced packaging received repeat orders from clients in advanced memory and logic applications [1] - Demand for mainstream business was driven by AI infrastructure, including data centers, data transmission, and energy management [1] Market Dynamics - In the Chinese market, the high utilization rates of electric vehicle (EV) and outsourced semiconductor assembly and testing (OSAT) companies boosted demand [1] - However, contributions from automotive and industrial markets outside of China remained weak [1] - The demand for mainstream business continued to benefit from AI, primarily driven by enhanced energy management capabilities in data centers and the demand for AI server motherboards in base stations [1] Segment Analysis - In the Chinese market, demand in the semiconductor solutions segment and surface mount technology (SMT) solutions segment continued to grow [1] - The new order total for wire bonding and die bonding applications in the semiconductor solutions segment was driven by the increasing utilization rates of outsourced semiconductor assembly and testing facilities [1] - Demand in the SMT solutions segment was mainly from electric vehicles, where the company maintains a leading position in China [1]