Core Viewpoint - The company, 快克智能 (603203.SH), announced on November 12 that it expects to complete the prototype development of its thermal compression bonding (TCB) equipment by the end of the year [1]. Group 1 - The company is responding to investor inquiries regarding the development progress of its TCB equipment amid increasing demand for HBM (High Bandwidth Memory) equipment [3]. - The company is under pressure to accelerate the development and provide samples to customers [3].

Core Insights - The company, Quick Intelligent (603203.SH), announced on its interactive platform that its thermal compression bonding equipment (TCB) is expected to complete prototype development within the year [1] Group 1 - The company is focused on the development of thermal compression bonding equipment [1] - The completion of the prototype is anticipated within the current year [1]

Core Viewpoint - The company Kuaike Intelligent (603203.SH) announced on an interactive platform that its thermal compression bonding equipment (TCB) is expected to complete prototype development within the year [1] Group 1 - The company is actively working on the development of thermal compression bonding equipment [1] - The completion of the prototype is anticipated within the current year, indicating progress in the company's R&D efforts [1]