Core Insights - The Chinese electron beam lithography (EBL) system industry is transitioning from "catching up" to "keeping pace" with international standards, achieving breakthroughs in technology such as 0.6 nm resolution and a production capacity of 60 wafers per hour, nearing global advanced levels [1][7][11] - The market size of the Chinese EBL system industry is projected to reach approximately 294 million yuan in 2024, representing a year-on-year growth of 59.78% [1][8] - Despite advancements, the industry faces challenges such as insufficient domestic production of EUV photoresists (less than 1%) and technical hurdles in processes below 2 nm [1][5][14] Industry Overview - EBL systems utilize high-energy electron beams for nanoscale structure fabrication, offering advantages like ultra-high resolution (less than 10 nm) and flexibility without masks, widely applied in semiconductor manufacturing and quantum device preparation [2][3] - The upstream supply chain includes materials like high-purity quartz glass and photoresists, while the downstream applications focus on semiconductor manufacturing and research [3][4] Market Size - The Chinese EBL system market is expected to grow significantly, with a forecasted market size of 294 million yuan in 2024, marking a 59.78% increase from the previous year [1][8] - The domestic demand for semiconductor chips continues to rise, driven by emerging technologies such as 5G and AI, which further supports the growth of the EBL system market [7][12] Key Companies and Institutions - Notable advancements have been made by companies like Zeyou Technology and Zhejiang University, with the "Xizhi" EBL machine achieving 0.6 nm precision and 8 nm linewidth technology, marking significant progress in domestic capabilities [8][11][9] - Zeyou Technology's EBL system has achieved over 95% localization rate and is being applied in various high-tech fields, breaking the monopoly of foreign companies [9][10] Industry Development Trends 1. **Technological Breakthroughs**: The focus will be on achieving resolutions below 0.6 nm and enhancing multi-beam parallel technology, with the aim of increasing production capacity to 120 wafers per hour [11][12] 2. **Expanding Market Demand**: The demand for high-precision chips in sectors like quantum computing and advanced packaging is expected to surge, driven by government support and industry collaboration [12][14] 3. **Complete Supply Chain Development**: The industry aims to achieve self-sufficiency across the entire supply chain, enhancing the localization of critical materials and addressing challenges in EUV photoresist production [14]

Core Viewpoint - The article provides a comprehensive overview of the evolution of lithography technology from the 1950s to the 21st century, focusing on the advancements in extreme ultraviolet lithography (EUVL) and its significance in semiconductor manufacturing [2][6]. Group 1: Introduction to Lithography Technology - Lithography technology is the cornerstone of modern microelectronics, enabling the precise transfer of complex patterns onto substrates, which directly impacts the integration density, computational performance, and manufacturing costs of integrated circuits [7]. - The application scenarios of lithography technology have expanded from traditional fields such as consumer electronics and medical devices to emerging areas like artificial intelligence and quantum computing, which require high-performance chips [8][9]. Group 2: Overview of Lithography Technology - The basic process of lithography includes substrate preparation, photoresist coating, pre-baking, exposure, development, post-baking, etching, and stripping [10][11]. - Key lithography technologies include deep ultraviolet lithography (DUVL), electron beam lithography (EBL), and nanoimprint lithography (NIL), each with unique characteristics and applications [10][11]. Group 3: Photoresist Materials - Photoresists are sensitive materials used in lithography, classified into positive and negative types based on their behavior after development [12][13]. - The core components of photoresists include film-forming resins and photoinitiators, which play crucial roles in the lithography process [12][13]. Group 4: Development Trends and Challenges - The future of photoresist development focuses on high-resolution materials compatible with EUVL, environmentally friendly options, and multifunctional photoresists that integrate various properties [15][16]. - Key challenges in lithography technology include resolution limits, high costs, and environmental impacts, with ongoing research aimed at addressing these issues through innovative solutions [22][23][24]. Group 5: Summary and Outlook - The evolution of lithography technology has progressed from DUVL to EUVL, achieving mass production capabilities for 5nm and below process nodes, while new types of photoresists are being developed to meet advanced manufacturing needs [16][33]. - Future directions include interdisciplinary collaboration, intelligent lithography systems, and the integration of multifunctional materials to adapt to emerging technologies [16][33].