碳化硅(SiC)

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深圳平湖实验室万玉喜:广揽英才助力深圳打造中国半导体第三极
2 1 Shi Ji Jing Ji Bao Dao· 2025-09-23 13:27
视频编辑:张迎,实习生孙筠雅 9月23日,"百万英才汇南粤"2025年N城联动秋季招聘活动在北京、上海同步启动。上海启动式暨上 海、山东地区首场招聘活动在上海交通大学举行。 (作者:孙燕编辑:卜羽勤,视频编辑,张迎,实习生孙筠雅) 国家第三代半导体技术创新中心深圳综合平台主任、深圳平湖实验室主任万玉喜告诉21世纪经济报道记 者,该平台围绕碳化硅(SiC)、氮化镓(GaN)、下一代先进功率电子材料及器件、核心装备及零部件、配 套材料等领域,开展核心技术攻关。今年计划招聘30位应届毕业生,包括器件研发工程师、工艺工程师 等。 万玉喜表示,中国在建设功率半导体的第三极,就在大湾区。"上海、北京以集成电路为方向,国内还 没有以功率半导体为方向的高地。深圳贴近客户,在发展功率半导体方面有优势。" ...
Wolfspeed,股价大涨480%
半导体芯闻· 2025-07-08 10:23
Core Viewpoint - Wolfspeed, Inc. has appointed Gregor van Issum as CFO, effective September 1, which has positively impacted the stock price amid ongoing financial challenges and restructuring efforts [1][2]. Group 1: Company Leadership Changes - Gregor van Issum brings over 20 years of experience in the technology sector, having previously held significant roles at ams-OSRAM and NXP Semiconductors [1]. - David Emerson was appointed COO in May to help improve gross margins and turn the company profitable [1]. Group 2: Financial Performance and Restructuring - Wolfspeed's stock has plummeted by 65.32% year-to-date, contrasting with a 5.92% increase in the S&P 500 [2]. - The company faced severe financial strain due to fluctuating U.S. trade policies and declining demand, leading to concerns about its ability to continue operations [2]. - In June, Wolfspeed announced plans to file for U.S. bankruptcy protection to alleviate its overall debt burden, with a restructuring process expected to be completed by Q3 2025 [2]. - Post-restructuring, Wolfspeed anticipates a 70% reduction in debt (approximately $4.6 billion) and a 60% decrease in annual cash interest expenses [2]. Group 3: Market Outlook and Stock Performance - Investors are optimistic that Van Issum's leadership will facilitate successful restructuring and effective cash management, capitalizing on strong demand for silicon carbide in electric vehicles and AI data centers [2]. - Following the announcement, Wolfspeed's stock surged by 95.76% to $2.31, marking the highest closing price since May 20, with a remarkable increase of 479.24% in July alone [2].
SiC大厂,突然大涨
半导体芯闻· 2025-04-29 09:59
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自moneyDJ ,谢谢 。 Raymond James分析师在半导体产业报告中指出,4月的空头活动较3月增加5%,Wolfspeed更是 最常遭放空的个股,空单余额比率(Short Interest Ratio)达41%。 Wolfspeed为碳化硅(SiC)行业的领导厂商,也投入数十亿美元在美国建立SiC制造能力,但持续深 陷亏损,股价也惨跌至剩个位数。 SiC是一种难以加工的材料,但也能制造出导电性更高的晶片,可应用于电动车、工业基础设施等 高压、高温的环境;近年电动车市况不佳,也冲击Wolfspeed。 Wolfspeed于1月底发布的第二季财报显示,净亏损从一年前的1.259亿美元扩大至3.722亿美元。 公司预估,第三季亏损将介于1.19亿美元至1.38亿美元之间。 市场先前传出,Wolfspeed恐无法与债权人达成债务交换协议,加上拜登政府时代通过的晶片法 (US CHIPS Act)补贴前景不明,引发股价于3月暴跌。 MoneyDJ XQ 全 球 赢 家 系 统 报 价 显 示 , Wolfspeed 股 价 已 连 五 个 交 易 日 上 ...
功率半导体行业观察:IGBT回暖信号显现;碳化硅加速渗透新能源汽车
Jin Rong Jie· 2025-04-02 04:46
Group 1 - The global power semiconductor industry is undergoing structural adjustments, driven by the continuous growth in downstream demand from electric vehicles and smart grids, leading to improved supply-demand dynamics for IGBT and accelerated adoption of SiC technology, marking the beginning of a new growth cycle [1] Group 2 - The supply-demand balance for IGBT is improving, with prices stabilizing after a nearly 30% year-on-year decline in Q1 2024, and a positive growth in shipments from Q2 onwards, indicating the end of the industry downturn [2] Group 3 - China's self-sufficiency rate in IGBT is gradually increasing, as domestic manufacturers narrow the gap with international leaders through technological breakthroughs and capacity expansion, leveraging cost advantages to replace imported products in mid-to-low-end markets [3] Group 4 - The mid-to-low-end vehicle segment is becoming a new growth market, with rising sales and penetration rates of electric vehicles by 2025, and increased competition driving down prices, creating significant opportunities for domestic manufacturers to enter the automotive supply chain [4] Group 5 - The capacity expansion in the SiC industry is accelerating, with China's production increasing threefold compared to 2022, and major overseas companies planning to achieve 8-inch substrate mass production by 2025, leading to a downward pressure on prices [5] Group 6 - The transition to 8-inch substrates is expected to reduce costs, as leading Chinese companies have initiated 8-inch production lines, and the cost gap between SiC modules and IGBT modules is projected to narrow from 2-3 times to below 1.5 times by 2026 [6] Group 7 - The shift from 400V to 800V platforms in electric vehicles is accelerating, with SiC's properties making it increasingly prevalent in mid-to-high-end vehicle power systems, suggesting a broader market potential as costs decrease and technology matures [7]