4、公司空气主轴的销售情况？ 答：公司全资子公司英国 LPB 是全球首个将空气主轴应用到半导体 划片机上的公司，生产的各种高性能高精密空气主轴多年来一直提供给 国内外众多客户；国产化切割主轴已运用到部分国产化划切设备中并于 2025 年开始对外销售。除切割用主轴、研磨用主轴外，目前公司空气 主轴产品已经在硅片生产、光学检测、汽车喷漆等多个应用领域向客户 批量供货。 5、公司激光划片机和研磨机的验证进度？ 证券代码：300480 证券简称：光力科技 债券代码：123197 债券简称：光力转债 光力科技股份有限公司投资者关系活动记录表 编号：20260303 | | □特定对象调研 □分析师会议 | | --- | --- | | 投资者关系活动 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | 类别 | √现场参观 | | | □其他（请文字说明其他活动内容） | | 参与单位名称及 | 中原证券曲波，景泰资本何少，天风证券李双亮 | | 人员姓名 | | | 时间 | 2026 年 3 月 3 日 | | 地点 | 公司郑州航空港厂区 号楼会议室 2 | | 上市公司接待人 | 总经 ...

光力科技股份有限公司投资者关系活动记录表 编号：20260227 | | □特定对象调研 □分析师会议 | | --- | --- | | □媒体采访 投资者关系活动 | □业绩说明会 | | | □新闻发布会 □路演活动 | | 类别 √现场参观 | | | | □其他（请文字说明其他活动内容） | | 参与单位名称及 | 华创证券：张文瑶；铜冠投资：陈宇、叶凯。 | | 人员姓名 | | | 时间 2026 年 | 2 月 27 日 | | 地点 | 公司郑州航空港厂区 号楼会议室 2 | | 上市公司接待人 | 证券事务代表：关平丽 | | 员姓名 | 证券事务经理：张思杰、王尚坤 | | | 各位投资者参观了生产车间、展厅等区域，并就上市公司半导体封 | | | 测装备业务、物联网安全生产监控装备业务的经营情况等问题进行交 | | | 流，主要内容如下： | | | 1、国产半导体业务的产品是否可以实现国产替代？划片机良率是 | | | 否一定要和进口设备达到同样的良率才能被客户接受？ | | | 答：公司国产半导体机械划切设备已经具有与国际头部对标型号相 | | | 媲美的切割品质和切割效率，已经进 ...

Group 1: Company Overview and Operations - Guangli Technology's semiconductor equipment production has reached full capacity since July 2025, with new orders continuously increasing [2] - The second phase of the Zhengzhou Airport project is expected to triple the current production capacity and is scheduled for completion in Q1 2027 [2] - Major clients in the semiconductor business include IDM manufacturers and OSAT firms, with large customer orders accounting for approximately 50% of new domestic semiconductor orders [2] Group 2: Financial Performance and Profitability - The gross margin for the semiconductor business is projected to exceed 40% in 2024, driven by increased sales of high-end customized equipment and improved utilization rates [3] - The overall gross margin is expected to rise as the company integrates self-developed core components into its products [3] Group 3: Global Operations and Market Position - The Israeli subsidiary ADT and the UK subsidiary LP leverage decades of industry experience and brand recognition to meet overseas customer demands [3] - The company employs a dual-circulation global production and marketing model to support both domestic and international markets [3] Group 4: Product Development and Innovation - The company has developed over 20 models of mechanical cutting equipment and is advancing the R&D of 8-inch laser cutting machines [5] - Core components, such as air spindles, are supplied to other semiconductor and semi-semiconductor equipment clients, with applications in various fields including silicon wafer production and optical inspection [5]

Core Viewpoint - The demand for semiconductor equipment has significantly increased since July, leading to shorter delivery cycles and full production capacity for the company's domestic semiconductor slicing machines, prompting plans for a second phase of expansion [1][2]. Semiconductor Equipment Demand - The company has observed a strong demand for semiconductor equipment, with a notable increase in shipment volumes starting from the third quarter of this year, and this growth trend is expected to continue until 2026 [2]. - The company's semiconductor packaging and testing equipment includes precision processing equipment and high-performance air spindles, which have gained widespread recognition and repeat orders from leading packaging enterprises and clients in new technology fields [2]. Market and Product Focus - The company's semiconductor packaging and testing equipment primarily targets OSAT and IDM manufacturers in Europe, Southeast Asia, and China, providing solutions in the slicing and grinding domain [3]. - The air spindle, a core component of the company's products, is not only used in the semiconductor sector but also serves a broader range of precision manufacturing applications [3]. Mergers and Acquisitions - The company has made three overseas acquisitions post-IPO, including Loadpoint Limited and ADT, to quickly penetrate the global semiconductor equipment market and integrate technology and channels in the wafer slicing sector [4]. - Following these acquisitions, the company focused on learning and overcoming various technical challenges to achieve high-end slicing machine mass production [4]. Subsidiary Contributions - ADT, a wholly-owned subsidiary, ranks among the top three semiconductor slicing machine manufacturers globally and is recognized for its cutting precision [5]. - The UK subsidiary, LP, is the inventor of the semiconductor slicing machine and has maintained a leading position in developing high-performance air spindles and related components [5]. R&D and Collaboration - The company plans to leverage the collaborative advantages of its R&D teams in the UK, Israel, and China to enhance customer response and service capabilities through a dual-circulation production and marketing model [6]. AI Integration - The company is advancing its "Artificial Intelligence+" initiative, integrating AI as a core driver in its business development, particularly in the semiconductor industry [8]. - AI is viewed not just as a tool but as a key engine for the company's strategic upgrade from an equipment and system provider to an intelligent solution service provider [8]. - The integration of AI with internal R&D and operational processes aims to enhance automation, reduce operational costs, and allow teams to focus on high-value innovation and customer service [9].

Core Viewpoint - The article highlights the growth and transformation of Guangli Technology, a local company in Henan, from a coal mine safety monitoring business to a key player in the semiconductor equipment industry, contributing to the local industrial chain and reducing reliance on imported high-end equipment [1][2]. Group 1: Company Transformation - Guangli Technology began its journey in 1994 focusing on coal mine safety monitoring and transitioned to semiconductor equipment after its IPO in 2015, raising approximately 170 million yuan for business expansion and R&D [2]. - The company seized the opportunity for domestic substitution in semiconductor equipment by acquiring Loadpoint, the inventor of the semiconductor dicing saw, and subsequently acquired Loadpoint Bearings and ADT, enhancing its capabilities in high-end equipment manufacturing [3]. Group 2: Product Development and Market Position - Guangli Technology has developed a series of domestic dicing saws, including the 8230 model, which is recognized for its performance and has entered mass production for leading packaging and testing companies [4]. - The semiconductor equipment manufacturing business has become a significant revenue contributor, with its share exceeding 50% of total revenue since 2022, indicating strong growth [4]. Group 3: Technological Innovation and Local Industry Development - The company has invested over 1.1 billion yuan in R&D since its listing, maintaining a R&D expenditure ratio above 12% for five consecutive years, and has established a semiconductor dicing saw testing laboratory [5]. - Guangli Technology is constructing a semiconductor intelligent manufacturing base in Zhengzhou, aiming for an annual production capacity of 500 dicing saws, and has attracted 12 supporting semiconductor companies to the region [6]. Group 4: Future Plans and Strategic Alignment - The company plans to focus on three main areas: expanding its cutting and grinding product lines, enhancing the localization of core components, and broadening its product offerings based on market demands [7]. - This strategic direction aligns with Henan's goal of strengthening technological innovation and building a robust advanced manufacturing sector, fostering local talent and supporting emerging industries [8].

Core Viewpoint - The article highlights the growth and transformation of Guangli Technology, a local company in Henan, from a coal mine safety monitoring business to a key player in the semiconductor equipment industry, contributing to the localization of high-end equipment and the development of the local semiconductor industry [1][3][5]. Group 1: Company Transformation - Guangli Technology started in 1994 focusing on coal mine safety monitoring and transitioned to semiconductor equipment after its IPO in 2015, raising approximately 170 million yuan for business expansion [5]. - The company strategically acquired three overseas firms to break the monopoly in the semiconductor slicing machine sector, achieving domestic production of key components and equipment [5][6]. - By 2022, the revenue from semiconductor packaging and testing equipment exceeded 50% of the company's total revenue, indicating strong growth in this segment [6]. Group 2: Technological Innovation - Guangli Technology has established a robust R&D framework, with over 11 billion yuan raised since its listing and a consistent R&D investment ratio of over 12% for five consecutive years [8]. - The company has developed a series of domestic slicing machines, including the 8230 model, which is recognized for its international performance and has been adopted by leading packaging enterprises [6][8]. - The establishment of a semiconductor slicing machine testing laboratory and a dedicated R&D team has further solidified the company's technological capabilities [8]. Group 3: Local Industry Development - Guangli Technology is playing a pivotal role in the development of Henan's semiconductor industry, with plans to build a semiconductor manufacturing base capable of producing 500 slicing machines annually [9]. - The company has attracted 12 semiconductor supporting enterprises to Henan, creating a "one-hour supply chain" and enhancing local industrial collaboration [9]. - The integration of traditional monitoring business with semiconductor technology has positioned Guangli Technology as a leader in niche markets, leveraging its industry experience and customer resources [9]. Group 4: Future Outlook - The company aims to deepen its semiconductor equipment business and expand into frontier fields over the next 3-5 years, aligning with Henan's high-quality development goals [11][12]. - Future R&D efforts will focus on enhancing the product line for cutting and polishing equipment, increasing the localization of key components, and expanding the production capacity of consumables [11][12]. - Guangli Technology's growth strategy emphasizes a multi-dimensional approach combining technology, capital, and ecosystem development to foster long-term collaboration with the local semiconductor industry [12].