从反馈问询中深交所发出的审核问询函来看，监管对胜蓝股份本次募投项目预计效益合理性及前募是否达到预期效益较为关注。 再融资审核结果 据深交所官网显示，创业板上市企业胜蓝科技股份有限公司（简称：胜蓝股份）再融资今日上会获审核通过。 | 上会日期 数量 类型 申报板块 公司简称 注册地 审核结果 | | | | | 募资金额 最近一年净利润 （万元） | | | | --- | --- | --- | --- | --- | --- | --- | --- | | | | | (万元) | (万元) | | | | | 2025-6-5 创业板 胜蓝股份 广东 | 公开发行 可转债 | 通过 | 45,000.00 | 10,038.55 | 东莞证券 | 司农 | 嘉源 | 审议会议现场无主要问询问题。 | 序号 | 项目名称 | 项目投资总额 | 拟投入募集资金金额 | 实施主体 | | --- | --- | --- | --- | --- | | | 新能源汽车高压连接器及组 件生产研发建设项目 | 25,575.87 | 25,500.00 | 胜蓝股份 | | | 工业控制连接器生产研发建 设项目 | ...

Core Viewpoint - The Shenzhen Stock Exchange's listing review committee has approved Shenglan Technology Co., Ltd.'s plan to issue convertible bonds, indicating compliance with issuance, listing, and information disclosure requirements [1] Group 1: Convertible Bond Issuance - Shenglan Technology plans to raise a total of up to RMB 450 million through the issuance of convertible bonds, which will be used for the research and development of high-voltage connectors and components for new energy vehicles, as well as industrial control connectors [1] - The convertible bonds will be issued to unspecified investors, including natural persons, legal entities, and qualified institutional investors, with a face value of RMB 100 per bond [2] - The interest rate for the bonds will be determined by the company's board of directors in consultation with the lead underwriter, based on national policies, market conditions, and the company's specific situation [2] Group 2: Underwriting and Management - Dongguan Securities Co., Ltd. is the lead underwriter for this issuance, with representatives Zhu Zeliang and Yang Guohui overseeing the process [2]

Core Points - Shenglan Technology Co., Ltd. is issuing convertible bonds to unspecified investors, with Dongguan Securities as the lead underwriter [1][2] - The company specializes in the research, production, and sales of electronic connectors and precision components, particularly for consumer electronics and new energy vehicles [4][8] - The company has a strong focus on R&D, with significant investments in core technologies and a dedicated team of researchers [4][11] Company Overview - Company Name: Shenglan Technology Co., Ltd. [2] - Legal Representative: Pan Hao [2] - Stock Code: 300843.SZ [2] - Established: December 14, 2007 [2] - Listed on: Shenzhen Stock Exchange on July 2, 2020 [2] - Main Products: Electronic products, new energy components, connectors, charging modules, and related products [2][4] Business Operations - The company has maintained stable operations in its main business areas since its establishment [4] - It has developed several core technologies in connector manufacturing, including crimping technology and precision injection molding [4][10] - R&D expenses for the first quarter of 2025 were approximately 16.49 million yuan, accounting for 4.90% of revenue [11] Financial Performance - Total assets as of March 31, 2025, were approximately 2.22 billion yuan, with total liabilities of about 651.41 million yuan [6] - Revenue for the first quarter of 2025 was approximately 336.69 million yuan, with a net profit of about 30.48 million yuan [6][7] - The company has shown fluctuations in revenue and net profit over the years, with a notable increase in R&D investment [11][12] Market Position and Risks - The company faces risks related to customer concentration, with a significant portion of revenue derived from a few major clients [8][9] - There is a risk of core technical personnel turnover, which could impact the company's innovation capabilities [10] - The company is also exposed to market competition and fluctuations in raw material prices, which could affect profitability [14][15]

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