Core Viewpoint - The company has successfully developed and mass-produced new materials such as silicon-aluminum alloys and aluminum carbide silicon for semiconductor equipment components, indicating a strong focus on innovation and market application [1] Group 1: Product Development - The company has achieved mass production of silicon-aluminum alloys and aluminum carbide silicon for manufacturing semiconductor equipment components like bases, support frames, and electrostatic chucks [1] - The high thermal conductivity solderable die-casting aluminum alloy developed by the company is being actively expanded for applications in energy storage and liquid cooling systems for computing centers [1] Group 2: Material Advantages - The new aluminum alloy material is suitable for high-pressure die-casting and high-temperature soldering processes, offering significant advantages over some existing solderable die-casting materials by not including precious metals like nickel and vanadium [1] - The material demonstrates excellent casting performance and high cost-effectiveness, representing a breakthrough for the company's aluminum alloy materials in replacing forging with casting [1] Group 3: Industry Impact - The advancements in materials are expected to facilitate low-cost, short-process, low-carbon, and green development of thermal management components in energy storage, computing centers, and communications sectors [1]

Core Viewpoint - The company, Lichung Group, has developed new materials such as silicon-aluminum alloy and aluminum carbide silicon for manufacturing semiconductor equipment components, indicating a focus on high-precision and high-performance applications in the semiconductor industry [1] Group 1 - The silicon-aluminum alloy is primarily used for manufacturing ultra-high precision components in semiconductor equipment, particularly for high-speed moving parts [1] - The aluminum carbide silicon is mainly utilized for components that require high stiffness and wear resistance [1] - Detailed information regarding these materials is currently undisclosed due to company confidentiality requirements [1]