Core Viewpoint - The company has developed new materials such as silicon-aluminum alloy and aluminum carbide silicon, which are currently used in aerospace, optics, and integrated electronic packaging, as well as chip packaging. These materials are also applicable for the casing packaging of optical modules in CPO [1] Group 1 - The new materials are utilized in aerospace and optical fields [1] - The materials are suitable for integrated electronic packaging and chip packaging [1] - The company’s products can be applied in the casing packaging of optical modules in CPO [1]

Core Viewpoint - The company has successfully developed and mass-produced new materials such as silicon-aluminum alloys and aluminum carbide silicon for semiconductor equipment components, indicating a strong focus on innovation and market application [1] Group 1: Product Development - The company has achieved mass production of silicon-aluminum alloys and aluminum carbide silicon for manufacturing semiconductor equipment components like bases, support frames, and electrostatic chucks [1] - The high thermal conductivity solderable die-casting aluminum alloy developed by the company is being actively expanded for applications in energy storage and liquid cooling systems for computing centers [1] Group 2: Material Advantages - The new aluminum alloy material is suitable for high-pressure die-casting and high-temperature soldering processes, offering significant advantages over some existing solderable die-casting materials by not including precious metals like nickel and vanadium [1] - The material demonstrates excellent casting performance and high cost-effectiveness, representing a breakthrough for the company's aluminum alloy materials in replacing forging with casting [1] Group 3: Industry Impact - The advancements in materials are expected to facilitate low-cost, short-process, low-carbon, and green development of thermal management components in energy storage, computing centers, and communications sectors [1]

Core Viewpoint - The company, Lichung Group, has developed new materials such as silicon-aluminum alloy and aluminum carbide silicon for manufacturing semiconductor equipment components, indicating a focus on high-precision and high-performance applications in the semiconductor industry [1] Group 1 - The silicon-aluminum alloy is primarily used for manufacturing ultra-high precision components in semiconductor equipment, particularly for high-speed moving parts [1] - The aluminum carbide silicon is mainly utilized for components that require high stiffness and wear resistance [1] - Detailed information regarding these materials is currently undisclosed due to company confidentiality requirements [1]