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Group 1 - The Ministry of Industry and Information Technology and other departments issued an implementation opinion to promote the high-quality development of the technology service industry, focusing on research and development, technology transfer, and enterprise incubation [1] - The State Administration of Foreign Exchange reported a continued positive trend in foreign investment in RMB assets, with a net increase of $10.9 billion in domestic bonds in April, and a shift to net buying in domestic stocks by foreign investors in late April [1] - TSMC plans to increase prices for its advanced process nodes, with a 10% price hike for 2nm wafers and a potential increase of up to 30% for its 4nm manufacturing node [1] - The National Financial Supervision and Administration Bureau approved Xinhua Insurance's participation in the third batch of long-term investment reform pilot projects, aiming to expedite the entry of long-term funds into the market [1] Group 2 - Kweichow Moutai's shareholders' meeting approved a profit distribution plan for 2024, proposing a dividend of 276.24 yuan per share [2] - Liren Lizhuang reported a cumulative transaction amount (GMV) of only 4.006 million yuan for its product in Q1 2025 [2] - Zhongyida stated that its production capacity remains stable with no new construction plans [2] - Weir Shares plans to change its stock name from "Weir Shares" to "Haowei Group" [2] - Wan'an Technology confirmed there are no significant undisclosed matters [2] - Ningbo Shipping's stock price has been highly volatile recently, indicating a high risk of speculation [2] - Lianyungang reported that its production and operational activities are normal, with no significant changes in industry policies [2]

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 5月19日消息，据台媒报道，台积电将会进一步提高其 2nm 工艺晶圆的售价。 报道称，未来几周晶圆价格将进一步飙升，这主要源于台积电在美国等海外地区建设晶圆厂成本上升， 以及需要收回其今年资本支出计划中 380 亿至 420 亿美元的部分投入。 据悉，台积电 2nm 工艺晶圆的价格将较此前上涨 10%，去年 300mm 晶圆的预估价格为 3 万美元，而新 定价将达到 3.3 万美元左右，报告还补充称，英伟达 CEO 黄仁勋认为台积电的尖端工艺"非常值得"。 供应链消息透露，英伟达已在台积电2nm制程客户名单中，未来将导入次世代AI芯片。随制程技术不断 微缩，技术复杂度与失败风险同步升高，晶圆代工报价「水涨船高」成必然趋势。 多数IC设计厂商认为，随着制程门槛升高，晶圆代工厂商与客户之间的黏着度亦持续加强。由于转 换代工厂所需的时间、人力与资源成本高昂，加上对先进制程的依赖程度加深，厂商倾向选择与成 熟供应商维持长期合作关系，以确保在AI技术与效能竞赛中不落人后。 半导体公众号推荐 半导体论坛百万微信 ...