Core Viewpoint - The A-share market experienced fluctuations on October 28, with the Shanghai Composite Index briefly surpassing 4000 points before closing lower, indicating volatility in investor sentiment and market dynamics [1][2][6]. Group 1: Human-Robot Sector - The human-robot concept stocks surged, with Jinfu Technology hitting a 20% limit up, driven by a new order from a Taiwanese client for a cooling system using their 0.08mm blade heat dissipation architecture [1][2]. - The new cooling architecture employs the latest MLCP (Microchannel Liquid Cooling Plate) technology, effectively addressing the thermal issues of processors with power consumption above 1800W [2]. Group 2: Market Trends and Predictions - Analysts remain optimistic about the Chinese stock market, citing a "transformation bull" trend driven by accelerated economic transformation, declining risk-free returns, and capital market reforms [6][7]. - The market is characterized by a "technology bull" phase, with significant price increases in tech sectors while traditional sectors lag behind, indicating a divergence in market performance [6][7]. - Goldman Sachs predicts a 30% increase in major stock indices by the end of 2027, supported by a 12% growth in earnings and a 5%-10% valuation adjustment [7]. Group 3: Fujian Province Developments - Fujian Province has seen a surge in related concept stocks, with significant investments announced at the 2025 World Marine Equipment Conference, totaling over 200 billion yuan across 172 projects [3][4]. - The province is focusing on seven key areas for industrial planning, including new-generation information technology and high-end equipment manufacturing, aiming to build competitive strategic emerging industry clusters [4].

Core Viewpoint - Jinfu Technology has received an order from a Taiwanese client for its custom-developed 0.08mm blade heat dissipation structure, which is utilized in the liquid cooling system for the B200 chip [1] Group 1: Product Development - The heat dissipation structure employs the latest MLCP (Microchannel Liquid Cooling Plate) technology, providing significant first-mover advantages and technical superiority [1] - This technology effectively addresses the TDP thermal effects of processors with power consumption between 1800W and 2000W and above, ensuring stable low-temperature operation of processor modules [1] Group 2: Future Prospects - The adaptation plan for the next-generation B300 chip has completed multiple rounds of sample testing, receiving positive feedback and is now entering the production preparation phase [1]