Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. successfully listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, raising approximately 1 billion RMB, with significant stock price increases and market capitalization reaching over 28 billion RMB, marking it as the largest IPO in Xiamen this year [2][3]. Company Overview - Established in 2004, Hengkang New Materials has a registered capital of approximately 381.92 million RMB and has formed joint ventures with companies like Jiu Ri New Materials and Ba Yi Space [4]. - Initially focused on optical film devices and window lenses, the company shifted its business model in 2014 to target the supply chain of photolithography materials and precursors for 12-inch integrated circuit wafer manufacturing [5]. Product Development and Market Position - By the end of 2024, Hengkang New Materials achieved mass production of various photolithography materials and precursors, including SOC, BARC C, i-Line photoresist, and KrF photoresist, successfully replacing foreign competitors [5][9]. - The company has become a leader in the domestic market for SOC and BARC sales, with projected sales of SOC reaching approximately 23.24 million RMB in 2024, capturing over 10% of the domestic market share [10][13]. Financial Performance - From 2022 to 2024, Hengkang New Materials reported revenues of approximately 322 million RMB, 368 million RMB, and 548 million RMB, with net profits of approximately 101 million RMB, 89.84 million RMB, and 96.92 million RMB respectively [13]. - The sales revenue from self-produced products increased significantly, accounting for 38.94%, 52.72%, and 63.77% of total revenue in the respective years [13][15]. Production Capacity and Utilization - In 2024, the production capacity for SOC and BARC was 26,928 gallons and 20,796 gallons respectively, with utilization rates of 57.42% and 21.43% [11]. - The production capacity for KrF photoresist reached 12,465 gallons, with a production output of 2,188 gallons and a utilization rate of 17.55% [11]. Market Outlook - According to market research, the domestic market for photolithography materials is expected to grow to 31.92 billion RMB by 2028, with a compound annual growth rate of 21.2% [9].

Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. has officially listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, establishing itself as a leader in the domestic semiconductor key materials sector, particularly in the production of SOC and BARC lithography materials, which are essential for chip manufacturing [1][18]. Company Overview - Hengkang New Materials is recognized as a national-level "specialized and innovative" small giant enterprise, with its subsidiary, Fujian Hongguang, designated as a key materials engineering research center for integrated circuit lithography in Fujian Province [2]. Industry Context - The domestic semiconductor key materials market has historically been dominated by foreign companies from Europe, the United States, Japan, and South Korea, with local production rates for critical lithography products being extremely low, often around 1% [3][15]. R&D and Innovation - The company has engaged in a long-term R&D process, which is characterized by high costs and lengthy validation periods of 3 to 5 years for new products [4][6]. - R&D expenditures have shown a consistent increase, reaching approximately 53.66 million yuan in 2023, which is 14.59% of revenue, and projected to rise to 88.61 million yuan in 2024, accounting for 16.17% of revenue [6][7]. - As of June 2025, the company holds 101 patents, including 43 invention patents, reflecting significant technological accumulation [8]. Market Performance - The sales revenue from self-produced products has grown significantly, with figures of 124 million yuan in 2022, 190 million yuan in 2023, and 344 million yuan in 2024, resulting in a compound annual growth rate of 66.89% [9]. - The company has supplied over 55,000 gallons of lithography materials and has developed over 100 product variations [9]. Strategic Importance - Hengkang New Materials has become a key player in national strategic tasks, successfully completing several major projects and providing critical lithography material solutions for advanced chip technologies [10][12]. - The shift towards "domestic substitution" in the semiconductor industry has created significant opportunities for the company, as clients are now actively seeking collaboration on product development [13][14]. Competitive Position - The company has achieved the status of the leading domestic manufacturer for its SOC and BARC products, effectively replacing foreign competitors such as DuPont and Shin-Etsu [18]. - Hengkang New Materials has received recognition from major industry clients, including awards for value creation and R&D collaboration, indicating strong customer acceptance of its products [19]. Financial Support and Future Plans - The company has invested over 1 billion yuan in equipment procurement, capacity building, and technology R&D, with ongoing support from local investment funds [20][21]. - The recent fundraising of 1.01 billion yuan from its IPO will be allocated to key projects aimed at advancing the development and industrialization of critical materials, enhancing the domestic supply chain for high-end integrated circuit materials [21][22].

Core Viewpoint - The successful IPO of Xiamen Hengkang New Materials Technology Co., Ltd. on the Sci-Tech Innovation Board marks a significant milestone in the domestic semiconductor materials industry, particularly in the field of photoresists, highlighting the trend of domestic substitution in critical materials [3][5][6]. Group 1: IPO Performance and Market Impact - Hengkang New Materials debuted at an issue price of 14.99 yuan per share, experiencing a remarkable opening surge of 287%, with its market capitalization briefly exceeding 28 billion yuan [3]. - The company's performance positions it as the largest IPO in Xiamen for the year, emphasizing its role in the semiconductor "bottleneck" materials sector [3]. Group 2: Technological Advancements and Market Position - Hengkang New Materials has established itself as one of the few domestic companies capable of developing and mass-producing key materials for 12-inch integrated circuit wafer manufacturing, focusing on photoresist and precursor materials since its inception in 2004 [5]. - The company’s core products, SOC (Spin Coated Silicon) and BARC (Bottom Anti-Reflective Coating), lead the domestic market, with SOC's market share exceeding 10% in 2024 [5]. - The company has invested significantly in R&D, with expenditures rising from 42.74 million yuan in 2022 to 88.61 million yuan in 2024, representing an increase in R&D expenditure ratio from 13.28% to 16.17% [5]. Group 3: Domestic Substitution and Supply Chain Integration - The domestic photoresist market remains heavily reliant on imports, with local production rates for various types of photoresists being significantly low, such as 10% for i-Line and only 1-2% for BARC and KrF photoresists [6]. - Hengkang New Materials has successfully entered the supply chains of major domestic 12-inch wafer fabs, delivering over 50,000 gallons of product, with some clients achieving sales exceeding 100 million yuan [6]. Group 4: Capital Injection and Future Prospects - The IPO has provided Hengkang New Materials with new growth momentum, with raised funds directed towards expanding production capacity and advancing R&D for high-end products like ArF photoresists [8]. - The listing serves as a benchmark for the industry, demonstrating the viability of the "technology breakthrough - customer validation - mass production - capital market entry" pathway for photoresist companies [8]. Group 5: Competitive Landscape and Global Context - The global photoresist market is dominated by Japanese and American companies, which hold a combined market share of 95%, particularly in high-end photoresists [16][17]. - Hengkang New Materials' success may inspire other domestic companies in the photoresist sector, although replicating or surpassing its achievements will require time and continued innovation [9].

从盘面来看，科创板592只个股涨少跌多，高价股多数上涨，低价股则多数下跌。细分领域来看，半导 体股、软件服务股表现强势，电气设备股、化工原料股跌幅靠前；专用机械股表现分化。 恒坤新材11月18日在上交所科创板上市，公司证券代码为688727，发行价格14.99元／股，发行市盈率 为71.42倍。公司的主营业务是光刻材料和前驱体材料的研发、生产和销售。公司主要产品有光刻材 料、SOC（碳膜涂层）、BARC（底部抗反射涂层）、光刻胶、其他光刻材料、前驱体材料等。截至收 盘时，恒坤新材较发行价涨74.41%，成交额约11.1亿元，换手率达73.25%。 经新华财经统计，11月18日，剔除上市首日的恒坤新材，科创板其余592只个股平均跌幅0.58%，平均 换手率2.62%，合计成交额约1846.08亿元，平均振幅为3.97%。 新华财经北京11月18日电（胡晨曦）科创50指数11月18日早间低开，随后震荡上行翻红，早盘一度涨超 1.4%；午后指数涨幅有所回落，最终小幅收涨。至收盘时，科创50指数报1357.93点，涨幅0.29%，指数 振幅为1.92%，总成交额约612.2亿元。 个股表现方面，不考虑上市首日的恒坤新 ...