CO2激光钻孔设备
Search documents
天准科技(688003.SH):产品可以用于高端PCB封装载板的制造过程
Ge Long Hui· 2025-11-03 08:28
格隆汇11月3日丨天准科技(688003.SH)在投资者互动平台表示,天准科技的激光直接成像设备、CO2激 光钻孔设备、PCB AOI设备等产品可以用于高端PCB封装载板的制造过程。 ...
芯碁微装:需求旺盛产能满载 预计PCB设备行业景气周期将结构性延长
Zheng Quan Shi Bao Wang· 2025-09-05 10:17
Core Viewpoint - The company has experienced significant growth in revenue and net profit due to the recovery in the global semiconductor and high-end manufacturing industries, achieving historical highs in performance metrics [1] Group 1: Financial Performance - In the first half of the year, the company recorded operating revenue of 654 million yuan, a year-on-year increase of 45.59%, and a net profit of 142 million yuan, up 41.05% year-on-year, both reaching historical highs for the same period [1] - The company's operating cash flow was negative at -105 million yuan, further declining year-on-year, primarily due to increased raw material procurement in response to surging orders and extended payment cycles from some clients [2] Group 2: Production and Capacity - The company has been operating at full capacity since March, with a record monthly shipment of over 100 units in March and a nearly 30% month-on-month increase in April [1] - The second phase of the company's production facility is set to commence operations this month, which will significantly enhance the annual production capacity of high-end direct-write lithography equipment [1] Group 3: Product Development - The company's MAS4 equipment has completed pilot testing with several leading clients, achieving a minimum line width of 3-4 μm, and is now in small batch delivery [2] - The self-developed CO2 laser drilling equipment is undergoing mass production validation with major clients, with expected order growth driven by downstream expansion needs by 2025 [2] Group 4: Market Strategy and Trends - The company is focusing on expanding its overseas presence, particularly in Southeast Asia, with ongoing progress in establishing a subsidiary in Thailand [3] - The company anticipates a structural extension of the PCB equipment industry's boom cycle, driven by the explosive demand for AI computing power and advancements in packaging technologies [3]