DDR内存接口

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倒计时2天 | 人工智能,IP盛会,约定北京
半导体芯闻· 2025-07-07 09:49
公众号记得加星标⭐️,第一时间看推送不会错过。 成立于1990年的Rambus公司,是接口IP和安全IP领域的先驱者。 凭借其创新的高速接口技术, Rambus重新定义了内存与系统间的数据传输标准,其DDR内存接口、HBM3/4和PCIe 5/6 等解决方 案 显 著 提 升 了 数 据 中 心 、 边 缘 计 算 等 场 景 的 性 能 上 限 。 同 时 , 面 对 日 益 复 杂 的 网 络 安 全 威 胁 , Rambus拥有许多安全IP解决方案,比如信任根技术、安全协议引擎、内联(inline)密码引擎、后量子 密码算法加速器核等。这些丰富的安全和接口IP解决方案帮助Rambus构建了强大的产品组合。 7月9日,针对AI和汽车两大热门方向,Rambus于北京丽亭华苑酒店举办技术探讨会。 届时,除了 Rambus 之 外 , 其 他 行 业 合 作 伙 伴 包 括 M31 、 晶 心 科 技 、 Brightsight 、 ETAS 、 DPLSLab 、 CoMIRA、Riscure的多位技术专家将带来全天候的精彩分享。 日期 : 2025年7月9日 ⏰ 时间 : 8:30 - 17:30 地点 : ...
倒计时4天 | 人工智能,IP盛会,约定北京
半导体行业观察· 2025-07-05 04:07
公众号记得加星标⭐️,第一时间看推送不会错过。 日期 : 2025年7月9日 ⏰ 时间 : 8:30 - 17:30 地点 : 北京丽亭华苑酒店 (北京海淀区知春路25号,近地铁知春路站,如果自驾前往酒店需支付停车费,但可享受折扣) 我们诚邀您扫描下方 二维码 提前注册,预留参会席位 (会议将提供午餐和茶歇) ,名额有限,预 报从速哦。 成立于1990年的Rambus公司,是接口IP和安全IP领域的先驱者。 凭借其创新的高速接口技术, Rambus重新定义了内存与系统间的数据传输标准,其DDR内存接口、HBM3/4和PCIe 5/6 等解决方 案 显 著 提 升 了 数 据 中 心 、 边 缘 计 算 等 场 景 的 性 能 上 限 。 同 时 , 面 对 日 益 复 杂 的 网 络 安 全 威 胁 , Rambus拥有许多安全IP解决方案,比如信任根技术、安全协议引擎、内联(inline)密码引擎、后量子 密码算法加速器核等。这些丰富的安全和接口IP解决方案帮助Rambus构建了强大的产品组合。 7月9日,针对AI和汽车两大热门方向,Rambus于北京丽亭华苑酒店举办技术探讨会。 届时,除了 Rambus ...
报名中 | 聚焦接口与安全IP,这场技术研讨会不容错过!
半导体芯闻· 2025-07-04 10:00
在当今高速发展的半导体行业中,数据传输速度和安全性已成为关键挑战。随着人工智能、 联网车辆、5G和物联网的爆发式增长,市场对高性能计算和低功耗芯片的需求激增,而内存 带宽与数据处理安全性的瓶颈日益凸显。在这一背景下,接口IP和安全IP技术成为行业突破 的核心驱动力,它们直接决定了芯片的效能、兼容性及抗攻击能力。 成立于1990年的Rambus公司,正是这一领域的先驱者。凭借其创新的高速接口技术,Rambus重新 定义了内存与系统间的数据传输标准,其DDR内存接口、HBM3/4和PCIe 5/6 等解决方案显著提升 了数据中心、边缘计算等场景的性能上限。同时,面对日益复杂的网络安全威胁,Rambus拥有许 多安全IP解决方案,比如信任根技术、安全协议引擎、内联(inline)密码引擎、后量子密码算法加速 器核等。这些丰富的安全和接口IP解决方案帮助Rambus构建了强大的产品组合。 7月9日,针对AI和汽车两大热门方向,Rambus于北京丽亭华苑酒店举办技术探讨会。届时,除了 Rambus 之 外 , 其 他 行 业 合 作 伙 伴 包 括 M31 、 晶 心 科 技 、 Brightsight 、 ETAS ...
报名中 | 聚焦接口与安全IP,这场技术研讨会不容错过!
半导体行业观察· 2025-07-04 01:13
在当今高速发展的半导体行业中,数据传输速度和安全性已成为关键挑战。随着人工智能、 联网车辆、5G和物联网的爆发式增长,市场对高性能计算和低功耗芯片的需求激增,而内存 带宽与数据处理安全性的瓶颈日益凸显。在这一背景下,接口IP和安全IP技术成为行业突破 的核心驱动力,它们直接决定了芯片的效能、兼容性及抗攻击能力。 成立于1990年的Rambus公司,正是这一领域的先驱者。凭借其创新的高速接口技术,Rambus重新 定义了内存与系统间的数据传输标准,其DDR内存接口、HBM3/4和PCIe 5/6 等解决方案显著提升 了数据中心、边缘计算等场景的性能上限。同时,面对日益复杂的网络安全威胁,Rambus拥有许 多安全IP解决方案,比如信任根技术、安全协议引擎、内联(inline)密码引擎、后量子密码算法加速 器核等。这些丰富的安全和接口IP解决方案帮助Rambus构建了强大的产品组合。 7月9日,针对AI和汽车两大热门方向,Rambus于北京丽亭华苑酒店举办技术探讨会。届时,除了 Rambus 之 外 , 其 他 行 业 合 作 伙 伴 包 括 M31 、 晶 心 科 技 、 Brightsight 、 ETAS ...
报名中 | 聚焦接口与安全IP,这场技术研讨会不容错过!
半导体芯闻· 2025-07-03 10:02
在当今高速发展的半导体行业中,数据传输速度和安全性已成为关键挑战。随着人工智能、 联网车辆、5G和物联网的爆发式增长,市场对高性能计算和低功耗芯片的需求激增,而内存 带宽与数据处理安全性的瓶颈日益凸显。在这一背景下,接口IP和安全IP技术成为行业突破 的核心驱动力,它们直接决定了芯片的效能、兼容性及抗攻击能力。 成立于1990年的Rambus公司,正是这一领域的先驱者。凭借其创新的高速接口技术,Rambus重新 定义了内存与系统间的数据传输标准,其DDR内存接口、HBM3/4和PCIe 5/6 等解决方案显著提升 了数据中心、边缘计算等场景的性能上限。同时,面对日益复杂的网络安全威胁,Rambus拥有许 多安全IP解决方案,比如信任根技术、安全协议引擎、内联(inline)密码引擎、后量子密码算法加速 器核等。这些丰富的安全和接口IP解决方案帮助Rambus构建了强大的产品组合。 7月9日,针对AI和汽车两大热门方向,Rambus于北京丽亭华苑酒店举办技术探讨会。届时,除了 Rambus 之 外 , 其 他 行 业 合 作 伙 伴 包 括 M31 、 晶 心 科 技 、 Brightsight 、 ETAS ...
报名中 | 聚焦接口与安全IP,这场技术研讨会不容错过!
半导体芯闻· 2025-06-30 10:07
Core Viewpoint - The semiconductor industry faces critical challenges in data transmission speed and security, driven by the explosive growth of AI, connected vehicles, 5G, and IoT, leading to increased demand for high-performance computing and low-power chips [1] Group 1: Industry Challenges and Innovations - The bottlenecks in memory bandwidth and data processing security are becoming increasingly prominent [1] - Interface IP and security IP technologies are identified as core drivers for breakthroughs in the industry, directly impacting chip performance, compatibility, and attack resistance [1] - Rambus, established in 1990, is a pioneer in this field, redefining data transmission standards between memory and systems with innovative high-speed interface technologies [1] Group 2: Rambus Solutions - Rambus offers solutions such as DDR memory interfaces, HBM3/4, and PCIe 5/6, significantly enhancing performance limits in data centers and edge computing [1] - The company provides a range of security IP solutions, including root of trust technology, security protocol engines, inline cryptographic engines, and post-quantum cryptography accelerators [1] - These comprehensive security and interface IP solutions contribute to a robust product portfolio for Rambus [1] Group 3: Upcoming Event - Rambus will host a technology discussion on July 9, 2025, in Beijing, focusing on AI and automotive sectors, featuring industry partners and technical experts [2][3] - The morning session will cover the latest interface and security IP solutions for AI and advanced applications, including quantum-safe encryption and various memory technologies [6] - The afternoon session will delve into automotive safety solutions, addressing trends and challenges faced by hardware and software designers in smart connected vehicles [7]
报名中 | 2025 Rambus 北京设计研讨会
半导体行业观察· 2025-06-28 02:21
Core Viewpoint - The semiconductor industry faces critical challenges in data transmission speed and security, driven by the explosive growth of AI, connected vehicles, 5G, and IoT, leading to increased demand for high-performance computing and low-power chips [1] Group 1: Industry Challenges and Innovations - The bottlenecks in memory bandwidth and data processing security are becoming increasingly prominent [1] - Interface IP and security IP technologies are identified as core drivers for breakthroughs in the industry, directly impacting chip performance, compatibility, and attack resistance [1] Group 2: Company Overview - Rambus, established in 1990, is a pioneer in high-speed interface technology, redefining data transmission standards between memory and systems [1] - Rambus offers a robust product portfolio, including DDR memory interfaces, HBM3/4, and PCIe 5/6 solutions, significantly enhancing performance in data centers and edge computing [1] Group 3: Upcoming Event - Rambus will host a technology discussion on July 9, 2025, in Beijing, focusing on AI and automotive sectors, featuring industry partners and technical experts [2][3] - The event will cover the latest interface and security IP solutions for advanced applications, including quantum-safe encryption and various memory technologies [6] - The afternoon session will delve into automotive security solutions, addressing trends and challenges faced by hardware and software designers in smart connected vehicles [7]
报名中 | 2025 Rambus 北京设计研讨会
半导体芯闻· 2025-06-23 10:23
在当今高速发展的半导体行业中,数据传输速度和安全性已成为关键挑战。随着人工智能、 联网车辆、5G和物联网的爆发式增长,市场对高性能计算和低功耗芯片的需求激增,而内存 带宽与数据处理安全性的瓶颈日益凸显。在这一背景下,接口IP和安全IP技术成为行业突破 的核心驱动力,它们直接决定了芯片的效能、兼容性及抗攻击能力。 ⏰ 时间: 8:30 - 17:30 地点: 北京丽亭华苑酒店 (北京海淀区知春路25号,近地铁知春路站,如果自驾前往酒店需支付停车费,但可享受折扣) 我们诚邀您扫描下方 二维码 提前注册,预留参会席位 (会议将提供午餐和茶歇) ,名额有限,预 报从速哦。 成立于1990年的Rambus公司,正是这一领域的先驱者。凭借其创新的高速接口技术,Rambus重新 定义了内存与系统间的数据传输标准,其DDR内存接口、HBM3/4和PCIe 5/6 等解决方案显著提升 了数据中心、边缘计算等场景的性能上限。同时,面对日益复杂的网络安全威胁,Rambus拥有许 多安全IP解决方案,比如信任根技术、安全协议引擎、内联(inline)密码引擎、后量子密码算法加速 器核等。这些丰富的安全和接口IP解决方案帮助Rambu ...
澜起科技:业绩高增,运力芯片前景广阔
He Xun Wang· 2025-05-21 14:39
Core Viewpoint - The company aims to become a leading international interconnected chip design firm over the next five to ten years, focusing on interconnect chips to support cloud computing and AI infrastructure [1] Business Strategy - The company will expand its business layout from three dimensions: - Continuous investment in DDR memory interface product upgrades in the memory interconnect field to lead technological innovation [1] - Strengthening core underlying technology research and development in the PCIe/CXL interconnect field to promote product upgrades and market expansion [1] - Exploring niche markets in the Ethernet and optical interconnect fields through various methods to advance product layout [1] Financial Performance - The company reported a revenue of 3.639 billion yuan for 2024, a year-on-year increase of 59.2%, and a net profit of 1.412 billion yuan, up 213.1% [1] - In Q1 2025, the company achieved a record high in revenue and net profit, with revenue of 1.222 billion yuan, a year-on-year growth of 65.78%, and a net profit of 525 million yuan, an increase of 135.14% [1] - As of April 22, 2025, the company expects over 1.29 billion yuan in orders for interconnect chips to be delivered in Q2 2025, with new orders still being received [1] Industry Insights - The chairman noted that advancements in AI technology are shifting the industry from "computing" to "intelligent computing," with generative AI and large language models reshaping the tech sector and driving growth in the AI server market [1] - The AI infrastructure sector continues to benefit from this transformation, with interconnect capabilities becoming increasingly important [1] - The company has a strong technical foundation in interconnect chips and actively participates in the formulation of related product standards [1]
一季度业绩延续高增长,澜起科技深耕“运力”启新程
Zheng Quan Shi Bao Wang· 2025-04-25 00:47
Core Insights - The company, Lanke Technology, reported strong financial performance for Q1 2025, achieving a revenue of 1.222 billion yuan, a year-on-year increase of 65.78%, and a net profit of 525 million yuan, up 135.14% [2] - The sales revenue from interconnect chips reached 1.139 billion yuan, reflecting a growth of 63.92% year-on-year, with multiple operational metrics hitting historical highs [2] - The gross margin for interconnect chips increased to 64.50%, up 3.57 percentage points year-on-year, indicating high business quality [2] Financial Performance - The company achieved a net profit of 602 million yuan when excluding the impact of share-based payments, resulting in a net profit margin approaching 50% [2] - The interconnect chip sales revenue and net profit have shown consistent quarter-on-quarter growth for eight consecutive quarters, demonstrating resilience in the company's development [2] - As of April 22, 2025, the company has over 1.29 billion yuan in hand orders for interconnect chips expected to be delivered in Q2 2025, with new orders continuing to flow in [2] Product Development - The company successfully passed the CXL2.0 compliance test for its CXLMXC chip and is now listed among the first batch of CXL2.0 compliant suppliers [3] - New products such as PCIe6.x/CXL3.x Retimer chips and second-generation MRCD/MDB sets have been developed, expanding the product matrix [3] - The sales revenue for three high-performance interconnect chips reached 135 million yuan in Q1 2025, marking a year-on-year growth of 155% [3] Strategic Focus - The company has set long-term strategic goals for the next five to ten years, aiming to become a leading global designer of all-interconnect chips, focusing on the interconnect chip sector [4] - Plans include advancing DDR memory interface product iterations, enhancing core technology R&D in PCIe/CXL interconnects, and exploring Ethernet and optical interconnect fields [4] - The company will actively seek investment and acquisition opportunities to align business expansion with strategic goals [4] Market Outlook - Analysts believe that as computing power increases, the demand for interconnect chips will grow, making the interconnect chip market a promising blue ocean [5] - The interconnect demand within AI systems, including between chips, server chassis, clusters, and data centers, highlights the potential for significant market growth [5] - With strong technical capabilities and industry experience, the company is well-positioned to capitalize on opportunities in this emerging market [5]