公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 etnews 。 SK海力士正在改变其晶圆切割工艺，以适应下一代存储器制造。随着第六代高带宽存储器（HBM4）和400层及以上 NAND闪存晶圆的薄化，现有工艺已达到极限。 据业内人士9日透露，SK海力士计划在HBM4晶圆切割中引入飞秒开槽和全切割工艺。为此，已确认正在与激光设备合作 伙伴共同探索新的晶圆切割设备联合评估项目（JEP）。目前，该公司已与部分合作伙伴开展技术测试。一位知情人士表 示："SK海力士计划对现有的晶圆切割方法进行重大改变"，并且"正在与合作伙伴讨论多项技术解决方案"。SK海 力士一直以来都使用机械切割（刀片）或隐形切割技术来切割晶圆。机械切割是指用金刚石砂轮切割晶圆，而隐形切割是 指在晶圆内部制造裂缝以将其分离。 隐形切割是将半导体电路切割成单个芯片（die）的主流技术，但随着高端半导体晶圆厚度的不断减小，该技术也变得越来 越难。晶圆厚度在100微米（㎛）左右时，主要采用机械切割；晶圆厚度在50微米左右时，则采用隐形切割。然而，SK海 力士正在准备的HBM4晶圆厚度更薄，约为20~30微米。 一位业内人士表示："如果采 ...

Group 1 - Micron Technology, Inc has commenced shipping its HBM4 technology to key customers, which is essential for next-generation AI platforms and data centers [1] - The increased adoption of HBM4 technology indicates a growing demand in the AI and data center sectors [1]

Core Viewpoint - The storage industry is undergoing significant changes driven by the rise of High Bandwidth Memory (HBM), with DDR4 prices increasing and Samsung Electronics experiencing a decline in quarterly profits, indicating a shift in focus towards HBM production [1][4]. Group 1: Market Dynamics - DDR4 prices have surged due to production cuts, while HBM is becoming the focal point of competition in the storage sector, leading manufacturers to shift capacity towards HBM [1][4]. - Samsung Electronics reported a projected sales revenue of 74 trillion KRW (approximately 55.5 billion USD) for Q2 2025, a slight decrease of 0.09% year-on-year, with operating profit dropping by 55.94% to 4.6 trillion KRW (about 3.3 billion USD), marking the lowest level in six quarters [4]. - SK Hynix has gained market share in the DRAM sector, achieving a 36% share in Q1 2023, surpassing Samsung for the first time, and holding a 70% share in the HBM market [4][8]. Group 2: Technological Advancements - The industry is moving towards the development of HBM4, with SK Hynix and Micron completing certifications for their HBM3e products, while Samsung is expected to complete its HBM3e certification by Q3 2025 [5][6]. - HBM technology faces challenges in both front-end and back-end processes, with future developments expected to include increased stacking layers and new manufacturing techniques [9]. Group 3: Customization Trends - The demand for HBM is expected to grow due to the strong AI market, with Nvidia currently consuming 61% of HBM, but this share is projected to decrease as more ASIC suppliers enter the market [8][10]. - Custom HBM solutions are being developed by several IT companies, including Nvidia, Amazon, and Microsoft, with expectations for significant market expansion by 2026 when HBM4 is launched [10][11].

Core Viewpoint - The storage industry is undergoing a significant transformation with HBM (High Bandwidth Memory) becoming the focal point, as manufacturers prepare for the mass production of HBM4 in the second half of the year, which is expected to dominate the market in 2024 [1][2][4]. Group 1: Market Dynamics - DDR4 prices have surged due to production cuts, while HBM is gaining traction as the competitive focus in the storage sector [1][4]. - Samsung Electronics reported a decline in operating profit, attributed to slower HBM progress compared to competitors, impacting its market position [4]. - SK Hynix has seen an increase in market share, with its HBM market share reaching 70%, while Samsung's share has decreased significantly [4][5]. Group 2: HBM Development and Production - SK Hynix and Micron are nearing completion of HBM3e product certification, with plans for HBM4 mass production preparations underway [5][6]. - Samsung is lagging in HBM development, with uncertainties surrounding its ability to commercialize higher-tier HBM4 in a timely manner [5][6]. Group 3: Customization Trends - The demand for HBM is expected to grow due to the AI boom, with Nvidia leading the market but facing increasing competition from other AI chip manufacturers [6][8]. - Customization in HBM is becoming a trend, with several IT companies, including Nvidia, Amazon, and Microsoft, pushing for tailored HBM solutions [8]. - The shift towards customized HBM is anticipated to significantly expand the market by 2026, as more clients adopt bespoke solutions [8].

芯片超人现有 1600平米 芯片智能仓储基地，现货库存型号 1000+ ，品牌高达 100种 ， 5000万颗 现 货库存芯片，总重量 10吨 ，库存价值高达 1亿+ 。同时，芯片超人在深圳设有独立实验室，每颗物料 均 安排QC质检 。 求购以下料号 | 品牌 | 型号 | 数量 | | --- | --- | --- | | ADI | LTM4628EV#PBF | 200PCS | | ADI | AD8512ARMZ | 1200PCS | | DEGSON/高松 | 2EDGRM-5.08-03P-14-100Z(H) | 800PCS | 优势物料，特价出售 | 品牌 | 型号 | 数量 | 年份 | | --- | --- | --- | --- | | ADI | ADM2483BRWZ | 2K | 22+ | | ADI | ADRF5545ABCPZN-R7 | 30K | 22+ | | TI | TMS320F28027PTT | 7499pcs | 23+ | | WINBOND | W83627DHG | 876pcs | 21+ | | 润石 | RS2299XTQC16 | ...

Core Viewpoint - The article discusses the significant transformation in data centers from a "compute-centric" approach to a "bandwidth-driven" model, highlighting the rise of High Bandwidth Memory (HBM) as a crucial infrastructure for large model computations [1][2]. Group 1: HBM Market Dynamics - HBM has evolved from being a standard component in high-performance AI chips to a strategic focal point in the semiconductor industry, with major players like Samsung, SK Hynix, and Micron viewing it as a key driver for future revenue growth [2][4]. - SK Hynix has established a dominant position in the HBM market, holding approximately 50% market share, with a staggering 70% share in the latest HBM3E products [6][10]. - Samsung is also actively pursuing custom HBM supply agreements with various clients, indicating a competitive landscape among these semiconductor giants [6][10]. Group 2: Customization Trends - Customization of HBM is becoming a necessity, driven by cloud giants seeking tailored AI chips, with SK Hynix already engaging with major clients like NVIDIA and Microsoft for custom HBM solutions [4][5]. - The integration of base die functions into logic chips allows for greater flexibility and control over HBM core chip stacks, optimizing performance, power consumption, and area [7][9]. Group 3: Hybrid Bonding Technology - Hybrid bonding is emerging as a critical technology for future HBM development, addressing challenges posed by traditional soldering techniques as stacking layers increase [12][18]. - Major companies, including Samsung and SK Hynix, are exploring hybrid bonding for their next-generation HBM products, which could lead to significant advancements in performance and efficiency [13][18]. Group 4: Future HBM Innovations - The article outlines the anticipated evolution of HBM technology from HBM4 to HBM8, detailing improvements in bandwidth, capacity, and power efficiency, with HBM8 expected to achieve a bandwidth of 64 TB/s and a capacity of up to 240 GB per module [20][21][27]. - Key innovations include the introduction of 3D integration technologies, advanced cooling methods, and AI-driven design optimizations, which are set to enhance the overall performance and efficiency of HBM systems [29][30]. Group 5: Competitive Landscape - The competition among DRAM manufacturers and bonding equipment suppliers is intensifying, with companies needing to collaborate across various domains to succeed in the evolving HBM market [33]. - The future of HBM technology will likely be shaped by the ability of companies to integrate diverse processes and resources, with the race for dominance in the post-AI era just beginning [33].

Core Insights - Qualcomm has been selected by Samsung to provide the Snapdragon 8 Elite Mobile Platform for its Galaxy Z Fold7 devices, enhancing performance and AI capabilities [1] - The Snapdragon 8 Elite chipsets are gaining traction in the premium smartphone market, with several manufacturers adopting them [2] - Qualcomm's QCT segment revenues increased to $9.47 billion in Q1 from $8.03 billion year-over-year, with expectations of $27.7 billion in handset revenue for 2025, reflecting an 11.3% year-over-year growth [3] Market Dynamics - Healthy demand in the premium smartphone segment is driving growth for Qualcomm, but competition from low-cost manufacturers like MediaTek and Rockchip is impacting profitability [4] - Apple is moving towards in-house chip development, which is affecting Qualcomm's revenue growth, as Apple has replaced Qualcomm's RF modem in its latest iPhone [4] - Broadcom is also a competitor, leveraging strong relationships with OEMs to gain insights into customer requirements [5] Financial Performance - Qualcomm shares have declined by 20.2% over the past year, contrasting with the industry's growth of 18.1% [6] - The company's shares trade at a price/earnings ratio of 13.51, significantly lower than the industry average of 33.07 [8] - Earnings estimates for 2025 have decreased by 0.17% to $11.71 per share, while 2026 estimates have declined by 2.23% to $11.82 [9]

事实上，上交所数据显示，科创人工智能ETF华宝（589520）近10个交易日中，有7个交易日获资金净 流入，累计金额1012万元。 成份股方面，乐鑫科技涨近6%，安路科技、虹软科技、奥普特、航天宏图、萤石网络等个股收红。 或由于英伟达市值突破4万亿美元，点燃AI投资热潮，今日（7月10日）重点布局国产AI产业链的科创 人工智能ETF华宝（589520）场内价格收跌0.47%，但频现宽幅溢价区间，显示买盘资金更为强势！全 天成交额近2000万元，较前一日环比激增133%，伴随成交放量，或有资金逢跌介入！ 2、技术突破驱动产业升级，国产化进程加速 国产大模型（如ChatGLM4、百度文心一言4.0、讯飞星火）已接近GPT-4性能，中文场景表现优异，成 本大幅下降，部分模型免费开放，降低应用门槛。多模态大模型（如华为盘古5.0）加速工业设计、医 疗研发等场景落地，缩短研发周期（如汽车造型设计从1-2年缩至数月）。端侧方面，AI手机、AI眼 镜、AIPC等硬件快速普及，高通、小米等厂商推动端侧AI生态成熟。 3、应用场景爆发，商业化进程加速 B端，行业赋能深化。工业领域，AI+CAD、智能控制、机器视觉优化生产流程， ...

| 品牌 | 型号 | 数量 | 年份 | | --- | --- | --- | --- | | DIODES | DMT10H009LCG-7 | 18K | 21+ | | LITTELFUSE | V320LA20AP | 60K | 22+ | | HYNIX | H5ANBG6NAMR-XNC | 40K | 22+ | | 润石 | RS2299XTQC16 | 100K | 24+ | 芯片超人现有 1600平米 芯片智能仓储基地，现货库存型号 1000+ ，品牌高达 100种 ， 5000万颗 现 货库存芯片，总重量 10吨 ，库存价值高达 1亿+ 。同时，芯片超人在深圳设有独立实验室，每颗物料 均 安排QC质检 。 求购以下料号 | 品牌 | 型号 | 数量 | | --- | --- | --- | | ADI | LTM4628EV#PBF | 200个 | | ADI | LTM4634IY#PBF | 238个 | | ADI | AD8512ARMZ | 1200个 | | DEGSON/高松 | 2EDGRM-5.08-03P-14-100Z(H) | 800PCS | 优势物 ...

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