Core Viewpoint - Intel's new CEO, Pat Gelsinger, emphasizes the importance of the foundry business and aims to prioritize it despite previous concerns about financial health and potential cuts to the division [1][2][4] Group 1: Leadership and Cultural Shift - Gelsinger's commitment to the foundry business marks a significant cultural shift within Intel, moving from an engineering-centric approach to one that prioritizes customer trust and responsiveness [3][5][6] - The focus on gaining customer trust is a departure from Intel's traditional engineering culture, indicating a potential transformation in the company's operational philosophy [4][5] Group 2: Foundry Business Strategy - Intel has invested $90 billion over the past four years in wafer fabrication to support its IDM 2.0 strategy, but the future direction under Gelsinger remains uncertain [2] - The company is building an ecosystem around its foundry services, including partnerships with leading EDA firms to enhance customer support in design processes [6][7] Group 3: Technological Advancements - Intel is advancing its manufacturing processes with multiple technology nodes, including Intel 4, Intel 3, and the highly anticipated Intel 18A, which is entering risk production and set for mass production this year [10][14] - The Intel 18A node features groundbreaking technologies such as RibbonFET and PowerVia, which are expected to significantly enhance performance and efficiency, potentially giving Intel a competitive edge over TSMC [17][18] Group 4: Competitive Landscape - Intel's competition with TSMC is intensifying, with both companies developing advanced nodes; however, Intel's unique technologies may provide it with a strategic advantage [14][21] - The introduction of Intel 14A, which utilizes high-NA EUV lithography, positions Intel to potentially surpass TSMC in technology, although TSMC's cost-effective strategies could pose challenges for Intel [20][21]

如果您希望可以时常见面，欢迎标星收藏哦~ 在台积电早起那的北美技术研讨会上，台积电业务发展和海外运营办公室高级副总裁兼副联 席首席运营官Kevin Zhang称其为"最后也是最好的 FinFET 节点"。台积电的战略是开发N3 工艺的多种变体，打造一个全面可定制的硅片资源。 Kevin Zhang表示："我们的目标是将集成硅片性能打造成为一个平台。" 截至目前，N3 现有 或计划推出的版本包括N3B、N3E、N3P、N3X、N3S、N3RF、N3A和N3C。 换而言之，自英特尔在2009 年的开发者大会上推出了 22 纳米 FinFET 晶圆后，这个改变了 芯片行业的设计，从某种程度看，走到了尽头。 FinFET，英特尔掀起革命 对芯片制造行业的读者应该知道，在过去几十年里，芯片的晶体管已经从planer走向了FinFet。至 于为什么用FinFet，以及这个进步的意义，我们需要从晶体管的原理说起。 本质上，在一颗芯片中，晶体管的目标是充当一个高速电子开关。导通时，电流从晶体管的源极流 向漏极。截止时，电流停止。反型层（上图蓝线）是电流实际流动的地方。 在理想情况下，晶体管需要做三件事： 1) 开启时允许尽可 ...