Group 1 - Tokyo Electron announced the dismissal of an employee from its Taipei branch following the arrest of six individuals suspected of stealing TSMC's trade secrets [1] - TSMC confirmed the leak of trade secrets related to its 2nm process, resulting in the dismissal of multiple employees and legal actions against them [1][2] - The investigation revealed that approximately 10 individuals were involved, including a former TSMC employee who contacted R&D personnel to obtain confidential information [1] Group 2 - Three individuals from the 2nm trial production team were found to have leaked over 400 images of process integration technology to Tokyo Electron employees while working remotely [2] - TSMC maintains a zero-tolerance policy towards violations of trade secret protection and has implemented strict monitoring mechanisms to detect such breaches [1][2] - In the global foundry market, TSMC holds a dominant position with a 67.6% market share, while Samsung and SMIC follow with 7.7% and 6.0% respectively [3]

Core Insights - The article discusses the launch of IBM's Power11 processors, which are designed to support large-scale computing environments with high memory and I/O capabilities [4][10] - It highlights the evolution of IBM's Power processors, particularly the transition from Power10 to Power11, and the challenges faced during the manufacturing process [5][7] - The article emphasizes the competitive landscape in the server market, particularly against AMD and Intel, and how IBM aims to maintain its position through advanced technology [6][19] Summary by Sections Power11 Launch - Power11 processors were launched and are set to be available on July 25, featuring enhancements over the previous Power10 generation [4] - The processors are designed to handle extensive memory and I/O requirements, making them suitable for enterprise-level applications [3] Evolution of Power Processors - Power11 is a refined version of the Power10, which faced manufacturing delays due to issues with GlobalFoundries' process technology [5][6] - The transition to 7nm technology was necessitated by delays in the 10nm process, leading to a redesign of Power10 [7][8] Competitive Landscape - The article notes that AMD has gained market share due to Intel's manufacturing challenges, which parallels IBM's own struggles with Power10 [5][6] - IBM's strategy includes leveraging its long-standing expertise in chip design and manufacturing to compete effectively in the high-performance computing market [8][19] Technical Specifications - Power10 and Power11 both feature 16 cores and 18 billion transistors, with Power11 offering improved clock speeds and core utilization [10][11] - The Power11 architecture supports advanced memory configurations, including DDR5, which enhances performance and efficiency [12][20] System Architecture - The Power E1180 server, based on Power11, can support up to 256 cores and 64TB of memory, showcasing a balance between I/O and computational power [18][19] - The architecture allows for flexible memory configurations, enabling users to optimize performance based on their specific workloads [21][22]

Core Insights - Intel is facing significant challenges, including plans to lay off 15%-20% of its global workforce and specific layoffs at its Santa Clara headquarters [3][4] - The company has already undergone large-scale layoffs in May, affecting various departments, particularly engineering, and has closed its automotive chip division in Germany [3][4] - Intel's manufacturing division is expected to see up to 20% layoffs starting July 2025, and the company plans to shut down its Automotive Group, discontinuing its automotive business entirely [4] - Recent executive turnover includes the departure of several senior executives and changes in the board of directors, indicating a restructuring effort to reduce costs amid declining performance [4] - Intel's market share is being eroded by competitors like AMD and NVIDIA, with a reported net profit of only $292 million in 2023 and a net loss of $630 million in Q1 2024 [5] - Revenue declines were noted in key segments, with a 20.8% drop in the Client Computing Group and a 7.6% decrease in the Data Center and AI segment [5] - Despite these challenges, Intel retains strong R&D capabilities and brand influence in the semiconductor market, and the restructuring plan aims to lower operational costs and improve efficiency for future growth [5]

如果您希望可以时常见面，欢迎标星收藏哦~ 在台积电早起那的北美技术研讨会上，台积电业务发展和海外运营办公室高级副总裁兼副联 席首席运营官Kevin Zhang称其为"最后也是最好的 FinFET 节点"。台积电的战略是开发N3 工艺的多种变体，打造一个全面可定制的硅片资源。 Kevin Zhang表示："我们的目标是将集成硅片性能打造成为一个平台。" 截至目前，N3 现有 或计划推出的版本包括N3B、N3E、N3P、N3X、N3S、N3RF、N3A和N3C。 换而言之，自英特尔在2009 年的开发者大会上推出了 22 纳米 FinFET 晶圆后，这个改变了 芯片行业的设计，从某种程度看，走到了尽头。 FinFET，英特尔掀起革命 对芯片制造行业的读者应该知道，在过去几十年里，芯片的晶体管已经从planer走向了FinFet。至 于为什么用FinFet，以及这个进步的意义，我们需要从晶体管的原理说起。 本质上，在一颗芯片中，晶体管的目标是充当一个高速电子开关。导通时，电流从晶体管的源极流 向漏极。截止时，电流停止。反型层（上图蓝线）是电流实际流动的地方。 在理想情况下，晶体管需要做三件事： 1) 开启时允许尽可 ...

来源：内容来自半导体芯闻综合 ，谢谢。 如果您希望可以时常见面，欢迎标星收藏哦~ 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 10万亿，投向半导体 知名分析师郭明錤的最新消息显示，英特尔Panther Lake芯片很有可能无法在2025年内上市，其 采用的Intel 18A工艺目前良品率提升缓慢。 英特尔此前已经公布了关于下一代Panther Lake的多项进展，预计该款芯片将大部分采用英特尔自 家制程工艺，目前样品运行表现良好，预计将会在今年下半年正式发布。不过事情似乎并不像英特 尔描述的那样顺利。据知名分析师郭明錤的最新消息显示，该系列芯片很有可能无法在2025年内 上市。 此前消息显示，Panther Lake传闻已经经历了一次延迟，现在已经推迟到第四季度中期。但根据郭 明錤的最新消息显示，Panther Lake产品不会在2026年之前上市。他表示："鉴于芯片和成品 （PC/NB）出货之间通常会有2-4周的时间差，PTL笔记本可能要到2026年才能普及，这意味着英 特尔 ...